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Research on Thermal Resistance Test Method of Stacked Package Based on High-precision Controllable Thermal Test Chip

Authors :
Cai Jiawei
Lv Xiaorui
Lin Pengrong
Huang Yingzhuo
Yao Quanbin
Source :
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Publication Year :
2022
Publisher :
IEEE, 2022.

Details

Database :
OpenAIRE
Journal :
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
Accession number :
edsair.doi...........7841fd395c998cff47f0c88ab0a0ca0a

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