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7. Recent Achievements in Sub-10 nm DSA Lithography for Line/Space Patterning

Author

Navarro, Christophe, primary, Nicolet, Celia, additional, Ariura, Fumi, additional, Chevalier, Xavier, additional, Xu, Kui, additional, Hockey, Mary Ann, additional, Mumtaz, Muhammad, additional, Fleury, Guillaume, additional, Hadziioannou, Georges, additional, Legrain, Antoine, additional, Zelsmann, Marc, additional, Gharbi, Ahmed, additional, Tiron, Raluca, additional, Pain, Laurent, additional, Evangelio, Laura, additional, Fernandez-Regulez, Marta, additional, Perez-Murano, Francesc, additional, and Cayrefourcq, Ian, additional

Published
2017
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19. How much further can lithography process windows be improved?

Author

Hockey, Mary Ann, Lin, Qin, and Calderas, Eric

Abstract

Utilizing thin photoresist layers for successful pattern transfer has gained acceptance as the lithography process of record, primarily due to the incorporation of silicon-containing hardmask (HM) layers for added etching resistance. Our work includes understanding the impact of HfO2and ZrO2nanocrystal additives incorporated into spin-on HM materials. The goal is to quantify both etch selectivity and the improvements in the lithography process windows with the addition of HfO2nanocrystals into various types of polymers. Conventional 193-nm photoresists and spin-on carbon materials were selected as references for etch selectivity calculations. Results indicate there are process window advantages with improvements in the depth of focus (DOF) and overall pattern collapse margins. In addition, the ability to quantify line width roughness (LWR) as a function of resolution has been accomplished for these HM materials, and results show low levels of LWR are achievable. Overall lithography process margins are positive for DOF, exposure latitude (EL), LWR, and pattern collapse with the incorporation of HfO2-enhanced HM coatings for etch protection.

Published
2012
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