80 results on '"Holsteyns F"'
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2. On the characterisation of grown-in defects in Czochralski-grown Si and Ge
3. Inflection points in interconnect research and trends for 2nm and beyond in order to solve the RC bottleneck
4. Buried Power Rail Integration with Si FinFETs for CMOS Scaling beyond the 5 nm Node
5. A record GmSAT/SSSAT and PBTI reliability in Si-passivated Ge nFinFETs by improved gate stack surface preparation
6. Singlet oxygen generation using PDMS occluded dyes
7. First Demonstration of Vertically Stacked Gate-All-Around Highly Strained Germanium Nanowire pFETs
8. First demonstration of vertically-stacked Gate-All-Around highly-strained Germanium nanowire p-FETs
9. Formation and Wet Removal of Organic and Titanium-Containing Residues on Patterned TiN/Porous Low-k Structure
10. Strained Germanium Gate-All-Around pMOS Device Demonstration Using Selective Wire Release Etch Prior to Replacement Metal Gate Deposition
11. Development of an all-in one wet single wafer process for 3D-SIC bump integration and its monitoring
12. Integrated clean for TSV: Comparison between dry process and wet processes and their electrical qualification
13. Characterization of Patterned Porous Low-kDielectrics: Surface Sealing and Residue Removal by Wet Processing/Cleaning
14. Oxygen Control Challenge for Advanced Wet Processing
15. Development of a Cu and W Compatible PERR Clean in BEOL Advanced Interconnect Patterning
16. (Invited) Selective Etch of Si and SiGe for Gate All-Around Device Architecture
17. Si-cap-free SiGe p-channel FinFETs and gate-all-around transistors in a replacement metal gate process: Interface trap density reduction and performance improvement by high-pressure deuterium anneal
18. Nanoscale Etching and Reoxidation of InAs
19. Effect of Downstream Plasma Treatment on Dissolution of Fluorocarbon Polymer in Organic Solvents
20. Scaling the 3D Bumps Pitch from 20 to 10 μm, Focusing on the Wet Cu Seed Etch Process Development
21. Post Etch Residue Removal and Material Compatibility in BEOL Using Formulated Chemistries
22. Evaluation of the Si0.8Ge0.2-on-Si Epitaxial Quality by Inline Surface Light Scattering: A Case Study on the Impact of Interfacial Oxygen
23. Role of Ambient Composition on the Formation and Shape of Watermarks on a Bare Silicon Substrate
24. Partial Wetting of Aqueous Solutions on High Aspect Ratio Nanopillars with Hydrophilic Surface Finish
25. Etching of III-V Materials Determined by ICP-MS with Sub-Nanometer Precision
26. Wet-Chemical Etching of InGaAs for Advanced CMOS Processing
27. Integration of Wet Cleaning in 45 Nm Pitch BEOL Processing
28. A Study of Nanoparticle Removal on Patterned Surfaces
29. (Invited) Particle Cleaning Technologies to Meet Advanced Semiconductor Device Process Requirements
30. Ex-situ bubble generation, enhancing the particle removal rate for single wafer megasonic cleaning processes
31. Single Bubble Cleaning and Vortex Flow
32. Acoustic Bubbles: Control and Interaction with Particles Adhered to a Solid Substrate
33. Roadblocks and Critical Aspects of Cleaning for Sub-65nm Technologies
34. Experimental and theoretical evidence for vacancy-clustering-induced large voids in Czochralski-grown germanium crystals
35. Monitoring and qualification using comprehensive surface haze information.
36. Etching of III-V Materials Determined by ICP-MS with Sub-Nanometer Precision.
37. Singlet oxygen generation using PDMS occluded dyes
38. Wetting performance on patterned substrates : experimental and numerical study
39. Nanoscale Wet Etching of Molybdenum Interconnects with Organic Solutions.
40. Preventing the Capillary-Induced Collapse of Vertical Nanostructures.
41. Dynamics of thin precursor film in wetting of nanopatterned surfaces.
42. Nanoscale Elastocapillary Effect Induced by Thin-Liquid-Film Instability.
43. Selective Wet Etching of Silicon Germanium in Composite Vertical Nanowires.
44. Scaled-Down c-Si and c-SiGe Wagon-Wheels for the Visualization of the Anisotropy and Selectivity of Wet-Chemical Etchants.
45. In-situ ATR-FTIR for dynamic analysis of superhydrophobic breakdown on nanostructured silicon surfaces.
46. Transient Clustering of Reaction Intermediates during Wet Etching of Silicon Nanostructures.
47. Superhydrophobic Breakdown of Nanostructured Surfaces Characterized in Situ Using ATR-FTIR.
48. Sonoluminescence and dynamics of cavitation bubble populations in sulfuric acid.
49. Full wetting of plasmonic nanopores through two-component droplets.
50. Study of non-spherical bubble oscillations near a surface in a weak acoustic standing wave field.
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