Back to Search Start Over

Mg-implanted bevel edge termination structure for GaN power device applications

Authors :
Matys, Maciej
Ishida, Takashi
Nam Kyung Pil
Sakurai, Hideki
Narita, Tetsuo
Uesugi, Tsutomu
Bockowski, Michal
Suda, Jun
Kachi, Tetsu
Matys, Maciej
Ishida, Takashi
Nam Kyung Pil
Sakurai, Hideki
Narita, Tetsuo
Uesugi, Tsutomu
Bockowski, Michal
Suda, Jun
Kachi, Tetsu
Publication Year :
2022

Abstract

Herein, we propose and demonstrate the edge termination for GaN-based one-sided abrupt p–n junctions. The structure is comprised of a combination of a shallow negative bevel mesa and selective-area p-type doping under the mesa. Based on the Technology Computer Aided Design (TCAD) simulation, the maximum electric field at the junction edge is markedly reduced to approximately 1.3 times that of the parallel-plane electric field in the proposed structure, which is almost half of the unimplanted diode. The TCAD simulation also shows that the shallow mesa angle of 6° effectively reduces the optimum acceptor concentration (Na) in the implanted region and enhances the breakdown voltage. The optimum Na value can be covered by the proposed technology based on the Mg-ion implantation and subsequent ultra-high-pressure annealing (UHPA). Using the formation of the shallow bevel mesa, the Mg-ion implantation, and the UHPA process, we experimentally demonstrate the p–n diodes with a breakdown voltage over 600 V, which is in good agreement with the TCAD simulation. The proposed method can be applied to a vertical trench-gate metal-oxide-semiconductor field-effect transistor with a high figure-of-merit.

Details

Database :
OAIster
Notes :
application/pdf, English
Publication Type :
Electronic Resource
Accession number :
edsoai.on1375194469
Document Type :
Electronic Resource