Search

Your search keyword '"Kikuchi, Katsuya"' showing total 305 results
Start Over Author "Kikuchi, Katsuya"
305 results on '"Kikuchi, Katsuya"'

1. Toward Practical-Scale Quantum Annealing Machine for Prime Factoring

Author

Maezawa, Masaaki, Fujii, Go, Hidaka, Mutsuo, Imafuku, Kentaro, Kikuchi, Katsuya, Koike, Hanpei, Makise, Kazumasa, Nagasawa, Shuichi, Nakagawa, Hiroshi, Ukibe, Masahiro, and Kawabata, Shiro

Subjects
Quantum Physics, Condensed Matter - Mesoscale and Nanoscale Physics, Condensed Matter - Superconductivity, Physics - Applied Physics
Abstract

We propose a prime factorizer operated in a framework of quantum annealing (QA). The idea is inverse operation of a multiplier implemented with QA-based Boolean logic circuits. We designed the QA machine on an application-specific-annealing-computing architecture which efficiently increases available hardware budgets at the cost of restricted functionality. The invertible operation of QA logic gates consisting of superconducting flux qubits was confirmed by circuit simulation with classical noise sources. The circuits were implemented and fabricated by using superconducting integrated circuit technologies with Nb/AlOx/Nb Josephson junctions. We also propose a 2.5Dimensional packaging scheme of a qubit-chip/interpose /package-substrate structure for realizing practically large-scale QA systems., Comment: 17 pages, 11 figures

Published
2018
Full Text
View/download PDF

2. Nb–Nb direct bonding at room temperature for superconducting interconnects.

Author

Fujino, Masahisa, Araga, Yuuki, Nakagawa, Hiroshi, Takahashi, Yuta, Nanba, Kenji, Yamaguchi, Ayami, Miyata, Akira, Nishi, Takanori, and Kikuchi, Katsuya

Subjects
TRANSMISSION electron microscopy, TRANSITION temperature, X-ray spectroscopy
Abstract

Superconducting devices with high-density integration are required for applications, such as high-performance detectors and quantum computing. Here, the direct bonding of Nb electrodes at room temperature using a surface activated bonding method was investigated. We directly bonded Nb bonding pads and then performed current–voltage measurements in a 3 He cryostat. A superconducting current of 1–5 mA was confirmed for the bonded interconnect. The transition temperature was 7.3–9.3 K. These values are affected by the quality of the bonding interface. According to cross-sectional transmission electron microscopy observations and energy-dispersive x-ray spectroscopy analysis of the bonding interface, the Nb layers were bonded with a 3-nm-thick intermediate layer made of Si and Nb between them. The Si sources were the bonding substrate and the bonding jig in the bonding apparatus. [ABSTRACT FROM AUTHOR]

Published
2023
Full Text
View/download PDF

5. Multi Die Stacked Structure Fabricated by WoW Bonding

Author

Shimamoto, Haruo, primary, Araga, Yuuki, additional, Fujino, Masahisa, additional, Watanabe, Naoya, additional, Takahashi, Kenji, additional, Kikuchi, Katsuya, additional, Kawagoe, Tsuyoshi, additional, Homma, Ichiro, additional, and Masuda, Takatoshi, additional

Published
2023
Full Text
View/download PDF

22. Study of wafer warpage reduction by dicing street

Author

Feng, Wei, primary, Shimamoto, Haruo, additional, Kawagoe, Tsuyoshi, additional, Honma, Ichirou, additional, Yamasaki, Masato, additional, Okutsu, Fumitake, additional, Masuda, Takatoshi, additional, and Kikuchi, Katsuya, additional

Published
2022
Full Text
View/download PDF

33. Electrostatic Shield TSVs to Suppress Coupling Among Stacked ICs

Author

Kikuchi Katsuya, Masahiro Aoyagi, and Yuuki Araga

Subjects
010302 applied physics, Physics, Noise suppression, business.industry, Hardware_PERFORMANCEANDRELIABILITY, 02 engineering and technology, 021001 nanoscience & nanotechnology, Chip, Electromagnetic solver, 01 natural sciences, Crosstalk, Shield, 0103 physical sciences, Electromagnetic shielding, Hardware_INTEGRATEDCIRCUITS, Optoelectronics, 0210 nano-technology, business
Abstract

Multi chip modules (MCMs) employing three-dimensionally stacked ICs (3DS-ICs) are expected to be the integration method to achieve high performance by integrating memories and processors densely. In such a densely assembled modules, crosstalk between closely placed 3DS-ICs like a stacked memories and processors. In this study, we propose a shielding method using through-silicon vias (TSVs) to suppress stack-to-stack crosstalk, we created MCM model for 3-D electromagnetic solver and simulated result showed good noise suppression effect, simulation result also showed higher suppression ratio as larger number of stacked ICs.

Published
2019

35. New fabrication process for Superconducting Quantum Interference Devices with Nb/AlAlOx/Nb junctions by using photosensitive polyimide insulation layers

Author

Kawai, Jun, Shimozu, Tatsuyuki, Kikuchi, Katsuya, Kawabata, Miki, Nakagawa, Hiroshi, Aoyagi, Masahiro, and Uehara, Gen

Subjects
Aluminum oxide -- Electric properties, Niobium -- Electric properties, Electric insulators -- Design and construction, Superconducting quantum interference devices -- Design and construction, Business, Electronics, Electronics and electrical industries
Abstract

A new fabrication process for Superconducting Quantum Interference Devices (SQUIDs) with Nb/AlAlOx/Nb junctions by using photosensitive polyimide insulation layers is proposed. It is found that photosensitive polyimide can be formed into a thin layer with spin-coating and patterned with conventional photolithography.

Published
2005

36. Double relaxation oscillation SQUID with a 4JL on-chip digital flux locked-loop circuit

Author

Myoren, Hiroaki, Goto, Masatoshi, Taino, Tohru, Kikuchi, Katsuya, Nakagawa, Hiroshi, Tokoro, Kazuhiko, Aoyagi, Masahiro, and Takada, Susumu

Subjects
Relaxation phenomena -- Analysis, Integrated circuit fabrication -- Methods, Digital-to-analog converters -- Design and construction, Superconducting quantum interference devices -- Design and construction, Integrated circuit fabrication, Business, Electronics, Electronics and electrical industries
Abstract

A design of an up/down counter composed of 4-Junction Logic (JL) gates and the digital/analog (D/A) converter using an R-2R ladder circuit is presented to realize the digital flux locked-loop (FLL) circuit. The 4 JL gates with the Superconducting QUantum Interference Device (SQUID) regulator is developed and the correct logic operations are successfully confirmed using fabricated 4JL gates.

Published
2005

37. Efficient fabrication process for superconducting integrated circuits using photosensitive polyimide insulation layers

Author

Kikuchi, Katsuya, Goto, Masatoshi, Nakagawa, Hiroshi, Aoyagi, Masahiro, Segawa, Shigemasa, Takada, Susumu, Tokoro, Kazuhiko, Taino, Tohru, and Myoren, Hiroaki

Subjects
Polyimides -- Electric properties, Superconductive devices -- Design and construction, Integrated circuit fabrication -- Methods, Integrated circuit fabrication, Business, Electronics, Electronics and electrical industries
Abstract

Photosensitive polyimide insulation layers are introduced to fabricate superconducting integrated circuits. It simplifies the fabrication process, because the photosensitive polyimide insulation layer can be patterned by conventional photolithography process, resulting in the etching process unnecessary in the present new fabrication process.

Published
2005

40. On-chip coil integrated STJ using the persistent superconducting current for photon detectors

Author

Kikuchi, Katsuya, Taino, Tohru, Nanme, Masaki, Nakagawa, Hiroshi, Aoyagi, Masahiro, Sato, Hiroshi, Sato, Hiromi, Akoh, Hiroshi, Iizuka, Takeshi, Myoren, Hiroaki, Takada, Susumu, Machata, Keisuke, Ishibashi, Kenji, Ikeda, Tokihiro, Otani, Chiko, Takizawa, Yoshiyuki, Oku, Takayuki, Kawai, Kazuhiko, Miyasaka, Hiromasa, Shimizu, Hirohiko M., Kato, Hiroshi, and Watanabe, Hiroshi

Subjects
Detectors -- Research, Phonons -- Research, Superconductive devices -- Research, Business, Electronics, Electronics and electrical industries
Abstract

An innovative phonon detector in which the integrated coil and the normal-distribution junction are combined is described and discussed.

Published
2003

41. A GHz multi-channel cryogenic test fixture for superconducting integrated circuit testing

Author

Aoyagi, Masahiro, Kikuchi, Katsuya, Sato, Yuichiro, Nagagawa, Hiroshi, Sato, Hiroshi, Tokoro, Kazuhiko, and Akoh, Hiroshi

Subjects
Superconductive devices -- Research, Semiconductor chips -- Research, Integrated circuits -- Research, Standard IC, Business, Electronics, Electronics and electrical industries
Abstract

A cryogenic test fixture for testing superconducting integrated circuits in the GHz range is described and discussed.

Published
2003

42. New fabrication process for Josephson tunnel junctions using photosensitive polyimide insulation layer for superconducting integrated circuits

Author

Kikuchi, Katsuya, Segwa, Shigemasa, Jung, Eun-Sil, Nakagawa, Hiroshi, Tokoro, Kazuhiko, Itanani, Hiroshi, and Aoyagi, Masahiro

Subjects
Integrated circuit fabrication -- Research, Superconductive devices -- Research, Integrated circuit fabrication -- 2002 AD, Superconductive devices -- 2002 AD, Integrated circuit fabrication, Business, Electronics, Electronics and electrical industries
Abstract

A new fabrication process for the Josephson tunnel junction is proposed. It uses a photosensitive polyimide.

Published
2003

43. Sidelobes suppression in normal-distribution-shaped Josephson tunnel junctions

Author

Kikuchi, Katsuya, Myoren, Hiroaki, Iizuka, Takeshi, and Takada, Susumu

Subjects
Josephson junction -- Usage, Superconductors -- Research, Business, Electronics, Electronics and electrical industries
Abstract

Normal-distribution-shaped Josephson tunnel junctions for superconducting tunnel junction photon detector applications have been investigated.

Published
2001

46. Fully Epitaxial Giant Magnetoresistive Devices with Half-Metallic Heusler Alloy Fabricated on Poly-Crystalline Electrode Using Three-Dimensional Integration Technology

Author

Chen, Jiamin, primary, Sakuraba, Yuya, additional, Yakushiji, Kay, additional, Kurashima, Yuichi, additional, Watanabe, Naoya, additional, Liu, Jun, additional, Li, Songtian, additional, Fukushima, Akio, additional, Takagi, Hideki, additional, Kikuchi, Katsuya, additional, Yuasa, Shinji, additional, and Hono, Kazuhiro, additional

Published
2020
Full Text
View/download PDF

Catalog

Books, media, physical & digital resources
See catalog results