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Flight proven entry system and TPS technologies are critical for the successful execution of in-situ science missions at Venus. Emerging new technologies point to new possibilities and offer innovative approaches to delivering small satellites for orbital science. Venus entry can be very demanding and there are only a few flight proven TPS, some developed by Industry and others by NASA, capable of meeting the mission needs. NASA developed TPS has predominately been transferred to Industry and it is assumed industry will maintain the fabrication capability. However, lack of mission needs may result in obsolence of TSP fabrication capability if there is no money and no motivation. Even within NASA, its' expertise could be diverted to higher priority objectives and thereby the readiness for particular material systems can be impacted or lost. Atrophy of capabilities can come about in other ways as well such as changes to raw materials. Even small manufacturing process changes can demand requalification and TRL may be degraded. Carbon-Phenolic is a text book example. After a long period of absence of US Venus missions, VEXG and the Science community is making the case for future missions. It is insufficient to assume the TSP technologies will be there in 5 or 10 years without active and continual planning and assessment. After Galileo, Carbon-Phenolic materials and fabrication skills were allowed to atrophy. Then when missions needed it, in early 2000, it was no longer possible to make the heritage Carbon-Phenolic. What do we need to do? The first step is to advocate for the establishment of TPS readiness assess-ment. The assessment will involve understanding threats and opportunities, and the development of risk mitigation strategies. VEXAG needs to advocate for such an active monitoring of the needed capabilities, assessment of emerging risks and development of risk mitigation strategies with implementation plans. Such an approach reduces the threat of material obsolence and helps maintain the availability of entry system and TPS technology capabilities, both old and new. Venus probes, landers, balloons and other variable altitude missions, and skimmer missions such as "Cu-pid's Arrow" as well as aerocapture missions to deliver small spacecraft require qualified entry systems and ablative TPS. VEXAG advocated for HEEET in 2013/2014 and the community is well versed with the need to sustain it. But, other TPS that need to be sustained may not be apparent to VEXAG community. The following figure summarizes the ablative TPS capabilities vs Venus mission needs for both primary heatshield and backshell.

Dragonfly is a proposed New Frontiers class mission that will send a nuclear powered octocopter to the surface of Titan for an extended science mission. This presentation will provide an overview of the Entry and Descent system that is under development to ensure the save delivery of this unique "relocatable lander" to Titan. Titan's dense atmosphere, large atmospheric scale height, and low gravity allows for a slow-paced entry and descent sequence that lasts more than 100 minutes, as opposed to the "7 minutes of terror" that is charac-teristic of landed Mars missions. This slow pace al-lows for sufficient temporal separation between critical events of the EDL sequence to minimize overall risk.The Dragonfly entry and descent system is composed of high-heritage components, minimizing overall risk. The aeroshell will be a scaled Genesis Sample Return capsule with a diameter of 3.75 meters, built by Lock-heed Martin. The thermal protection system (TPS) is made up of Phenolic Impregnated Carbon Ablator-Domestic (PICA-D) on the heatshield, SLA-561V on the backshell, and SLA-220M on the aft cover and low gain antenna. Each material has extensive heritage for the chosen application. The spacecraft will enter Titan at a velocity of 7.3 km/s, resulting in a predicted fully margined stagnation point heating environment of 254 W/cm2 heat rate and 13 kJ/cm2 heat load, well within the tested limits of the chosen materials. The aeroheat-ing environments, including the significant contribu-tion of shock layer radiation from CN on both the heatshield and backshell, are evaluated using state of the art models and codes that have been validated with appropriate ground testing.Once the deceleration pulse is complete, a disk-gap-band (DGB) drogue parachute will be deployed at ap-proximately Mach 1.5 to stabilize and further deceler-ate the spacecraft. Due to the dense atmosphere, the spacecraft will spend more than 80 minutes on this parachute, until reaching an appropriate altitude to de-ploy the subsonic main parachute. The lander is re-leased after approximately 17 minutes on the main chute before releasing and transitioning to powered flight in order to navigate to its first landing site. The release of the lander from the backshell effectively ends the entry and descent portion of the mission.The full presentation will provide additional details about the design of the EDL system hardware, engi-neering design, and overall con-ops. Preliminary aero-thermal and TPS sizing analyses will be presented, and the parachute system will be described in greater detail. In addition, the Dragonfly spacecraft will carry an En-gineering Science Investigation (ESI) package designed to obtain engineering data during EDL that will be used to validate the design methodology for future missions. An overview of the proposed ESI package will also be presented.

NASA is anticipated to commission the next Planetary Science Decadal Survey (PSDS) with preparation expected in early calendar year 2020. The new PSDS will outline the priorities of science missions for the decade spanning 2023-2032. For the previous PSDS, the science and technology communities have been invited to submit white papers to the PSDS sub-panels as background information to guide the PSDS recommendations. The National Research Council has previously stated that white papers that represent the opinion of many authors from different institutions carried more significance and weight, and the recommendations from the previous PSDS attempted to reflect more of a consensus opinion. In 2009, a total of 4 white papers were submitted to the PSDS panels regarding thermal protection system (TPS) readiness for missions, as well as one on TPS instrumentation. The TPS readiness papers were co-authored by 90 individuals from many institutions. These white papers surveyed the TPS materials for both forebody and afterbody of a probe and analyzed the suitability of materials for missions to each destination. In addition, each paper outlined the ground testing required and ongoing technology development. Recommendations were provided for further technology development and ground test capability in order to fulfill future missions. Many improvements and changes have occurred in the past 10 years with regard to TPS materials and instrumentation. New materials have been developed and tested, such as the high density material Heat-shield for Extreme Entry Environment Technology (HEEET), and new capabilities for ground testing for high heating and high pressures have been added such as the 3-inch nozzle at the Ames arc jet. NASA has also flown several TPS instrumentation suites, such as MEDLI (Mars Science Laboratory Entry, Descent, and Landing Instrument) and EFT-1 (Exploration Flight Test-1). In order to provide the PSDS sub-panels with the most current information about the state-of-the-art suitability for TPS materials for entry missions, we are beginning to update and draft new white papers. We will present the outline for material to be covered in the white papers, and we invite all IPPW (International Planetary Probe Workshop) attendees to particiate in co-authoring these papers.

The Common Probe Study was funded by the NASA's Planetary Science Division in the Science Mission Directorate in 2018 to investigate the feasibility of a common aeroshell design for atmospheric probe missions at Venus, Jupiter, Saturn, Uranus, and Neptune. The study involved 4 NASA Centers: Ames Research Center, Goddard Space Flight Center, Langley Research Center, and the Jet Propulsion Laboratory. The common aeroshell design that was studied was a 400 kg, 1.5 m diameter, 45-degree sphere cone shape with a high density heatshield material (Heatshield for Extreme Entry Environments Technology, or HEEET) and a parachute system to extract the descent vehicle. This size of aeroshell could accommodate a descent vehicle of 0.75 m diameter, which could encompass both Tier 1 and Tier 2 science instruments at each of the 5 destinations. Study methodology: First, a notional payload of instruments for each destination was defined based on the top priority measurements indicated by the Planetary Science Decadal Survey. Steep and shallow entry flight path angles (EFPA) were defined for each planet based on qualification and operational g-load limits for current, state-of-the-art instruments. Interplanetary trajectories were then identified that bounded the EFPA range.Next, 3-DoF simulations for entry trajectories were run using the entry state vectors from the interplanetary trajectories. Conical ribbon parachutes were sized based on heatshield separation dynamics. Aero-heating correlations were used to generate stagnation point convective and radiative heat flux profiles. High fidelity thermal response models for various TPS materials were used to size stagnation point thicknesses, with margins based on previous studies. Backshell TPS masses were assumed based on scaled heat fluxes from the heatshield and also from previous mission concepts.Based on these analyses, we have found that the common design is applicable for atmospheric probe missions for 4 out of the 5 destinations. Because of the unique gravity well for Jupiter, the entry environments are more severe resulting in heat loads an order of magnitude higher than for the other destinations.The next step is to determine what follow-on activities NASA should engage in. A questionnaire for the atmospheric probe community has been developed, with a focus on what size of aeroshell should be further analyzed (smaller or same diameter), and what incentives would make using such an aeroshell, if assembled and available, desirable to mission proposers.Preliminary results from this questionnaire will be presented.

Introduction: Atmospheric probes have been successfully flown to planets and moons in the solar system to conduct in situ measurements. They include the Pioneer Venus multiprobes, the Galileo Jupiter probe, and Huygens probe. Probe mission concepts to five destinations, including Venus, Jupiter, Saturn, Uranus, and Neptune, have all utilized similarshaped aeroshells and concept of operations, namely a 45° sphere cone shape with high density heatshield material and parachute system for extracting the descent vehicle from the aeroshell. The current paradigm is to design a probe to meet specific mission requirements and to optimize mass, volume, and cost for a single mission. However, this methodology means repeated efforts to design an aeroshell for different destinations with minor differences. A new paradigm has been explored that has a "common probe" design that could be flown at these different destinations and could be assembled in advance with multiple copies, properly stored, and made available for future NASA missions.

Estimate the mass of the Thermal Protection System (TPS) for a single design construct of an atmospheric entry probe with a rigid aeroshell, which could be used at five destinations, i.e. Venus, Saturn, Uranus, Neptune, and perhaps, Jupiter. The entry mass of the probe is 400 kg with a ballistic coefficient of 216 kg/m2. Process: The 3DoF trajectory simulation program Traj, coupled with the TPS response program FIAT was used for simulation and design. The assumed atmospheric models were VIRA (Venus-GRAM) for Venus, the Julianne Moses' model for Saturn, a NASA Ames engineering model for Uranus, Neptune-GRAM for Neptune, and Galileo Probe (Al Seiff's) result for Jupiter.

In 2012, the entry vehicle for the Mars Science Laboratory (MSL) mission was the largest and heaviest vehicle flown to another planet, designed to be able to withstand the largest heat fluxes in the Martian atmosphere ever attempted. The heatshield material that had been successfully used for all previous Mars missions had been baselined in the design, but during the development and qualification testing demonstrated catastrophic and unexplained failures. With only 10 months remaining before the original launch date, the TPS team led by NASA Ames designed and implemented a first-ever tiled, ablative heatshield. Highlights from MSL of the testing difficulties and innovations required to execute a new heatshield design will be presented, along with a sneak peak of the Mars 2020 mission.

The Mars 2020 Entry, Descent, and Landing Instrumentation 2 (MEDLI2) sensor suite seeks to address the aerodynamic, aerothermodynamic, and thermal protection system (TPS) performance issues during atmospheric entry, descent, and landing of the Mars 2020 mission. Based on the highly successful instrumentation suite that flew on Mars Science Laboratory (MEDLI), the new sensor suite expands on the types of measurements and also seeks to answer questions not fully addressed by the previous mission. Sensor Package: MEDLI2 consists of 7 pressure transducers, 17 thermal plugs, 2 heat flux sensors, and one radiometer. The sensors are distributed across both the heatshield and backshell, unlike MEDLI (the first sensor suite), which was located solely on the heat-shield. The sensors will measure supersonic pressure on the forebody, a pressure measurement on the aftbody, near-surface and in-depth temperatures in the heatshield and backshell TPS materials, direct total heat flux on the aftbody, and direct radiative heating on the aftbody. Instrument Development: The supersonic pressure transducers, the direct heat flux sensors, and the radiometer all were tested during the development phase. The status of these sensors, including the piezo-resistive pressure sensors, will be presented. The current plans for qualification and calibration for all of the sensors will also be discussed. Post-Flight Data Analysis: Similar to MEDLI, the estimated flight trajectory will be reconstructed from the data. The aerodynamic parameters that will be reconstructed will be the axial force coefficient, freestream Mach number, base pressure, atmospheric density, and winds. The aerothermal quantities that will be determined are the heatshield and backshell aero-heating, turbulence transition across the heatshield, and TPS in-depth performance of PICA. By directly measuring the radiative and total heat fluxes on the back-shell, the convective portion of the heat flux will be estimated. The status of the current tools to perform the post-flight data analysis will be presented, along with plans for model improvements.

The Mars Entry Descent and Landing Instrumentation 2 (MEDLI2) sensor suite will measure aerodynamic, aerothermodynamic, and TPS performance during the atmospheric entry, descent, and landing phases of the Mars 2020 mission. The key objectives are to reduce design margin and prediction uncertainties for the aerothermal environments and aerodynamic database. For MEDLI2, the sensors are installed on both the heatshield and backshell, and include 7 pressure transducers, 17 thermal plugs, and 3 heat flux sensors (including a radiometer). These sensors will expand the set of measurements collected by the highly successful MEDLI suite, collecting supersonic pressure measurements on the forebody, a pressure measurement on the aftbody, direct heat flux measurements on the aftbody, a radiative heating measurement on the aftbody, and multiple near-surface thermal measurements on the thermal protection system (TPS) materials on both the forebody and aftbody. To meet the science objectives, supersonic pressure transducers and heat flux sensors are currently being developed and their qualification and calibration plans are presented. Finally, the reconstruction targets for data accuracy are presented, along with the planned methodologies for achieving the targets.

High level summary of ground test capabilities available at NASA Ames Research Center that can aid in the development and design of future Outer Planet (Saturn and Uranus) probe missions

Exploration of Venus atmospheric entry trajectory space using a rigid aeroshell

Exploration of Saturn atmospheric entry trajectory space using a 45 sphere-cone rigid aeroshell.

The present study considers direct ballistic entries into the atmosphere of Venus using a 45deg sphere-cone rigid aeroshell, a legacy shape that has been used successfully in the past in the Pioneer Venus Multiprobe Mission. For a number of entry mass and heatshield diameter combinations (i.e., various ballistic coefficients) and entry velocities, the trajectory space in terms of entry flight path angles between skip out and -30deg is explored with a 3DoF trajectory code, TRAJ. From these trajectories, the viable entry flight path angle space is determined through the use of mechanical and thermal performance limits on the thermal protection material and science payload; the thermal protection material of choice is entry-grade carbon phenolic, for which a material thermal response model is available. For mechanical performance, a 200 g limit is placed on the peak deceleration load experienced by the science instruments, and 10 bar is assumed as the pressure limit for entry-grade carbon-phenolic material. For thermal performance, inflection points in the total heat load distribution are used as cut off criteria. Analysis of the results shows the existence of a range of critical ballistic coefficients beyond which the steepest possible entries are determined by the pressure limit of the material rather than the deceleration load limit.

Nanoscale structures, such as nanowires and carbon nanotubes (CNTs), are often grown in gaseous or plasma environments. Successful growth of these structures is defined by achieving a specified crystallinity or chirality, size or diameter, alignment, etc., which in turn depend on gas mixture ratios. pressure, flow rate, substrate temperature, and other operating conditions. To date, there has not been a rigorous growth model that addresses the specific concerns of crystalline nanowire growth, while demonstrating the correct trends of the processing conditions on growth rates. Most crystal growth models are based on the Burton, Cabrera, and Frank (BCF) method, where adatoms are incorporated into a growing crystal at surface steps or spirals. When the supersaturation of the vapor is high, islands nucleate to form steps, and these steps subsequently spread (grow). The overall bulk growth rate is determined by solving for the evolving motion of the steps. Our approach is to use a phase field model to simulate the growth of finite sized nanowire crystals, linking the free energy equation with the diffusion equation of the adatoms. The phase field method solves for an order parameter that defines the evolving steps in a concentration field. This eliminates the need for explicit front tracking/location, or complicated shadowing routines, both of which can be computationally expensive, particularly in higher dimensions. We will present results demonstrating the effect of process conditions, such as substrate temperature, vapor supersaturation, etc. on the evolving morphologies and overall growth rates of the nanostructures.

As semiconductor circuits shrink to CDs below 0.1 nm, it is becoming increasingly critical to replace and/or enhance existing technology with nanoscale structures, such as nanowires for interconnects. Nanowires grown in plasmas are strongly dependent on processing conditions, such as gas composition and substrate temperature. Growth occurs at specific sites, or step-edges, with the bulk growth rate of the nanowires determined from the equation of motion of the nucleating crystalline steps. Traditional front-tracking algorithms, such as string-based or level set methods, suffer either from numerical complications in higher spatial dimensions, or from difficulties in incorporating surface-intense physical and chemical phenomena. Phase field models have the robustness of the level set method, combined with the ability to implement surface-specific chemistry that is required to model crystal growth, although they do not necessarily directly solve for the advancing front location. We have adopted a phase field approach and will present results of the adatom density and step-growth location in time as a function of processing conditions, such as temperature and plasma gas composition.

To better utilize its vast collection of heterogeneous resources that are geographically distributed across the United States, NASA is constructing a computational grid called the Information Power Grid (IPG). This paper describes various tools and techniques that we are developing to measure and improve the performance of a broad class of NASA applications when run on the IPG. In particular, we are investigating the areas of grid benchmarking, grid monitoring, user-level application scheduling, and decentralized system-level scheduling.

Etching in semiconductor processing typically involves using halides because of the relatively fast rates. Bromine containing plasmas can generate high aspect ratio trenches, desirable for DRAM and MEMS applications, with relatively straight sidewalk We present scanning electron microscope images for silicon-etched trenches in a HBr plasma. Using a feature profile simulation, we show that the removal yield parameter, or number of neutrals removed per incident ion due to all processes (sputtering, spontaneous desorption, etc.), dictates the profile shape. We find that the profile becomes pinched off when the removal yield is a constant, with a maximum aspect ratio (AR) of about 5 to 1 (depth to height). When the removal yield decreases with increasing ion angle, the etch rate increases at the comers and the trench bottom broadens. The profiles have ARs of over 9:1 for yields that vary with ion angle. To match the experimentally observed etched time of 250 s for an AR of 9:1 with a trench width of 0.135 microns, we find that the neutral flux must be 3.336 x 10(exp 17)sq cm/s.

Etching of semiconductor materials is reliant on plasma properties. Quantities such as ion and neutral fluxes, both in magnitude and in direction, are often determined by reactor geometry (height, radius, position of the coils, etc.) In order to obtain accurate etching profiles, one must also model the plasma as a whole to obtain local fluxes and distributions. We have developed a set of three models that simulates C12 plasmas for etching of silicon, ion and neutral trajectories in the plasma, and feature profile evolution. We have found that the location of the peak in the ion densities in the reactor plays a major role in determining etching uniformity across the wafer. For a stove top coil inductively coupled plasma (ICP), the ion density is peaked at the top of the reactor. This leads to nearly uniform neutral and ion fluxes across the wafer. A side coil configuration causes the ion density to peak near the sidewalls. Ion fluxes are thus greater toward the wall's and decrease toward the center. In addition, the ions bombard the wafer at a slight angle. This angle is sufficient to cause slanted profiles, which is highly undesirable.

Self-Aligned Contact (SAC) etch has emerged as a key enabling technology for the fabrication of very large-scale memory devices. However, this is also a very challenging technology to implement from an etch viewpoint. The issues that arise range from poor oxide etch selectivity to nitride to problems with post etch nitride surface morphology. Unfortunately, the mechanisms that drive nitride loss and surface behavior remain poorly understood. Using a simple langmuir site balance model, SAC nitride etch simulations have been performed and compared to actual etched results. This approach permits the study of various etch mechanisms that may play a role in determining nitride loss and surface morphology. Particle trajectories and fluxes are computed using Monte-Carlo techniques and initial data obtained from double Langmuir probe measurements. Etched surface advancement is implemented using a shock tracking algorithm. Sticking coefficients and etch yields are adjusted to obtain the best agreement between actual etched results and simulated profiles.

Semiconductor device profiles are determined by the characteristics of both etching and deposition processes. In particular, a highly anisotropic etch is required to achieve vertical sidewalls. However, etching is comprised of both anisotropic and isotropic components, due to ion and neutral fluxes, respectively. In Ar/Cl2 plasmas, for example, neutral chlorine reacts with the Si surfaces to form silicon chlorides. These compounds are then removed by the impinging ion fluxes. Hence the directionality of the ions (and thus the ion angular distribution function, or IAD), as well as the relative fluxes of neutrals and ions determines the amount of undercutting. One method of modeling device profile evolution is to simulate the moving solid-gas interface between the semiconductor and the plasma as a string of nodes. The velocity of each node is calculated and then the nodes are advanced accordingly. Although this technique appears to be relatively straightforward, extensive looping schemes are required at the profile corners. An alternate method is to use level set theory, which involves embedding the location of the interface in a field variable. The normal speed is calculated at each mesh point, and the field variable is updated. The profile comers are more accurately modeled as the need for looping algorithms is eliminated. The model we have developed is a 2-D Level Set Profile Evolution Simulation (LSPES). The LSPES calculates etch rates of a substrate in low pressure plasmas due to the incident ion and neutral fluxes. For a Si substrate in an Ar/C12 gas mixture, for example, the predictions of the LSPES are identical to those from a string evolution model for high neutral fluxes and two different ion angular distributions.(2) In the figure shown, the relative neutral to ion flux in the bulk plasma is 100 to 1. For a moderately isotropic ion angular distribution function as shown in the cases in the left hand column, both the LSPES (top row) and rude's string method (bottom row) predict tapered profiles. The LSPES uses an AD with a FWHM = 13.5 degrees, and rude's model uses a ratio of sheath voltage to ion temperature of 50. The more anisotropic IADs produce profiles with more vertical sidewalls and a wider bottom surface, as shown in the right hand column. Here, the LSPES has an AD with a FWHM = 2 degrees, and rude's model uses a ratio of 500 of sheath voltage to ion temperature. The agreement between the LSPES and rude's model is excellent in both cases. We will present etching profiles generated by the LSPES, including calculations of the re-emitted fluxes of both neutrals and ions off of the profile walls. In addition, we will show the effect of geometric structures (overhangs, etc.) on the etching profiles. Other physical aspects, such as surface diffusion, will also be included in the model.

Tungsten and titanium nitride films have long been grown by chemical vapor deposition (CVD) methods. However, there has been recent interest in low temperature growth using plasma enhanced CVD. For the present work, we focus on the radio frequency (BE) discharge characteristics of gas mixtures used in nitride deposition (for example, WF6 and ammonia). Because the radial variations for a standard 200 mm, parallel plate reactor are limited to a small zone near the edges of the electrodes, a 1-D (one-dimensional) analysis is considered. This model consists of a self-consistent, 3-D (three-dimensional) moment fluid simulation that solves the continuity, momentum, and energy equations for neutral and charged species. The results in terms of plasma structure, radical concentrations, and local deposition rate will be presented. We will also compare the 1-D results with those obtained from a 2-D hybrid plasma equipment model (HPEM) developed at the University of Illinois.

Etching and deposition of materials are critical steps in semiconductor processing for device manufacturing. Both etching and deposition may have isotropic and anisotropic components, due to directional sputtering and redeposition of materials, for example. Previous attempts at modeling profile evolution have used so-called "string theory" to simulate the moving solid-gas interface between the semiconductor and the plasma. One complication of this method is that extensive de-looping schemes are required at the profile corners. We will present a 2D profile evolution simulation using level set theory to model the surface. (1) By embedding the location of the interface in a field variable, the need for de-looping schemes is eliminated and profile corners are more accurately modeled. This level set profile evolution model will calculate both isotropic and anisotropic etch and deposition rates of a substrate in low pressure (10s mTorr) plasmas, considering the incident ion energy angular distribution functions and neutral fluxes. We will present etching profiles of Si substrates in Ar/Cl2 discharges for various incident ion energies and trench geometries.