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Contactless plating with electroless solutions can provide self-aligned high-efficiency contacts with very low silver content, using simple and inexpensive equipment. With prior surface activation, it can even be used to metallize both sides of bifacial silicon solar cells simultaneously. However, we observe in such a coplating process with nickel, where surface activation is achieved by immersion plating and thickening by electroless plating, that V oc and fill factor can sometimes significantly decrease with immersion-plating time. To understand the reason for this electrical degradation, we studied the impact of immersion plating on the microstructure of the plated silicon surface. The evolution of the Si-Ni interface was studied by scanning and transmission electron microscopies, energy-dispersive X-ray analysis, secondary ion mass spectrometry, and scanning spreading resistance microscopy. Our attention focused on metal in-diffusion, silicon roughening and etching as the origin for increased recombination. Etching was found to have a significant impact on V oc. The thickness of N + Si etched during Ni deposition can in fact suppress in a few locations most of the field-effect passivation underneath the contacts. This means that a thicker surface field with doping beyond 1019/cm3 must be foreseen under the plated areas, or that the amount of Si lost in the reaction must be reduced. Our observations also confirm that immersion plating can hinder silicide formation and allow Ni in-diffusion, which may be a concern for reliability.

Carefully tailored periodic nanostructures on the light wavelength scale, such as diffraction gratings, benefit from wave optics for efficiently trapping the weakly absorbing infrared photons in crystalline-silicon (c-Si) absorbers. In contrast with the conventional random pyramid texture, diffraction gratings can be designed to target specific wavelength ranges by the selection of the grating pitch. Absorption enhancement at infrared wavelengths in a silicon solar cell is especially desired when it operates below a perovskite top cell in a tandem device. In this article, inverse nanopyramid gratings of 800 nm pitch are proposed as an alternative front-surface texture to random pyramids in silicon heterojunction devices with interdigitated back contacts that are to be used as bottom cells in four-terminal perovskite/c-Si tandem devices. By doing so, we report a short-circuit current density gain of 0.53 mA/cm 2 with respect to the random pyramid texturing for the bottom c-Si cell. The rationale to substitute random pyramids by inverse nanopyramid gratings is, however, not justified in single-junction operation despite achieving the power conversion efficiency of 22.3% since the degraded optical performance at shorter wavelengths offsets the absorption enhancement at longer wavelengths, resulting in similar levels of short-circuit current densities for both texture types. ispartof: Ieee Journal Of Photovoltaics vol:10 issue:3 pages:740-748 status: Published online

© Copyright 2019 American Chemical Society. Low contact resistivity ( c ) and low recombination current density at the metallized area (J 0,metal ) are the key parameters for an electron-selective contact in solar cells, and an i-a-Si:H/TiO x /low work function metal (ATOM) structure could satisfy these criteria. In this work, to achieve strong downward band bending, an Yb ( = 2.5-2.6 eV)/Ag stack is used. Moreover, the impact of (1) substrate topography (flat or textured), (2) TiO x thickness, and (3) Ti precursor (TTIP vs TDMAT) on the ATOM contact performance is investigated. The results show that the ATOM contact is relatively insensitive to the surface topography and to the Ti precursors (TTIP or TDMAT) used for the atomic layer deposition (ALD) of TiO x . However, the TiO x thickness has a significant impact on the c and marginally on the J 0,metal of the ATOM contact. For all topography cases and Ti precursors, 1 nm thick TiO x results in the lowest c value, most likely due to E F,metal depinning. In the silicon heterojunction solar cell, this ATOM contact (i-a-Si:H/TiO x /Yb/Ag) yields a solar cell efficiency of 19.2% with a high V OC of 723 mV without the need of a doped n-a-Si:H layer. Concerning the thermal stability of these contacts, TEM images confirm that Yb does not diffuse into the i-a-Si:H layer after an annealing at 180 °C for 30 min thanks to the TiO x layer behaving as a diffusion barrier. 98% of the initial solar cell efficiency is preserved even after successive annealing treatments at 150 and 175 °C, which are values in the same temperature range used in the module lamination and the sintering of the printed Ag. These results in combination with the demonstrated efficiency underline that the ATOM contact is a promising route to realize high-efficiency solar cells. ispartof: ACS APPLIED ENERGY MATERIALS vol:2 issue:2 pages:1393-1404 status: published

Metal silicide is a well-known material for contact layers; however, it has not been tested in the context of doping-free carrier selective contacts. Thin film deposition of an appropriate metal with mild annealing treatment is an interesting alternative to the more complex depositions of other compound materials. Reaction of Yb deposited on top an i-a-Si:H passivation layer results in the formation of YbSix on top of a remnant i-a-Si:H, following a low-temperature annealing below 200 degrees C. Such a contact is an interesting candidate as a doping-free electron-selective contact. Detailed investigation of the i-a-Si/YbSix contact shows that Yb thickness, i-a-Si:H thickness and silicidation annealing conditions play a significant role in determining the recombination current density (J(0,metal)) and the contact resistivity (rho(c)). Low J(0,metal) of 5 fA/cm(2) and low rho(c) below 0.1 Omega.cm were independently demonstrated for such i-a-Si:H/YbSix contacts. We also demonstrate that lowtemperature silicidation can be combined with contact sintering (160 degrees C/25 min) or module lamination (160 degrees C/20 min), which are potential pathways for process simplification. Combining the optimized i-a-SEFI/YbSix electron contact with MoOx based hole contact in the MolYSili doping-free cell (i-a-SEH/MoOx + i-a-SEFI/YbSix), we achieved 16.7% in average efficiency and 17.0% for the champion cell. Furthermore, the YbSc contact stability was evaluated at module level and excellent thermal stability of the MolYSili laminate was demonstrated using the damp-heat test method (humidity 85%, 85 degrees C, 1000 h), where the laminated MolYSili cell did not show any degradation in the cell efficiency. This is the first proof-of-concept demonstration of a stable silicide-based contact for low-temperature processed doping-free solar cells. The authors thank Pieter Lagrain, Olivier Richard, and Hugo Bender for TEM measurement. Moreover, the authors gratefully acknowledge the financial support of imec's industrial affiliation program for Si-PV. The work in this paper was partially funded by the Kuwait Foundation for the Advancement of Sciences under project number CN18-15EE01. imec is a partner in EnergyVille (www.energyville.be), a collaboration between the Flemish research partners KU Leuven, VITO, imec, and UHasselt in the field of sustainable energy and intelligent energy systems. Cho, J (corresponding author), Katholieke Univ Leuven, ESAT Dept, B-3001 Leuven, Belgium. jinyoun.cho@eu.umicore.be

Metal oxides are interesting materials for use as carrier-selective contacts for the fabrication of doping-free silicon solar cells. In particular, MoOx and TiOx have been successfully used as hole and electron selective contacts in silicon solar cells, respectively. However, it is of paramount importance that good thermal stability is achieved in such contacts. In our work, we combined i-a-Si:H/MoOx based hole contacts with electron contacts featuring i-a-Si:H/TiOx/low work function metal (ATOM) to fabricate doping-free cells, termed MoIyATOM cells. We found that the thermal stability of the ATOM contact was improved when the i-a-Si:H was annealed (300 degrees C for 20 min in N-2) before depositing TiOx (Le. pre-TiOx annealing), which reduces the hydrogen content in i-a-Si:H by about 27 Vorei, and thereby the H-related degradation of the ATOM contact characteristics. Moreover, it was found that reducing the thickness of the low-work function metal on top of the TiOx enhanced the thermal stability of the ATOM contact. With these adaptations, the MoIyATOM cell efficiency was improved by 3.5 %(abs), with the highest efficiency of 17.6%. Moreover, the cells show improved thermal stability after the above-mentioned pre-TiOx annealing, which is confirmed by annealing tests at cell level as well as damp-heat tests at module level. The insights of this study could be used to tailor other metal-oxide based electron or hole contacts. The authors thank Praveen Dara and Johan Meersschaut for ERD measurement. Moreover, the authors gratefully acknowledge the financial support of imec's industrial affiliation program for Si-PV. The work in this paper was partially funded by the Kuwait Foundation for the Advancement of Sciences under project number CN18-15EE-01. Imec is a partner in EnergyVille (www.energyville.be), a collaboration between the Flemish research partners KU Leuven, VITO, imec, and UHasselt in the field of sustainable energy and intelligent energy systems. Cho, JY (reprint author), Katholieke Univ Leuven, ESAT Dept, Kasteelpk Arenberg 10, B-3001 Leuven, Belgium; Umicore, Watertorenstr 33, B-2250 Olen, Belgium. Radhakrishnan, HS (reprint author), IMEC, Kapeldreef 75, B-3001 Leuven, Belgium. jinyoun.cho@eu.umicore.be

Nowadays, material manufacturers are engineering module materials to optimize the energy production of the PV modules. One of the elements which can be influenced is the optical scattering of a material. In this study, we quantified the effect of a scattering front encapsulant on the energy production of PV modules. First, a wavelength-dependent scattering model was developed in the ray-tracing software PVlighthouse. This model was used to find the optimal scattering conditions, looking at the photo-generated current for a glass-glass PV module with flat front surface. It was shown that a gain of +0.63 mA/cm2 can be obtained for optimal scattering conditions. The scattering is mostly beneficial when the light strikes the module surface at a perpendicular angle. The outcome of the optimization study was implemented in IMEC’s energy yield simulation framework. This framework was used to estimate the energy gain of PV module with scattering front encapsulant when installed in Kuwait’s desert. It was shown that an energy production gain of 1.8% can be expected in case of a glass-glass module with flat front surface and ARC coating.

In this work, we explored aluminium-induced crystallization (AIC) of amorphous Si (a-Si) as a low-temperature alternative to make p-type poly-Si/SiOx contacts for Si solar cells. In this approach, a stack of Al and a-Si deposited on a SiOx-passivated Si wafer surface is annealed at temperatures below 577 °C (the eutectic temperature of Al–Si mixture), which induces the exchange of Al and Si layer positions in the stack and the simultaneous crystallization of a-Si to Al-doped p-type poly-Si, potentially leading to the formation of an Al/poly-Si/SiOx passivating contact. The Al-doped AIC poly-Si has low carrier concentration, and thus to compensate for this, we used highly B-doped a-Si for AIC and could achieve a tenfold increase in the carrier concentration. We found that the typical thickness of 1.5 nm of the passivating SiOx layer is too low for this AIC-based approach, as Al reduces SiOx during the process and degrades its passivation quality. By starting with a thicker SiOx layer, we could demonstrate that AIC poly-Si/SiOx contacts with low contact recombination is achievable. However, the contact characteristic remains non-ohmic. This can be improved by extended annealing after AIC, during which Al diffuses into the Si substrate. The Al diffusion, however, damages the SiOx layer and in turn severely increases contact recombination. We conclude that with AIC poly-Si/SiOx contacts the process window to achieve low contact resistivity and low contact recombination seems to be very narrow, if existing at all.

In early 2017, the world record efficiency for single-junction crystalline silicon (c-Si) solar cells was achieved by merging amorphous silicon (a-Si:H)/c-Si heterojunction technology and back-contact architecture. However, to fabricate such silicon heterojunction interdigitated back-contact (SHJ-IBC) solar cells, complex a-Si:H patterning steps are required to form the interdigitated a-Si:H strips at the back side of the devices. This fabrication complexity raises concerns about the commercial potential of such devices. In this work, a novel process scheme for a-Si:H patterning using damage-free laser ablation is presented, leading to a fast, simple and photolithography-free emitter patterning approach for SHJ-IBC solar cells. To prevent laser-induced damage to the a-Si:H/c-Si heterocontact, an a-Si:H laser-absorbing layer and a dielectric mask are deposited on top of the a-Si:H/c-Si. Laser ablation only removes the top a-Si:H layer, reducing laser damage to the bottom a-Si:H/c-Si heterocontact under the dielectric mask. This dielectric mask is a distributed Bragg reflector (DBR), resulting in a high reflectance of 80% at the laser wavelength and thus providing additional protection to the a-Si:H/c-Si heterocontact. Using such simple a-Si:H patterning method, a proof-of concept 4-cm(2) SHJ-IBC solar cell with an efficiency of up to 22.5% is achieved. The authors gratefully acknowledge the financial support of IMEC's Industrial Affiliation Program for Si-PV. This project has also received funding from the European Union's Horizon 2020 Research and Innovation Programme under grant agreement no. 727523 (NextBase).

A fully dry and hydrofluoric-free low-temperature process has been developed to passivate n-type crystalline silicon (c-Si) surfaces. Particularly, the use of a hydrogen (H2) plasma treatment followed by in situ intrinsic hydrogenated amorphous silicon (a-Si:H) deposition has been investigated. The impact of H2 gas flow rate and H2 plasma processing time on the a-Si:H/c-Si interface passivation quality is studied. Optimal H2 plasma processing conditions result in the best effective minority carrier lifetime of up to 2.5 ms at an injection level of 1 × 1015 cm−3, equivalent to the best effective surface recombination velocity of 4 cm/s. The reasons that enable such superior passivation quality are discussed in this paper based on the characterization of the a-Si:H/c-Si interface and c-Si substrate using transmission electron microscopy, high angle annular dark field scanning transmission electron microscopy, and deep-level transient spectroscopy.

© 2018 Elsevier Ltd PV module testing under standard conditions is an important and well-established procedure, which plays a vital role in module rating. However, PV modules rarely operate at standard conditions therefore their field performance should be predicted based on long term outdoor monitoring or by means of models – so called energy yield models, which combine PV module characteristics with varying environmental conditions. The present work employs a bottom-up, physics-based energy yield modelling approach, which accounts to the interacting optical, thermal and electrical mechanisms in a detailed manner. Additionally, measured data is used for the accurate calibration of the models. Such an approach permits to explore the influence of cell- and module technology details on energy yield under any specific environmental conditions. The present work employs such a method to evaluate the influence of Silicon solar cell technology on energy yield under desert and moderate climates, where the interplay of different irradiance and ambient temperature levels result in a challenging PV performance prediction problem. The purpose of this work is to identify the best-suited solar cell technologies and to understand the underlying mechanisms, which lead to superior PV performance under specific climate conditions. The study is performed by means of physics-based exploratory energy yield simulations with detailed resolution of the thermal effects. Our comparison of four different cell technologies in monofacial modules highlights that superior illumination-dependent performance can contribute to annual energy yield enhancement under both moderate and desert climates amounting to 1.75% and 0.4%, respectively; while a 0.04%/°C advantage in relative temperature coefficient increases annual energy yield (by 1.2%) only under a desert climate. ispartof: SOLAR ENERGY vol:173 pages:728-739 status: published

In this work we present bifacial cells with Ni/Ag co-plated contacts with average V oc values of 691±2 mV and efficiencies of 22.4±0.2 % (internal measurement using a lowly-reflective Gridtouch TM contacting unit from Pasan). The Ni/Ag co-plating sequence used in this paper presents numerous advantages, most notably: non-contact batch processing and cell metallization costs potentially below 7 $ct./cell. In the first part of this paper, two different emitter passivation schemes are compared (SiO 2 /SiN x and Al 2 O 3 /SiN x ) and we demonstrate that Al 2 O 3 /SiN x enables a ~17mV gain in V oc and ~0.3 mA/cm 2 gain in j sc thanks to reduced recombination losses. In the second part of this paper, proof-of-concept glass/backsheet and glass/glass 1-cell laminates are fabricated using multi-wires interconnection and light I-V results are presented. Finally, we demonstrate that one of the first 1-cell glass/backsheet laminates with Ni/Ag co-plated contacts and multi-wires interconnection currently experiences less than 4% abs. loss in maximum power after 400 thermal cycles (-40 to +85°C).

One of the advantages of an epitaxially grown emitter is that its doping profile is not limited by the diffusion process and that almost any arbitrary profile shape can be realized. In this simulation study we make use of the epitaxial doping profile’s flexibility to optimize the emitter of an nPERT solar cell. Initially an optical and electrical model is set up in Sentaurus TCAD and calibrated based on measurements of an actual device with an efficiency of 22.5%. Next, simulations for a box shaped profile with varying thicknesses and doping concentrations are carried out. Additionally, a two-step emitter consisting of a combination of two box profiles – one located at the surface and another deep profile underneath the former one – is also simulated. The results clearly identify the optimal doping concentrations and thicknesses which result in the highest efficiencies. Outside of these optimal regions the most significant loss mechanisms are pointed out. To be highlighted is that the switch from a the single box profile emitter to an optimal two-step profile emitter realizes a gain of 0.4% absolute resulting in an efficiency of 22.9%. This demonstrates that the freedom in the shape of the epitaxial doping profile can be employed to further increase the solar cell efficiencies.

In this work, we improved the performance of the MWT-PERT solar cells focusing on increasing their V-oc by combining the MWT concept with n-PERT technology. The impact of different post-laser treatments on the via surface morphology and the via passivation was investigated. KOH texturing can partially remove the laser damage in the via and reduce the via SRV to 1000 cm/s. With optimized post-laser treatment and via passivation, an average V-oc of 685mV was achieved for our large-area n-type MWT-PERT cells. Front Ni/Cu plating and rear Ag and Al screen-printing were used for the metallisation, the compatibility of this hybrid metallisation scheme was studied. Using industrial solder-through interconnection technology, the cell was integrated in a laminate reaching a one-cell module efficiency at 20%. The reliability of the one-cell modules was preliminarily investigated in an extended reliability test. (C) 2017 The Authors. Published by Elsevier Ltd. The authors gratefully acknowledge the financial support of the PV4FACADES project (Solar-Era.net) and Imec's industrial affiliation program for Photovoltaics (IIAP-PV).

This work focuses on analytical modelling as an alternative to numerical simulations for determining via-related recombination losses in MWT silicon solar cells. Two new analytical models are presented in this framework. The first model deals with calculation of the local via recombination velocity S via from photoconductance lifetime measurements. The second model relates S via to loss in V OC by solving the diffusion equation in two-dimensions. From short-loop tests, we show that these analytical models are valid over a wide range of via densities. The results also show that alkaline etching treatment after the laser via drilling step reduces S via by an order of magnitude and thus allows for good via passivation. We then make use of these models for estimating V OC loss in our MWT solar cells as a result of via recombination. We find that via recombination losses can be substantial at high via densities and so by limiting the number of vias on large area cells (239 cm 2 ) and with good via passivation, the V OC loss can be limited to ~ 1 mV. This finding is in agreement with our cell integration results.

Previously, IMEC proposed the i(2)-module concept which allows to process silicon heterojunction interdigitated back-contact (SHJ-IBC) cells on thin ( < 50 mu m) Si wafers at module level. This concept includes the bonding of the thin wafer early on to the module cover glass, which delivers mechanical support to the wafer and thus significantly improves the production yield. In this work, we test silicone and ethylene vinyl acetate bonding agents and prove them to be resistant to all rear side processes, including wet and plasma processes. Moreover, a lift-off process using a sacrificial SiOx layer has been developed for emitter patterning to replace conventional lithography. The optimized process steps are demonstrated by the fabrication of SHJ-IBC cells on 6-inch 190 mu m-thick wafers. Efficiencies up to 22.6% have been achieved on reference freestanding wafers. Excellent V-oc of 734 my and J(sc) of 40.8 mA/cm(2) lead to an efficiency of 21.7% on silicone-bonded cells, where the high V-oc indicates the process compatibility of the bonding agent. The developments that enabled such achievements and the key factors that limit the device performance are discussed in this paper. The authors would like to thank the financial support of imec's industrial affiliation program for Si-PV. This work was also partially funded by Kuwait Foundation for the Advancement of Sciences under project code: P115-15EE-01. The research has received funding from the European Union's Seventh Programme for research, technological development and demonstration under grant agreements no. 609788 (Cheetah), and also funding from the European Union's Horizon 2020 research and innovation programme under the Marie Sklodowska-Curie grant agreement No 657270. The authors gratefully acknowledge Joachim John for the spectral response measurements and Yiming Yang for the SEM measurements.

Extensive knowledge of the dependence of solar cell and module performance on temperature and irradiance is essential for their optimal application in the field. Here we study such dependencies in the most common high-efficiency silicon solar cell architectures, including so-called Aluminum back-surface-field (BSF), passivated emitter and rear cell (PERC), passivated emitter rear totally diffused (PERT), and silicon heterojunction (SHJ) solar cells. We compare measured temperature coefficients (TC) of the different electrical parameters with values collected from commercial module data sheets. While similar TC values of the open-circuit voltage and the short circuit current density are obtained for cells and modules of a given technology, we systematically find that the TC under maximum power-point (MPP) conditions is lower in the modules. We attribute this discrepancy to additional series resistance in the modules from solar cell interconnections. This detrimental effect can be reduced by using a cell design that exhibits a high characteristic load resistance (defined by its voltage-over-current ratio at MPP), such as the SHJ architecture. We calculate the energy yield for moderate and hot climate conditions for each cell architecture, taking into account ohmic cell-to-module losses caused by cell interconnections. Our calculations allow us to conclude that maximizing energy production in hot and sunny environments requires not only a high open-circuit voltage, but also a minimal series-to-load-resistance ratio.

Utilisation of expensive silicon (Si) material in crystalline Si modules has come down to 4 g Si per watt-peak in 2018, mainly as a result of reduction in wafer thickness and kerf losses as well as increase in module efficiencies. With continued progress in conventional multi-wire sawing of ingots, wafers as thin as 100 mu m could eventually be produced. Beyond this, kerfless lift-off technologies are being investigated which enable wafer thicknesses well below 100 mu m with negligible Si kerf waste. Such thin Si wafers and foils would be much lighter in weight than today's standard 165-180 mu m-thick wafers and would exhibit considerable flexibility and fragility. This necessitates a rethink about how to handle and process thin Si into solar devices in a manufacturing line with high mechanical yield and high throughput. This paper gives a broad overview of the different approaches for fabricating solar cells on thin Si foils. In particular, three routes are discussed in detail, namely (1) freestanding processing of thin Si, (2) processing of thin Si supported mechanically on a conductive low-cost Si substrate ("wafer-equivalent" approach) and (3) processing of thin Si bonded to a transparent glass superstrate. In each case, the main challenges are explained and the recent progress in addressing them are summarised. Kerfless 50 mu m-thick epitaxial Si foils lifted-off using porous Si and thinned-down Si wafers (below 70 mu m) are used as model substrates for this work. The authors gratefully acknowledge the efforts of several people who were involved in this work over the last few years, namely Jonathan Govaerts, Stefano Granata, Menglei Xu, Ergi Donercark, Ivan Sharlandshiev, Shashi Kiran Jonnak, Shruti Jambaldinni, Robert Roozeman, Jarkko Heildcinen, Thomas Kaden, Zuzana Kovacova, Erich Neubauer, Michael Grimm and Kaori Nagaoka. The authors also acknowledge the funding received for this work from the European Commission for the H2020 project CABRISS under grant agreement No. 641972. Imec is a partner in EnergyVille (www.energyville.be), a collaboration between the Flemish research partners KU Leuven, VITO, imec, and UHasselt in the field of sustainable energy and intelligent energy systems. Radhakrishnan, HS (reprint author), Imec Vzw Partner EnergyVille, Kapeldreef 75, B-3001 Leuven, Belgium. sivarama@imec.be

A possible research path to increase the photo-generated current in silicon heterojunction (SHJ) solar cells is to replace doped layers on the front-side of the cell, which result in significant parasitic light absorption losses. MoOx is one candidate to replace the p-doped a-Si:H layer in such devices, although it is claimed to be relatively unstable to thermal treatments. We found that a MoOx film with a thickness of 6 nm is sufficient to achieve a JSC of 36 mA/cm2, which is 0.5 mA/cm2 on average higher than that of our classical SHJ reference cell. We also established a contact sintering condition for printed Ag at 160 °C after MoOx deposition, without degrading the cell performance. The champion MoOx-contacted cell yielded VOC of 724 mV and FF of 74.1%, resulting in an efficiency of 19.3%. From a detailed analysis of the interfaces of the hole contact, an interfacial a-SiOx of 1.6–2 nm was observed between a-Si:H and MoOx irrespective of the MoOx thickness (6–10 nm) before and after contact sinter annealing at 160 °C. We postulate that this a-SiOx layer acts as an interfacial dipole layer and also increases the contact resistivity at this contact. The intrinsic stability of the optimised MoOx-contacted cell is studied using a one-cell mini-module under standard damp-heat testing (85 °C/85% humidity/1000 h). More than 97 %rel of the original efficiency is maintained after 1010 h of testing, which is comparable to the behavior observed in a classical SHJ reference one-cell mini-module that was similarly tested.

We present a novel process sequence to simplify the rear‐side patterning of the silicon heterojunction interdigitated back contact (HJ IBC) cells. In this approach, interdigitated strips of a‐Si:H (i/p+ ) hole contact and a‐Si:H (i/n+ ) electron contact are achieved by partially etching a blanket a‐Si:H (i/p+ ) stack through an SiOx hard mask to remove only the p+ a‐Si:H layer and replace it with an n+ a‐Si:H layer, thereby switching from a hole contact to an electron contact in situ, without having to remove the entire passivation. This eliminates the ex situ wet clean after dry etching and also prevents re‐exposure of the crystalline silicon surface during rear‐side processing. Using a well‐controlled process, high‐quality passivation is maintained throughout the rear‐side process sequence leading to high open‐circuit voltages (VOC). A slightly higher contact resistance at the electron contact leads to a slightly higher fill factor (FF) loss due to series resistance for cells from the partial etch route, but the FF loss due to J02‐type recombination is lower, compared with reference cells. As a result, the best cell from the partial etch route has an efficiency of 22.9% and a VOC of 729 mV, nearly identical to the best reference cell, demonstrating that the developed partial etch process can be successfully implemented to achieve cell performance comparable with reference, but with a simpler, cheaper, and faster process sequence.

We present a novel process sequence to simplify the rear-side patterning of the silicon heterojunction interdigitated back contact (HJ IBC) cells. In this approach, interdigitated strips of a-Si:H (i/p(+)) hole contact and a-Si:H (i/n(+)) electron contact are achieved by partially etching a blanket a-Si:H (i/p(+)) stack through an SiOx hard mask to remove only the p(+) a-Si:H layer and replace it with an n(+) a-Si:H layer, thereby switching from a hole contact to an electron contact in situ, without having to remove the entire passivation. This eliminates the ex situ wet clean after dry etching and also prevents re-exposure of the crystalline silicon surface during rear-side processing. Using a well-controlled process, high-quality passivation is maintained throughout the rear-side process sequence leading to high open-circuit voltages (V-OC). A slightly higher contact resistance at the electron contact leads to a slightly higher fill factor (FF) loss due to series resistance for cells from the partial etch route, but the FF loss due to J(02)-type recombination is lower, compared with reference cells. As a result, the best cell from the partial etch route has an efficiency of 22.9% and a V-OC of 729 mV, nearly identical to the best reference cell, demonstrating that the developed partial etch process can be successfully implemented to achieve cell performance comparable with reference, but with a simpler, cheaper, and faster process sequence. European Commission's Horizon 2020Framework Programme, Grant/Award Num-ber: 727523; IIAP‐SiPV; Kuwait Foundationfor the Advancement of Sciences, Grant/Award Number: P115‐15EE‐01

We derive efficiency roadmaps for three industrial bifacial cell types, (1) pPERC, (2) rear-emitter nPERT, and (3) front-emitter nPERT, using an approach based on Quokka 2 numerical simulations. Using realistic incremental improvements based on data available in the literature, we show that the efficiency potential for bifacial pPERC and rear-emitter nPERT cells exceeds 24% while the efficiency potential for front-emitter nPERT cells is above 24.5%.We derive efficiency roadmaps for three industrial bifacial cell types, (1) pPERC, (2) rear-emitter nPERT, and (3) front-emitter nPERT, using an approach based on Quokka 2 numerical simulations. Using realistic incremental improvements based on data available in the literature, we show that the efficiency potential for bifacial pPERC and rear-emitter nPERT cells exceeds 24% while the efficiency potential for front-emitter nPERT cells is above 24.5%.

We have studied the effect of different cleanings at device level for nPERT (passivated Emitter, Rear Totally diffused) cells with a rear epitaxial emitter. Cleanings based on sulfuric acid and peroxide mixtures (SPM), which are effective but also expensive, were used as reference. We found that simplified cleanings such as those based on sulfuric acid and ozone mixtures (SOM), and those based on water and ozone (IPV), are giving similar results at device level as the expensive SPM cleaning, leading to similar J0e, J0, FSF, and lifetime values. The implied VOC values of corresponding test devices fabricated using the simplified cleanings are at the same high level as the test devices using more expensive SPM cleanings. Actual nPERT devices with moderately doped epitaxially-grown emitters with a constant doping profile (box profile) showed average efficiencies above 22.0% for both SOM and IPV cleanings. Very high VOC values of up to 695 mV and implied VOC values of up to 730 mV were shown for cells with a flat rear surface. Finally, the best nPERT cells with rear epitaxial emitter and SOM cleaning showed efficiencies up to 22.5%, as externally confirmed by ISE CalLab.

This paper proposes a kerfless wafer structure with built-in p-n junctions in n-type silicon wafers grown using Crystal Solar's high throughput epitaxy technology. Compared with a conventional p-type emitter by boron diffusion, ion implantation, or epitaxy, the built-in p-type emitter has a reduced and uniform doping concentration and increased thickness. The epitaxially grown wafers and conventional Czochralski (CZ) n-type wafers were processed into solar cells. A best efficiency of 22.5% with epitaxially grown wafers was achieved, with a 6 mV gain in open-circuit voltage, suggesting a high wafer quality and superiority of the deep epitaxial emitter over a standard boron-diffused emitter. Substrate reuse associated with the kerfless epitaxy technology is studied as well, with respect to its impact on solar cell efficiency. The data suggest no degradation in cell efficiency due to substrate reuse.

The influence of the plasma ignition condition during PECVD deposition from a silane/hydrogen mixture on the amorphous silicon passivation of crystalline silicon surface is investigated. The changes in this process step mainly consist in varying the power density for very brief durations in between 1 s and 3 s. We find that the ignition phase contributes significantly in the film growth, especially in the a-Si:H/c-Si interface formation. In particular, the deposition rate increases with ignition power density. TEM cross-section inspection presents a rougher a-Si:H/c-Si interface with higher plasma power and thus, a tendency for nano-clusters formation caused by the crystalline nature of the substrate. In-situ plasma diagnostics reveal the gradual raise up of I Ha*/ I SiH* with the power density leading to worse SiH* abstraction to the surface. Whereas, time-resolved optical emission spectroscopy explains the possible recombination mechanism in the plasma due to higher-silane related reactive species (HSRS) formation via polymerization reactions. Our results point out that the ignition conditions with a rather low power for longer time give the best passivation, resulting an effective lifetime up to 9 ms.

Building on the previous development of large-area interdigitated back-contacted silicon solar cells employing a copper plating metallization process, a loss analysis of the cell performance is presented. The impact of our cell design on edge losses is reported, where it is shown that significant current and fill factor losses result, arising from an edge back surface field region that is adjacent to the emitter busbar. The cell schematic was redesigned to limit these edge effects, together with the reduction of the total busbar width. The measured results were validated by simulations, which enabled the optimum contact fraction to be employed. Combining these effects, interdigitated back contact solar cells were fabricated on 15.6 × 15.6 cm2 wafers, which achieved efficiencies of 22.5%, or 5.37-W maximum power output. The developments that enabled this improvement are discussed in this paper.

In order to reduce the material cost for silicon solar cells, several research groups are investigating methods to minimize the silicon consumption for making monocrystalline silicon wafers. One promising approach is deposition of an epitaxial layer on porous silicon, followed by detachment of the layer. This contribution discusses improvements in the epitaxial wafer fabrication by optimization of the porosification process. The introduction of a layered porous silicon structure allows to independently improve both epitaxial layer quality and detachment yield. In this way, we have managed to obtain 100µm thick silicon wafers with effective lifetimes up to 1.3ms, and 40µm thick wafers with effective lifetimes up to 700µs. We will also review the current status of the process development for solar cells made on thin wafers. Two approaches are presented. In the first approach, heterojunction solar cells are fabricated on freestanding epitaxial wafers of 40µm thickness. In the second approach, high efficiency (21%) heterojunction back-contacted cells are fabricated on wafers that are bonded to a glass superstrate. Challenges for device processing and limitations in cell performance are discussed.

This work evaluates the potential of selective epitaxy to mitigate the recombination losses at the p-type contact regions of plated bifacial n-type PERT cells. Following the growth of a 500 nm, 2.5 10(19) cm(-3) boron doped epitaxial layer at the emitter contact regions defined by laser ablation of the passivating dielectrics, both an increase in V-oc (+6 mV) and FF (+ 1% absolute) are measured in the final cells compared to the reference with a homogeneous diffused emitter. These results come with an average efficiency gain of 0.3 and 0.5% absolute for front and rear side illumination, respectively. If the diffused, blanket emitter in the passivated regions is replaced by a thicker, lowly doped epitaxial profile (3 mu m, 5 10(18) cm(-3)) to further reduce recombination, an additional rise in implied V-oc after metallization of 10 mV is estimated. This increase would be the result of a reduction in J(0,pass, emitter) (down to 6 fA/cm(2)) and J(0,plated, emitter) (down to 1967 fA/cm(2)).

Copyright © 2018 John Wiley & Sons, Ltd. In this work, the ATOM (intrinsic a-Si:H/TiO x /low work function metal) structure is investigated to realize high-performance passivating electron-selective contacts for crystalline silicon solar cells. The absence of a highly doped Si region in this contact structure is meant to reduce the optoelectrical losses. We show that a low contact resistivity (ρ c ) can be obtained by the combined effect of a low work function metal, such as calcium (Φ 2.9 eV), and Fermi-level depinning in the metal-insulator-semiconductor contact structure (where in our case TiO x acts as the insulator on the intrinsic a-Si:H passivating layer). TiO x grown by ALD is effective to achieve not only a low ρ c but also good passivation properties. As an electron contact in silicon heterojunction solar cells, inserting interfacial TiO x at the i-a-Si:H/Ca interface significantly enhances the solar cell conversion efficiency. Consequently, the champion solar cell with the ATOM contact achieves a V OC of 711 mV, FF of 72.9%, J SC of 35.1 mA/cm 2 , and an efficiency of 18.2%. The achievement of a high V OC and reasonable FF without the need for a highly doped Si layer serves as a valuable proof of concept for future developments on passivating electron-selective contacts using this structure. ispartof: PROGRESS IN PHOTOVOLTAICS vol:26 issue:10 pages:835-845 status: published

The heterojunction interdigitated back-contact (HJ IBC) cell technology enables remarkably high cell efficiencies, but requirescomplex processing for the rear-side patterning of the interdigitated a-Si:H electron and hole hetero-contacts. Therefore, the HJ IBC process flow must be simplified into a sequence that is cost-effective and industrially-compatible. Towards this goal, a litho-free, all-dry process sequence is being developed. As part of this simplified process flow, a novel in situ dry clean process called “nano-envelope” clean is developed to replace the wet cleaning after dry etching of a-Si:H. Surface contaminationanalysis and passivation studies prove that the developed dry clean is as effective as the standard wet clean. Since the “nano-envelope” clean can bedone in the same PECVD tool, the sequence from dry etching to repassivation can be done fully in situ.

We present a novel approach to simplify the rearside a-Si:H patterning of silicon heterojunction interdigitated back-contact solar cells. In our current process, laser ablation and lift-off are used. Since lift-off is not industrially-viable, we propose to replace it with a selective deposition process which ensures a-Si: H is realised only on c-Si surface and not on the SiOx mask, at the end of the process, based on cycles of a-Si: H deposition and etching. While neither the deposition nor the etching is truly selective, this method relies on the difference of a-Si: H etch rates on c-Si and SiOx surfaces to achieve selectivity as the net end-result. The main challenge is addressing the trade-off between selectivity and c-Si surface passivation. The authors gratefully acknowledge the financial support of imec’s industrial affiliation program for Si-PV. This project has also received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement no. 727523 (NextBase).

Lowering production costs for crystalline silicon solar cells is critical. Fabricating large volumes of higher efficiency industrial cells is key to lower costs. Also critical are improving the efficiency of metal–insulator–semiconductor inversion layer (MIS-IL) solar cells, improving substrate materials, and further developing commercial PV modules.

In this work, we evaluate the impact of implementing a selective back surface field (BSF) on the performance of bifacial n-type Passivated Emitter and Rear Totally diffused (PERT) cells with Ni/Ag co-plated contacts. For this, we compare bifacial nPERT cells featuring a homogeneous BSF etched-back to ~100 Ω/sq and patterned by laser ablation to cells featuring an identical front side design and a selective BSF obtained by means of laser doping. In the first part of this paper, we demonstrate using test structures that selective BSF cells benefit from drastically lower area weighted recombination current density (J0) contributions at the BSF side resulting in estimated Voc improvement from ~657 mV to ~ 681 mV. In the second part of this paper, we confirm at cell level that implementing a selective BSF results in gains in Voc ~ 30 mV, jsc~ 0.2 mA/cm2, and Fill Factors FF ~ 0.9%abs. resulting in average cell efficiencies improving from 20.7±0.4 % to 22.0±0.2 %. This clearly confirms that a selective BSF is required in nPERT cells with Ni/Ag co-plated contacts to maximize cell efficiencies. Finally, we fabricated a 9-cells bifacial glass-glass laminate for proof-of-concept and discuss several possible improvements to bring 60-cells module front maximum power values under standard test conditions (STC) above 340 Wp.

A TiOx layer is well known as an electron-selective contact material because of its asymmetric band offsets with respect to c-Si. When applying TiOx layers as passivating electron-selective contacts, forming sub-stoichiometric TiOx is important to obtain a low contact resistivity because oxygen vacancies increase the conductivity of TiOx and provide n-type doping effects. In this work, oxygen vacancies at SiOx/TiOx interfaces are investigated by atomic depth profiling of XPS measurements. Three kinds of TiOx layers are studied grown by either e-beam evaporation, atomic layer deposition or sputtering on c-Si. In all three TiOx samples, a resulting stack of c-Si/SiOx/TiOx could be noticed XPS measurements that show SiOx peaks near the c-Si/TiOx interface. Moreover, clear TiO2 peaks, which can be measured at the surface of all three TiOx layer types, gradually change to Ti or TiSi2 peaks near the SiOx/TiOx interface. This indicates that many oxygen vacancies seem to exist at the SiOx/TiOx interface. This TiOx reduction may contribute to the formation of a dipole and increased downward band bending resulting in a lower contact resistivity in the electron-selective contacts. As a result, hetero-junction solar cells with i-a-Si:H/TiOx/Ca/Al contacts exhibit a significant series resistance reduction of about 40 % compared to solar cells with i-a-Si:H/Ca/Al contacts.

Recently, large area hybrid silicon heterojunction cells (SHJ) with nickel/copper (Ni/Cu) plated front contacts were shown to benefit from a simpler processing sequence than n-PERT cells featuring a boron diffused rear emitter. Hybrid refers here to the combination of a diffused front surface field (FSF) and a SHJ rear emitter. In this work, further process simplifications for such hybrid SHJ cells are evaluated. Based on reflectance and adhesion considerations, stacks of tin-doped indium oxide and copper (ITO/Cu) and chromium/silver (Cr/Ag) are tested as alternative to the previously chosen ITO/Ag rear contact stack. Using ITO/Cu/Al as rear contact stack, average efficiencies of 20.8±0.2% are presented on 6-inch wafers. We also demonstrate that the excimer laser annealing step previously employed to form nickel silicides at the front side can be skipped without comprising solder tab adhesion quality.

This work focuses on the fabrication of nPERT(Passivated Emitter, Rear Totally Diffused) devices incorporating an epitaxially grown single side rear-emitter. Such epi-nPERT cells are fabricated in a simplified way using the selectivity of the epitaxial deposition, which is obtained by a PECVD-SiOxlayer, that not only mask the front but also passivates the cell. The cell performance is studied in terms of: i) various front surface fields (FSF) applied prior to emitter epitaxy and ii) usage of laser doping as an alternative to laser ablation for a front contacting scheme. The results show: i) a clear relationship between the depth of the homogeneous FSF and its impact on the open circuit voltage of the devices, with a shallow FSF having the highest V OC loss due to laser damage and ii) laser doping on devices with a relatively deep diffused FSF giving 8 mV increase in V OC as compared to devices with ablated dielectrics and a V OC increase of almost 30 mV in case a shallow selective FSF is applied. This results in a best efficiency obtained so far for the epi nPERT devices of 21.6% (226 cm 2 ).

In this work we present large area p-type PERL solar cells featuring local p + Back-Surface-Field (BSF) obtained by pico-second (ps) laser processing of thin ALD Al 2 O 3 layers capped either by PECVD SiN x or PECVD SiO x . In this specific approach, the laser processing is performed through the rear passivation stack, whereby the laser simultaneously patterns the dielectrics for the subsequent Al–Si contact formation, whilst incorporating the Al atoms from the Al 2 O 3 film into the underlying Si bulk. With this technique, we register substantial dopant incorporation for 10 nm of ALD Al 2 O 3 , without using additional doping sources. When this process is coupled to a front metallization scheme based on Cu plating, p-PERL cells can be fabricated adopting only low temperature process steps, which avoids thermal stability issues related to the Al 2 O 3 layer, such as crystallization and blistering, and improves the properties of the rear reflector by avoiding Al–Si alloying. Efficiencies up to 20.7% are reported on 6-in. Cz–Si solar cells featuring local p + BSF formed by laser doping through a rear stack composed of 10 nm ALD Al 2 O 3 and 120 nm PECVD SiN x .

Argon (Ar) and oxygen (O2) plasmas are performed on silicone adhesives to eliminate the negative influence of silicone on amorphous silicon (a-Si:H) surface passivation of wafers bonded to glass. Both the Ar and O2 plasmas lead to oxidation of the silicone surface, consisting in an increase of oxygen/carbon ratio, of degree of crosslinking, and of material density. The oxidized silicone is more resilient than pristine and does not interact with the a-Si:H passivation process, allowing for state-of-the-art surface passivation of wafers bonded to glass. Similarities between the modifications induced by the Ar and O2 plasmas on the silicone indicate the secondary role of the O2 radicals in the oxidation process. Moreover, amorphous/crystalline heterojunction interdigitated back contact solar cells (a-Si:H/c-Si HJ i-BC) are fabricated on freestanding and bonded wafers treated with Ar plasma. The devices show comparable open-circuit voltages of up to 675 mV, confirming at device level the efficacy of the treatment.

We report the use of a screen-printable copper paste to form the front busbars on high efficiency photovoltaic cell structures in combination with copper fingers formed by light induced plating. Such a process route offers economic benefits relative to the fully plated front metallization due to the reduced requirement for laser ablation and increased cell performance. We demonstrate improved open circuit voltage and fill factor compared to cells that used plating for both the fingers and the busbars. These result from reduced contact between the semiconductor and the metal and from reduced shunting compared to the laser ablated and plated electrodes. p-type ‘PERC’ cells have been fabricated with copper plated fingers and screen-printed copper busbars with a median cell efficiency of 20.4%, compared to 20.3% for those with fully plated busbars. n-type ‘PERT’ cells reached a cell efficiency of 20.9% for both front metallization schemes. The screen-printed busbars gave a ∼5 mV advantage over the plated busbars in both cases.

Two important aspects for the success of the porous silicon-based layer transfer method in producing kerfless thin ( 15 cm −3 which corresponds to a minimum minority carrier diffusion length of ~670 µm (> 16 times the silicon thickness). With such high quality epitaxial foils combined with high detachment yield, very high efficiency solar devices on thin silicon substrates would be a reality in the near future.

The influence of the cleaning process on the amorphous silicon passivation of homojunction emitters is investigated. A significant variation in the passivation quality following different cleaning sequences is not observed, even though differences in cleaning performance are evident. These results point out the effectiveness of our cleaning treatment and provide a hydrogen termination for intrinsic amorphous silicon passivation. A post-deposition treatment improves the passivation level yielding emitter saturation currents determined by Auger recombination in the order of 70 fA/cm2 and below.

A detailed investigation of the laser damage to amorphous silicon (a-Si:H) layers patterned by laser ablation (LA) and wet chemical etching is presented. This approach can be applied to pattern the rear side of silicon heterojunction interdigitated back-contact solar cells. Only the top sacrificial a-Si:H laser-absorbing layer of an a-Si:H/SiOx/a-Si:H/c-Si stack is ablated. Laser damage in the bottom a-Si:H layer and a-Si:H/c-Si interface is analyzed by both scanning electron microscopy and transmission electron microscopy. We show that the a-Si:H/c-Si passivation is degraded by laser damage and that this degradation can be diminished by increasing laser processing speed. This is attributed to a decrease of laser-irradiated area, and particularly smaller overlapping zones of adjacent laser pulses. The re-passivation quality after LA and wet etching is similar to that of as-passivated samples. This indicates that laser damage is not present in the bulk c-Si substrate but only in the a-Si:H passivation layer, which is removed during subsequent wet etching, thus allowing high quality repassivation., Marie Sklodowska-Curie Action; Epitaxial silicon foil solar cells with interdigitated back contacts 657270 — EpiSil-IBC published in physica status solidi (RRL) - Rapid Research Letters doi:10.1002/pssr.201700125

This paper presents the different strategies which have been studied at imec in order to reduce the front surface recombination of our monofacial high-efficiency rear-junction (RJ) n-PERT diffused cells. These devices feature: a laser doped selective FSF on a lightly POCl 3 diffused front side; front contacts by Ni/Cu plating followed by immersion Ag plating; a diffused rear boron emitter passivated with an Al 2 O 3 /PECVD SiO x stack and sputtered rear AISi contacts. Each of the three main parameters contributing to the front recombination has been tackled, starting from the reduction of the metal front recombination (by improving the laser doping process), then the reduction of the contact fraction with the implementation of busbar free cells and finally, a further reduction in the recombination of the passivated areas, by improving the thermal treatment of the dielectrics. This study shows that an average 23% efficiency is within reach for large-area double-side contacted RJ PERT cells, with voltages over 700 mV and an average FF of 80.7 % .

In this work, we investigate the temperature and irradiance dependencies of the power output of silicon solar cell architectures (BSF, PERC, PERT, SHJ). When we compare our data with commercial module datasheets, we find that the temperature coefficient under maximum power point conditions is systematically worse in the modules. Following our analysis we attribute this to ohmic losses $(R_{\mathrm{CTM}})$ due to cell interconnection. Using energy yield calculations we show the impact of $R_{\mathrm{CTM} }$ on the energy production in moderate and hot and sunny climates for all investigated architectures. We conclude that maximizing energy production in hot and sunny environments requires not only a high open-circuit voltage, but also a minimal series-to-Ioad-resistance ratio.

Eliminating a doping process could be an effective way to reduce the production cost of c-Si cells. However, in absence of highly doped Si, the formation of a high quality contact is not straightforward. The lack of field-effect passivation from a lowly doped region can lead to a high recombination current density at the contacts (J(0,metal)) and moreover, contact resistivity (rho(c)) typically increases when doping level is decreasing. In this work we focus on reducing the contact resistivity of an electron-selective contact for doping-free cells. Although the effect of low work function metals (LWMs) in combination with an i-a-Si:H layer has already been reported, the synergy effect of a LWM and a MIS (Metal-Insulator-Semiconductor) contact structure on top of the ia-Si:H has not been reported yet. Here, we demonstrate a new ATOM (i-a-Si:H / TiOX / low workfunction metal) contact structure as an electron-selective contact using an i-a-Si:H layer, a TiOX interfacial layer and Ca (Phi 2.9eV) without requiring an additional n(+) doping process. The addition of TiOX in between the i-a-Si:H layer and the Ca decreases the pc by about 2 orders of magnitude. Despite of increased J(0,metal) due to e-beam processing of TiOX, the Ca based ATOM contact increases the potential max efficiency up to 25 %. To the best of our knowledge, this is the first demonstration of an electron-selective contact comprising a low work function metal, an interfacial TiOX and an i-a-Si:H passivation layer. This type of contact could be a promising route for the optimization of doping-free cells (C) 2017 The Authors. Published by Elsevier Ltd. The authors gratefully acknowledge the financial support of imec's industrial affiliation program for Si-PV. And part of this project has received funding from the European Union's Horizon 2020 research and innovation programme under the Marie Sklodowska-Curie grant agreement No 657270.