9 results on '"Hsiu Chuan Shih"'
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2. Processor and DRAM integration by TSV-based 3-D stacking for power-aware SOCs.
3. An enhanced double-TSV scheme for defect tolerance in 3D-IC.
4. Training-based forming process for RRAM yield improvement.
5. DArT: A Component-Based DRAM Area, Power, and Timing Modeling Tool.
6. A computer designed half Gb 16-channel 819Gb/s high-bandwidth and 10ns low-latency DRAM for 3D stacked memory devices using TSVs.
7. RRAM Defect Modeling and Failure Analysis Based on March Test and a Novel Squeeze-Search Scheme
8. DArT: A Component-Based DRAM Area, Power, and Timing Modeling Tool
9. DEVELOPMENT OF PROTOPLASTS OF ULVA FASCIATA (CHLOROPHYTA) FOR ALGAL SEED STOCK
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