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We investigated the run-to-run fluctuation in growth conditions of physical vapor transport growth of 4H-SiC boules through observations of surface morphology on the (000-1) facet of the boules. The boules, which were grown under the same macroscopic growth conditions, exhibited slightly different surface morphologies. This indicates that some microscopic growth parameters that influence the surface morphology fluctuate between growth runs. We have considered the C/Si ratio of the vapor sublimed from the source material as a major parameter and discussed the associated variations in the physical and surface properties of the grown crystals.

Mechanism of surface roughening caused by the polishing induced subsurface damage on 4o off-cut 4H-SiC (0001) substrate during thermal etching, CVD epitaxial growth, and the subsequent high temperature annealing was investigated in the wide temperature range of 1000-1800°C. Different from the previous study based on a macroscopic characterization by optical microscopy, microscopic characterization based on a scanning electron microscopy (SEM) was employed in this study. By utilizing the SEM operated under various conditions, disordered step arrangements as well as stacking faults and dislocations were imaged. The obtained results revealed that the SFs cause the fluctuation in the step kinetics, resulting in the step bunching formation during the thermal process.

Step bunching on a vicinal 4H-SiC (0001) epitaxial layer surface was investigated using low-voltage electron scanning microscopy (LVSEM) and electron channeling contrast (ECC) imaging. LVSEM observations revealed that the step bunching resulted in the formation of atomically flat wide (~250 nm) terraces on the surface, and the terraces tended to form in pairs. The two terraces in paired terraces often showed the same electron channeling contrast as each other, and the contrast of the two terraces, either bright or dark, appeared to be determined by the orthogonal misorientation of substrates. On the basis of these results, the formation mechanism of the step-bunched structure on a vicinal 4H-SiC (0001) surface is discussed.

As a new thinning and surface planarizing process of Silicon Carbide (SiC) wafer, we propose the completely thermal-chemical etching process; Si-vapor etching (Si-VE) technology. In this work, the effects of mechanical strength and surface step-terrace structure by Si-VE are investigated on the 4° off-axis 4H-SiC (0001) Si-face substrates. The indentation hardness of Si-VE surface is superior to the conventional chemo-mechanical polishing (CMP) surface even after epitaxial growth. The transverse strength of thinned Si-VE substrate is also superior to the conventional mechanically ground substrate. The surface step-terrace structures are observed by the low energy electron channeling contrast (LE-ECC) imaging technique. The latent scratch causes bunched step lines (BSLs) with various inhomogeneous step morphologies only on the CMP surface.

Low energy electron channeling contrast imaging (LE-ECCI) by scanning electron microscopy (SEM) was adopted to evaluate both the direction and length of the topmost hexagonal stacking sequence of the Si–C bilayers on 4H-SiC (0001). LE-ECCI revealed the change in the dangling bond configuration at step edges depending on SiC thermal etching rate, which was difficult to be detected by optical microscope (OM) and even by atomic force microscopy (AFM). Furthermore, LE-ECCI was applied to evaluate the atomic structure of polytype inclusions in commercially available 3-inch diameter 4o off-axis 4H-SiC (0001) epitaxial wafer. The validity of LE-ECCI was discussed by comparing the one with two kinds of widely used wafer inspection methods: confocal OM with differential interference contrast (CDIC-OM) and photoluminescence (PL) imaging.

The stacking fault formation during physical vapor transport growth of heavily nitrogen-doped (mid-1019 cm−3) 4H-SiC crystals was investigated. Low-voltage scanning electron microscopy (LVSEM) observations detected the stacking fault formation on the (000-1) facet of heavily nitrogen-doped 4H-SiC crystals. Stacking faults showed characteristic morphologies, and atomic force microscopy (AFM) studies revealed that these morphologies of stacking faults stemmed from the interaction between surface steps and stacking faults. Based on these results, the stacking fault formation mechanism in heavily nitrogen-doped 4H-SiC crystals is discussed.

The range of polishing-induced subsurface damage remaining in a commercially available production grade 4H-SiC (0001) epi-ready substrate was evaluated by the observation from the (-1100) cleavage plane using two kinds of highly strain-sensitive characterization methods. Firstly, the analysis using electron backscattered diffraction (EBSD) with a submicron spatial resolution was conducted on the exposed cross sectional plane. Then, for the further quantitative evaluation excluding the influence of roughness or contamination of the cleavage plane, a synchrotron X-ray micro-diffraction experiment was carried out. The range of the subsurface damage evaluated in those experiments was ensured by confirming none of additional strain inserted at the cleavage, as compared with the damage-free substrate prepared by high temperature thermal etching. As a result, the depth of the residual strained region below polishing-induced scratches at the surface was estimated to be in the range of a few microns, which is much deeper than the previously reported value of 100 nm by cross-sectional transmission electron microscopy. It suggests a potential of EBSD for the conventional tool to characterize even a small amount of strain in SiC single crystal.

Step, ridge, and crack submicro/nanostructures of epitaxial graphene on 4H-SiC (0001) were characterized using tip-enhanced Raman scattering (TERS) spectroscopy. The nanostructures were created during graphene synthesis due to a difference in the thermal expansion coefficient of graphene and SiC. These structures are a distinctive property of epitaxial graphene, together with other desirable properties, such as large graphene sheet and minimal defects. The results of this study illustrate that the exceptional spatial resolution of TERS allows spectroscopic measurements of individual nanostructures, a feat which normal Raman spectroscopy is not capable of. By analyzing TERS spectra, the change of local strain on the nanoridge and decreased graphene content in the submicrometer crack were detected. Using G′ band positions in the TERS spectra, the strain difference between the ridge center and flat area was calculated to be 1.6 × 10–3 and 5.8 × 10–4 for uniaxial and biaxial strain, respectively. This confir...

We develop a bulk silver tip for tip-enhanced Raman scattering (TERS) and obtain TERS spectra of epitaxial graphene on the carbon face of 4H-SiC(000-1) with a high signal-to-noise ratio. Thanks to the high quality of TERS spectra we firstly find that the G band in the TERS spectra exhibits position-by-position variations in both lower wavenumber shifts and spectral broadening. The analysis of the variations reveals that the shifts and broadenings have a linear correlation between each other, indicating that the variations are induced by the position dependent local stress on graphene based on a uniaxial strain model.

The orientation of growth sectors of highly B doped p+ high pressure and high temperature (HPHT) substrates were investigated by high angular resolution electron backscatter diffraction (HR-EBSD). The lattice rotation mapping images of the areas across the 〈111〉 growth sector boundaries were measured. The crystal orientation was found to be inclined approximately 0.03° for [001] to [-1-10], compared with the [-1-11] growth sector area at a given location. Other orientation inclinations were observed such as 0.02° for [001] to [110] and 0.025° for [001] to [1-10]. The same phenomena were confirmed for the other two crystals. Conventionally, it has been recognized that a HPHT-grown crystal is a perfect single crystal, however, our results indicate that "twin boundaries" are formed between the growth sectors for p+ HPHT substrates. To meet the requirements for the power device wafer specifications, the establishment of growth technology is desirable in the near future.

The wide (0001) terrace formation due to step bunching on a vicinal 4H-SiC (0001) epitaxial layer surface was investigated using low-energy electron channeling contrast (LE-ECC) imaging and atomic force microscopy. LE-ECC imaging revealed that step bunching resulted in the formation of wide atomically-flat (∼200 nm) (0001) terraces on the surface, and the terraces tended to form in pairs. Terraces in a pair had almost the same width and often showed the same LE-ECC; moreover, the contrast of the two terraces, either bright or dark, appeared to be determined by the orthogonal misorientation of substrates. On the basis of these results, the formation mechanism of the paired terraces with the same LE-ECC on a vicinal 4H-SiC (0001) surface is discussed herein.

In low energy scanning electron microscope (SEM) with primary electron energy less than 1.0 keV, the dependence of SEM contrast on crystallographic orientation within a range of 1.0 nm in depth has been investigated by utilizing 4H-SiC (0001) as a standard sample having a definitive electron penetration depth marker layer at hexagonal sites. Reflecting the difference of the direction of topmost two Si-C bilayers stacking sequence (0.50 nm in depth), clear bright and dark SEM contrast has been observed by adjusting the sample tilting and rotation angles by a conventional Everhart–Thornley type in-chamber detector. It is revealed that the brighter signal emission arises when the incident primary electron beam direction is almost parallel to the topmost stacking sequence direction. This angular coincidence was verified separately by correlating low energy SEM contrast from 3C-SiC (111) of no hexagonal sites with its electron back scattered diffraction pattern for identifying stacking sequence direction. The ...

We describe an algorithm to generate a manifold mesh from an octree while preserving surface features. The algorithm requires samples of a surface (coordinates) on the octree edges, along with the surface normals at those coordinates.The distinct features of the algorithm are:the output mesh is manifold,the resolution of the output mesh can be adjusted over the space with octree subdivision, andsurface features are generally preserved.A mesh generation algorithm with this combination of advantages has not been presented before.

Creating a complex virtual environment with human inhabitants that behave as we would expect real humans to behave is a difficult and time consuming task. Time must be spent to construct the environment, to create human figures, to create animations for the agents' actions, and to create controls for the agents' behaviors, such as scripts, plans, and decision-makers. Often work done for one virtual environment must be completely replicated for another. The creation of robust, procedural actions that can be ported from one simulation to another would ease the creation of new virtual environments. As walking is useful in many different virtual environments, the creation of natural looking walking is important. In this paper we present a system for producing more natural looking walking by incorporating actions for the upper body. We aim to provide a tool that authors of virtual environments can use to add realism to their characters without effort.