50 results on '"Gao, Li-Yin"'
Search Results
2. Effect of impurities on anisotropic grain growth in (111)-oriented nanotwinned copper
3. Micro-cones Cu fabricated by pulse electrodeposition for solderless Cu-Cu direct bonding
4. The mechanical property and microstructural thermal stability of gradient-microstructured nanotwinned copper films electrodeposited on the highly (111)-orientated substrates
5. Significant inhibition of interfacial Cu6Sn5 IMC and improvement of solder joint strength and reliability by applying (111) nanotwinned Cu substrate and vacuum soldering
6. Synthesis of Cu Nanowires by Template Electrodeposition and Their Application in Pressure Sensors
7. Study on the dual inhibition behavior of interfacial IMCs in Cu/SAC105/Cu joint by adopting SiC nanowires and nanocrystalline Cu substrate
8. Regulating the orientation and distribution of nanotwins by trace of gelatin during direct current electroplating copper on titanium substrate
9. Detrimental angle range between c axis of Sn crystal and electron flow for the electromigration reliability of ball grid array devices
10. Influence of macroscale dimension on the electrocrystallization of Cu pad and redistributed layer in advanced packaging
11. Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints
12. The effect of finish layer on the interfacial cracking failure of Au[sbnd]Si bonding
13. Gradient growth of fcc and bcc phase within FexNi1−x (50
14. Improving electromigration resistance of fine‐pitch redistributed layer (RDL) using graphene doped twinned copper composites
15. Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints
16. Extremely Low Contact Resistivity of Bi2Te3-Based Modules Enabled by NiP-Based Alloy Barrier
17. Micro-cones Cu fabricated by pulse electrodeposition for solderless Cu-Cu direct bonding
18. Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state
19. Characterization of Cu-Cu direct bonding in ambient atmosphere enabled using (111)-oriented nanotwinned-copper
20. Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate
21. Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package
22. The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage
23. Effects of additive interactions on electroplating profile of IC substrate copper pillars
24. Prospective application of nanotwinned copper for Damascene via filling and hybrid bonding
25. Copper electroplating of through silicon vias (TSV) using a series of nitrogen-containing heterocyclic compounds
26. Research Progress of Electroplated Nanotwinned Copper in Microelectronic Packaging
27. Extremely Low Contact Resistivity of Bi2Te3‑Based Modules Enabled by NiP-Based Alloy Barrier.
28. Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling
29. Effect of sodium thiazolinyl dithiopropane sulphonate (SH110) addition on electroplating nanotwinned copper films and their filling performance of fine-pitch redistributed layer (RDL)
30. 8-inch wafer-level electroplating of nanotwinned copper redistribution layer for advanced packaging
31. Thermal stability of electroplated Cu films with different microstructure by annealing treatment
32. The serving behavior of nanotwinned copper under the reliability test of high temperature high humidity and electromigration test
33. Effect of pulse off time on microstructure and properties of twinned copper films by pulse electrodeposition
34. The self-healing of Kirkendall voids on the interface between Sn and (1 1 1) oriented nanotwinned Cu under thermal aging
35. Electroplating Low Coercivity Nanocrystalline Fe-Ni Magnetic Cores for High Performance On-Chip Microinductor
36. Electroplating nanotwinned copper for ultrafine pitch redistribution layer (RDL) of advanced packaging technology
37. The effect of finish layer on the interfacial cracking failure of Au Si bonding
38. Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure
39. The electrochemical behavior of leveler JGB during electroplating of nanotwinned copper
40. The effect of transition layer on the strength of nanotwinned copper film by DC electrodeposition
41. Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder
42. Effect of applied magnetic field on the electroplating and magnetic properties of amorphous FeNiPGd thin film
43. Electrodeposition of anisotropic NiFe thin films for integrated high-frequency micro-inductor
44. Electrodeposition of nanotwinned copper film as under bump metallization
45. Diffusion Barrier Effect of Ni-W-P and Ni-Fe UBMs during High Temperature Storage
46. A superior interfacial reliability of Fe–Ni UBM during high temperature storage
47. Superior reliability of Fe-45Ni UBM in electromigration
48. Identification of IMCs at SAC/Fe-Ni interface during solid-state aging at 125°C
49. Clarification of Cu rich phase in SAC/FeNi solder joint
50. Extremely Low Contact Resistivity of Bi 2 Te 3 -Based Modules Enabled by NiP-Based Alloy Barrier.
Catalog
Books, media, physical & digital resources
Discovery Service for Jio Institute Digital Library
For full access to our library's resources, please sign in.