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For rooting the development of GaN-based optoelectronic devices, understanding the roles of midgap recombination centers (MGRCs), namely, nonradiative recombination centers and deep-state radiative recombination centers, on the carrier recombination dynamics is an essential task. By using the combination of time-resolved photoluminescence and positron annihilation spectroscopy (PAS) measurements, the origins of major MGRCs in the state-of-the-art GaN epilayers, bulk crystals, and Mg-implanted layers were identified, and their concentrations were quantified for deriving the capture coefficients of minority carriers. In this article, potential standardization of the room-temperature photoluminescence lifetime for the near-band-edge emission (τ PL RT ) as the concentration of major MGRCs well below the detection limit of PAS is proposed. For n-GaN substrates and epilayers grown from the vapor phase, τ PL RT was limited by the concentration of carbon on N sites or divacancies comprising a Ga vacancy (VGa) and a N vacancy (VN), [VGaVN], when carbon concentration was higher or lower, respectively, than approximately 1016 cm−3. Here, carbon and VGaVN act as major deep-state radiative and nonradiative recombination centers, respectively, while major MGRCs in bulk GaN crystals were identified as VGa(VN)3 vacancy clusters in Na-flux GaN and VGa or VGaVN buried by a hydrogen and/or VGa decorated with oxygen on N sites, VGa(ON)3–4, in ammonothermal GaN. The values of τ PL RT in n-GaN samples are compared with those of p-GaN, in which τ PL RT was limited by the concentration of VGa(VN)2 in Mg-doped epilayers and by the concentrations of VGaVN and (VGaVN)3 in Mg-implanted GaN right after the implantation and after appropriate activation annealing, respectively. [ABSTRACT FROM AUTHOR]

In Mg ion implantation doping of GaN, sequential N ion implantation reportedly changes Mg concentrations in the Mg ion‐implanted region and the underlying region after activation annealing. The impact of sequential N ion implantation on defects and Mg distribution after postimplantation annealing is investigated. The atomic‐resolution analyses show that, in the Mg ion‐implanted region, the N ion implantation increases the concentration of MgGa. It is thus concluded that the Mg soluble in GaN by Mg ion implantation is increased by N ion implantation. The rest of the Mg atoms agglomerate to form clusters on the extended defects, and their concentration is also increased by the N implantation. The coarsening of extended defects is suppressed by the N ion implantation: the defects in the Mg+N‐implanted sample are nanoscale interstitial‐type defects, and they do not grow or annihilate after annealing. This indicates that the N implantation changes the concentrations of interstitials. [ABSTRACT FROM AUTHOR]

Defect levels in the vicinity of the Al2O3/p-type GaN interface were characterized using a sub-bandgap-light-assisted capacitance–voltage (C–V) method. For metal–oxide–semiconductor (MOS) diodes prepared using p-type GaN (p-GaN) and Al2O3 formed by atomic layer deposition, the C–V curves measured in the dark showed capacitance saturation at a negative bias and a large negative voltage shift compared with ideal curves, which implied the effects of donor-like gap states in the vicinity of the Al2O3/p-GaN interface. Upon illumination with monochromated sub-bandgap light with photon energies higher than 2.0 eV under a large positive bias, the subsequently measured C–V curves showed three plateaus. The plateau under the positive bias voltage due to the surface inversion appeared despite the sub-bandgap illumination, which did not appear at 1.8 eV light illumination, indicating the existence of midgap defect levels. Moreover, the other plateaus were attributed to defect levels at 0.60 and 0.7–0.8 eV above the valence band maximum. For a sample whose surface was prepared by photo-electrochemical (PEC) etching to a depth of 16.5 nm, the C–V curve measured in the dark showed a reduced voltage shift compared with the unetched sample. Furthermore, sub-bandgap-light-assisted C–V curves of the sample with PEC etching showed no plateau at a positive bias, which indicated the reduction in the density of the midgap defect states. Possible origins of the detected defect levels are discussed. The obtained results showed that the interface control can improve the properties of p-GaN MOS structures. [ABSTRACT FROM AUTHOR]

P-type doping in selected areas of gallium nitride (GaN) using magnesium (Mg)-ion implantation and subsequent ultra-high-pressure annealing (UHPA) are investigated to improve the performance of vertical GaN power devices. UHPA allows a high-temperature process without decomposition of the GaN surface and virtually complete activation of the implanted Mg ions in GaN. In the present paper, we provide an overview of recent challenges in making UHPA more realistic as an industrial process. Instead of UHPA at more than 1400 °C for a short duration, prolonged UHPA at 1300 °C demonstrates a comparable acceptor activation of Mg-ion-implanted GaN. This can reduce the annealing pressure to approximately 300 MPa and enlarge the processable wafer diameter. The second challenge is controlling the doping profiles in the lateral and vertical directions. We demonstrate fine patterning of the p-type regions, which indicates the limited lateral diffusion of Mg through UHPA. However, controlling the vertical doping profile is challenging. The nitrogen vacancies formed by ion implantation reduce the effective acceptor concentration near the surface, which can be compensated for by sequential nitrogen ion implantation. Defect-assisted Mg diffusion to the deeper region causes a redistribution of the Mg atoms and should be considered in the design of a device. Such anisotropic diffusion of Mg to the c-axis has potential applications in the fabrication of unique vertical device structures such as super junctions. [ABSTRACT FROM AUTHOR]

We carried out atomic-scale observations of Mg-ion-implanted GaN by transmission electron microscopy (TEM) and atom probe tomography (APT) to clarify the crystallographic structures of extended defects and Mg agglomerations that form during post-implantation annealing. The complementary TEM and APT analyses have shown that Mg atoms agglomerate at dislocations that bound extended defects. The concentration of Mg is higher at the dislocations with a larger Burgers vector. This indicates that Mg agglomeration is caused by the pressure at the dislocations. Mg concentration in highly Mg-rich regions is 1 at. %, which exceeds the solubility limit of Mg in GaN. We investigated isothermal and isochronal evolution of the defects by TEM, cathodoluminescence analysis, and positron annihilation spectroscopy. The results indicated that the intensity of donor–acceptor pair emission increases with the annealing temperature and duration and reaches a maximum after elimination of the extended defects with highly Mg-rich regions. These results strongly suggest that such extended defects reduce the acceptor formation and that they as well as the previously reported compensating centers, such as N-related vacancies, can inhibit the formation of p-type GaN. The mechanism by which the extended defects reduce acceptor formation is discussed. [ABSTRACT FROM AUTHOR]

An area selective doping via ion implantation is a key technology to realize gallium nitride (GaN) based energy-efficient power devices; however, conventional annealing leads to the formation of numerous Mg-enriched defects, which result in inefficient p-type activation. The recent invention of ultra-high-pressure annealing (UHPA) has enabled a significant improvement in p-type activation efficiency. In this study, we investigated the formation of Mg-enriched defects in Mg implanted GaN followed by annealing under either conventional atmospheric pressure or ultra-high-pressure. Unlike the conventional annealing, UHPA leads to a much lower number density of Mg-enriched defects. Correlative scanning transmission electron microscopy, atom probe tomography, cathodoluminescence, and secondary ion mass spectrometry analyses have shown that the number density of Mg-enriched defects is substantially suppressed by the UHPA. The dissolved Mg concentrations in the GaN matrix for both the conventional and the UHPA samples are almost of the same value, approximately 2 × 1018 cm−3; however, the UHPA sample shows over one order of magnitude stronger intensity of donor–acceptor-pair emission than the conventional one. Thus, the implanted Mg is effectively activated as acceptors through the UHPA technique. [ABSTRACT FROM AUTHOR]

Avalanche multiplication characteristics in a reverse-biased homoepitaxial GaN p–n junction diode are experimentally investigated at 223–373 K by novel photomultiplication measurements utilizing above- and below-bandgap illumination. The device has a non-punch-through one-side abrupt p–-n+ junction structure, in which the depletion layer mainly extends to the p-type region. For above-bandgap illumination, the light is absorbed at the surface p+-layer, and the generated electrons diffuse and reach the depletion layer, resulting in an electron-injected photocurrent. On the other hand, for below-bandgap illumination, the light penetrates a GaN layer and is absorbed owing to the Franz–Keldysh effect in the high electric field region (near the p–n junction interface), resulting in a hole-induced photocurrent. The theoretical (non-multiplicated) photocurrents are calculated elaborately, and the electron- and hole-initiated multiplication factors are extracted as ratios of the experimental data to the calculated values. Through the mathematical analyses of the multiplication factors, the temperature dependences of the impact ionization coefficients of electrons and holes in GaN are extracted and formulated by the Okuto–Crowell model. The ideal breakdown voltage and the critical electric field for GaN p–n junctions of varying doping concentration are simulated using the obtained impact ionization coefficients, and their temperature dependence and conduction-type dependence were discussed. The simulated breakdown characteristics show good agreement with data reported previously, suggesting the high accuracy of the impact ionization coefficients obtained in this study. [ABSTRACT FROM AUTHOR]

N-type GaN epitaxial layers grown via metal organic vapor-phase epitaxy typically exhibit a yellow luminescence (YL) band owing to carbon-related deep levels in the photoluminescence spectra. The decay of YL after pulse excitation involves a long time constant (∼0.2 ms at room temperature), whereas microwave photoconductivity decay (μ-PCD) curves show the corresponding component of the time constant. To clarify the origin of the long decay time, the temperature-dependent time constants of YL decay and μ-PCD curves are analyzed using a numerical model based on rate equations for trapping and emission through a deep level. The characteristics of the decays are well reproduced by a recombination model using a hole trap H1 at an energy of EV + 0.88 eV because of the acceptor-like state of carbon on a nitrogen site (CN) whose electron capture cross section (σn) is estimated to be 3 × 10−21 cm2. The slow decay in μ-PCD signals indicates that the electrons before being captured to H1 traps are free electrons in the conduction band. These findings indicate that the slow recombination process through CN results in tail currents in the turn-off switching periods of devices. [ABSTRACT FROM AUTHOR]

The fabrication processes of p-type regions for vertical GaN power devices are investigated. A p-type body layer in a trench gate metal-oxide-semiconductor field-effect transistor requires precise control of the effective acceptor concentration, which is equal to the difference between the Mg acceptor concentration (Na) and the compensating donor concentration (Nd). The carbon atoms incorporated during growth via metalorganic vapor phase epitaxy substitute nitrogen sites (CN) and function as donor sources in a p-type GaN layer. Since interstitial H atoms (H i) also compensate holes, their removal from an Mg-doped layer is crucial. Extended anneals to release H atoms cause the formation of extra hole traps. The p+ capping layer allows effective and rapid removal of H atoms from a p-type body layer owing to the electric field across the p+/p– junction. On the other hand, selective area p-type doping via Mg ion implantation is needed to control the electrical field distribution at the device edge. Ultrahigh-pressure annealing (UHPA) under a nitrogen pressure of 1 GPa enables post-implantation annealing up to 1753 K without thermal decomposition. Cathodoluminescence spectra and Hall-effect measurements suggest that the acceptor activation ratio improves dramatically by annealing above 1673 K as compared to annealing at up to 1573 K. High-temperature UHPA also induces Mg atom diffusion. We demonstrate that vacancy diffusion and the introduction of H atoms from the UHPA ambient play a key role in the redistribution of Mg atoms. [ABSTRACT FROM AUTHOR]

Defects in Mg ion-implanted GaN epitaxial layers formed after annealing at 1573 K and at 1753 K were analyzed by transmission electron microscopy. Degradation of the GaN surface, which occurs at temperatures higher than about 1573 K, was avoided by ultra-high-pressure annealing under a N2 atmosphere at 1 GPa. Annealing for damage recovery in ion-implanted compound semiconductors generally requires temperatures at about two-thirds of their melting point, which is reportedly 2518 K or higher for GaN. Thus, defect analysis in ion-implanted GaN annealed at temperatures higher than 1573 K is necessary to understand the defect recovery. Atomic-resolution transmission electron microscopy analysis showed that interstitial-type extended defects and inversion domains with Mg segregation were formed during the annealing at 1573 K. These defects were not observed in a sample annealed at 1753 K; instead, vacancy-type extended defects were formed. Such evolution of defects can be explained by previous theoretical studies that indicated that the migration energy of vacancy-type defects is higher than that of interstitial-type defects. Moreover, the formation of vacancy-type extended defects implies a reduction in the concentrations of vacancies and their complexes. Since the vacancies and their complexes can compensate for Mg acceptors, their reduced concentration should increase the acceptor activation efficiency. Also, the disappearance of Mg segregation during high-temperature annealing should increase the activation efficiency since the segregated Mg atoms are electrically inactive. It is thus concluded that the evolution of defects caused by high-temperature annealing above 1573 K increases the activation efficiency of acceptors in Mg ion-implanted GaN. [ABSTRACT FROM AUTHOR]

Herein, transmission electron microscopy direct observations are used to examine the time evolution of dislocation loops in Mg‐ion‐implanted GaN during annealing in N2 atmospheres of 2.0 and 0.3 GPa. It is indicated in the results that the diffusion of the native defects, for both interstitials and vacancies, is retarded during annealing at the higher pressure. Furthermore, secondary ion mass spectrometry shows that annealing at the higher pressure retards the migration of Mg and increases Mg‐acceptor concentration in the ion‐implanted region. These findings provide a design principle of the postimplantation annealing process to activate ion‐implanted Mg in GaN. [ABSTRACT FROM AUTHOR]

We investigated traps in lightly Mg-doped (2 × 1017 cm−3) p-GaN fabricated by metalorganic vapor phase epitaxy (MOVPE) on a freestanding GaN substrate and the subsequent post-growth annealing, using deep level transient spectroscopy. We identified four hole traps with energy levels of EV + 0.46, 0.88, 1.0, and 1.3 eV and one electron trap at EC − 0.57 eV in a p-type GaN layer uniformly doped with magnesium (Mg). The Arrhenius plot of hole traps with the highest concentration (∼3 × 1016 cm−3) located at EV + 0.88 eV corresponded to those of hole traps ascribed to carbon on nitrogen sites in n-type GaN samples grown by MOVPE. In fact, the range of the hole trap concentrations at EV + 0.88 eV was close to the carbon concentration detected by secondary ion mass spectroscopy. Moreover, the electron trap at EC − 0.57 eV was also identical to the dominant electron traps commonly observed in n-type GaN. Together, these results suggest that the trap states in the lightly Mg-doped GaN grown by MOVPE show a strong similarity to those in n-type GaN, which can be explained by the Fermi level close to the conduction band minimum in pristine MOVPE grown samples due to existing residual donors and Mg-hydrogen complexes. [ABSTRACT FROM AUTHOR]