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Selective area growth (SAG) of gallium nitride (GaN) on silicon (Si) wafers efficiently relaxes the tensile stress that is generated in the GaN layer, when the structure is cooled down to room temperature after the growth. Hence, SAG enables the growth of thicker layers that are capable of operating at higher voltages than those grown in 2D layers. In this study, two GaN layers are grown by SAG on 200 mm-diameter Si(111) wafers by metal organic vapor phase epitaxy for the fabrication of pseudo-vertical p–n diodes. During the growth, the SiH4 precursor flow for the first sample was double than that for the second one. The uniformity of the doping concentration of the layers is investigated by scanning spreading resistance microscopy and the p- and n-type doped regions are examined by scanning capacitance microscopy. A low net doping concentration of 1.4 × 1016 cm−3 is extracted from capacitance–voltage measurements and a destructive breakdown occurs at 700 V for a 90 μm-diameter pseudo-vertical p–n diode. These results show the high potential of the SAG of GaN on Si wafers for vertical power devices. [ABSTRACT FROM AUTHOR]

The transformation of 2 ¯ 01 β - Ga 2 O 3 to h- GaN under exposure to RF nitrogen plasma was monitored in situ by reflection high-energy electron diffraction. Analysis of the reaction kinetics reveals that the nitridation process is initiated by the formation of an oxynitride phase and proceeds via two-dimensional nucleation and growth of wurtzite GaN grains. X-ray photoelectron spectra suggest a Ga − (N x O 1 − x) type configuration dominates the surface early in the nitridation process. The surface restructuring is followed by a diffusion-fed phase transformation, which propagates the wurzite GaN structure into the substrate upon reaching 70 % nitrogen anion site occupation, corresponding to the oxygen solubility in h - GaN. A direct correlation is observed between the nitridated film morphology and the epitaxial film crystallinity, demonstrating control of the residual strain, lateral coherence, and mosaicity in subsequent GaN epitaxy by the nitridation conditions. This study provides mechanistic details of the nitridation reaction of 2 ¯ 01 β - Ga 2 O 3 facilitating the optimization of the nitridation process toward improving GaN - 2 ¯ 01 β - Ga 2 O 3 heterojunctions. [ABSTRACT FROM AUTHOR]

We have performed a small-signal admittance analysis to extract trap parameters in an AlGaN/GaN high electron mobility transistor-on-Si. Whereas the admittance in the accumulation- and depletion-bias regimes is primarily due to the interface traps, the admittance near the threshold voltage and below is due to mono-energetic traps inside GaN. The density extracted for threading dislocation-related 1D traps at ≈ 0.22 eV below the GaN conduction band edge is similar to that previously reported by reverse-biased gate leakage analysis of the analyzed device. Our analysis suggests additional 1D traps of comparatively lower density ≈ 4 × 10 14 cm − 3 but considerably large capture cross section ≈ 8 × 10 − 14 cm 2 in the GaN layer at ≈ 0.31 eV below the conduction band. The AlGaN trap density is considerably larger near the AlGaN/GaN interface than in the bulk AlGaN. The AlGaN traps mainly contribute to the voltage stretch; their admittance contribution is negligible. Gate leakage dominates the conductance at lower frequencies. [ABSTRACT FROM AUTHOR]

Recently, deep-ultraviolet (DUV) light-emitting devices have attracted attention for various applications. GaN/AlN superlattices have emerged as a promising alternative for achieving high-efficiency DUV emission. To fabricate superlattices with high crystal quality and abrupt interfaces, we have utilized face-to-face-annealed sputter-deposited AlN template substrates characterized by a flat surface and low dislocation density. Furthermore, radio-frequency plasma-assisted molecular beam epitaxy with in situ reflection high-energy electron diffraction monitoring was employed for the growth process. The growth of the superlattices follows a specific sequence. Step 1: AlN growth, Step 2: conversion of Al droplets to AlN, Step 3: GaN growth, and Step 4: evaporation of Ga droplets. This study explored the impact of GaN thickness on the GaN/AlN superlattice. The GaN thickness was linearly controlled by changing the duration of Step 3. This approach allowed for the growth of a flat GaN layer up to 1 monolayer (ML) and achieved superlattices with abrupt interfaces. Single-peak cathodoluminescence (CL) emission at 240–245 nm was observed from the superlattices, with the peak shift toward longer wavelengths as the GaN thickness increased. In contrast, quantum dot-like GaN islands were generated with a thickness of over 1 ML, induced by compressive strain. Superlattices with thicker GaN exhibited broad CL emission with multiple peaks. However, the AlN barrier layer reduced the surface roughness and maintained abrupt interfaces within the superlattices. Therefore, to obtain sharp single-peak UV emission from GaN/AlN superlattices, the growth sequence should be controlled to obtain flat GaN layers without dots. [ABSTRACT FROM AUTHOR]

This study investigates the impact of biaxial strain on monolayer black phosphorus (BP) through first-principles calculations, confirming its stability and subsequently modifying its photocatalytic performance. Under biaxial strain, BP exhibits a direct bandgap suitable for photocatalytic hydrogen production during water splitting, albeit with limitations due to its valence band maximum edge. A distinctive GaN/BP heterojunction is proposed, featuring a direct bandgap and advantageous band edge positions conducive to efficient photocatalytic overall water splitting. Under the influence of biaxial strain, the heterojunction type undergoes a transition from direct type-I to direct type-II and Z, augmenting the separation of photoexcited electrons and holes and markedly enhancing the efficiency of photocatalytic hydrogen production. Furthermore, the heterojunction exhibits commendable capabilities in absorbing visible light. This research provides a promising avenue to surmount the constraints associated with monolayer BP in photocatalysis, offering valuable insights for the development of efficient photocatalytic materials. [ABSTRACT FROM AUTHOR]

An area-selectable Mg doping via ion implantation (I/I) is essential to realize gallium nitride (GaN) based power switching devices. Conventional post-implantation annealing forms considerable defects in the GaN, resulting in extremely low activation efficiency. The recent invention of ultrahigh-pressure annealing (UHPA) has substantially improved the p-type activation efficiency; however, the UHPA causes an unexpected Mg diffusion. Thus, both annealing processes resulted in a much lower Mg concentration in the GaN matrix than the Mg dose. In this study, the effect of a sequential N I/I for p-type Mg-implanted GaN was investigated by the correlative cathodoluminescence, transfer length method, scanning transmission electron microscopy, and atom probe tomography (APT) analyses. APT results have revealed that the sequential N I/I can successfully maintain the Mg concentration in the GaN matrix in the higher range of 1018 cm−3 or more. Our investigation suggests that sequential N I/I is a promising technique to maintain the Mg concentration higher and improve the p-type activation efficiency. [ABSTRACT FROM AUTHOR]

Distributed Bragg reflectors (DBRs) based on alternating layers of porous and non-porous GaN have previously been fabricated at the wafer-scale in heteroepitaxial GaN layers grown on sapphire substrates. Porosification is achieved via the electrochemical etching of highly Si-doped layers, and the etchant accesses the n+-GaN layers through nanoscale channels arising at threading dislocations that are ubiquitous in the heteroepitaxial growth process. Here, we show that the same process applies to GaN multilayer structures grown on silicon substrates. The reflectance of the resulting DBRs depends on the voltage at which the porosification process is carried out. Etching at higher voltages yields higher porosities. However, while an increase in porosity is theoretically expected to lead to peak reflectance, in practice, the highest reflectance is achieved at a moderate etching voltage because etching at higher voltages leads to pore formation in the nominally non-porous layers, pore coarsening in the porous layers, and in the worst cases layer collapse. We also find that at the high threading dislocation densities present in these samples, not all dislocations participate in the etching process at low and moderate etching voltages. However, the number of dislocations involved in the process increases with etching voltage. [ABSTRACT FROM AUTHOR]

Gallium nitride (GaN)- based lasers are extensively employed in display, lighting, and communication applications due to their visible laser emission. Despite notable advancements in their performance and reliability, sustained device functionality over extended periods remains a challenge. Among the diverse mechanisms contributing to degradation, the deterioration of quantum wells poses a persistent obstacle. In this study, we investigated the atomic-level degradation of quantum wells within GaN-based laser diodes utilizing atom probe microscopy. Our analysis revealed a substantial increase in indium fluctuation, accompanied by the formation of indium protrusions at the quantum well interfaces, which provides a credible explanation for the observed increase in FWHM (full width at half maximum) of the spontaneous spectra of lasers following prolonged operation. Additionally, magnesium analysis yielded no evidence of diffusion into the quantum well region. Combined with prior studies, we attribute the degradation of quantum wells primarily to the formation of indium-related non-radiative recombination centers. [ABSTRACT FROM AUTHOR]

III-nitride materials, such as GaN and its alloys, are essential for modern microelectronics and optoelectronics due to their unique properties. Focused ion beam (FIB) techniques play a crucial role in their prototyping and characterization at the micro- and nanoscale. However, conventional FIB milling with Ga ions presents challenges, including surface amorphization and point defect introduction, prompting the exploration of alternative ion sources. Xenon-based inductively coupled plasma or plasma FIB has emerged as a promising alternative, offering reduced damage and better sample property preservation. Despite extensive research on FIB-induced damage in GaN, systematic comparisons between Ga and Xe ion milling on the luminescence characteristics of GaN remain limited. This study aims to fill this gap by evaluating and comparing the extent of FIB-induced damage caused by Ga and Xe ions in wurtzite and zincblende GaN through cathodoluminescence measurements. Our findings indicate that Xe ion milling yields higher integrated intensities compared to Ga ion milling, attributed to shallower implantation depths and reduced lattice disorder. We also observe a decrease in integrated intensity with increasing ion beam acceleration voltage for both wurtzite and zincblende GaN layers. This study provides valuable insights into optimizing FIB-based sample preparation techniques for III-nitride materials, with implications for enhancing device performance and reliability. [ABSTRACT FROM AUTHOR]

Traditional LEDs emit light that exhibits incoherence and displays a Lambertian distribution. To achieve linearly polarized (LP) light and control the emission direction, a variety of optical components are required to be stacked, which is unsuitable for compact applications and results in low deflection efficiency. Here, we propose and and numerically simulate a novel single-chip micro-resonant cavity LED (micro-RCLED) device that generates directional LP light by integrating a continuous metasurface. This device includes a bilayer grating at the GaN layer's bottom, providing high transverse electric (TE) reflectivity above 89.5% and an extinction ratio exceeds 57 dB at 500 nm. The top distributed Bragg reflector (DBR) and the bilayer grating together constitute a TE mode Fabry–Pérot resonant cavity. This not only promotes the emission of the TE wave, but also guarantees its collimation with the appropriate phase, thereby enhancing its spatial coherence. A functional metasurface above the DBR layer precisely controls the TE wave's deflection angle. It maintains a low aspect ratio while enabling efficient, large-angle deflection. The simulation results demonstrate that this device provides an effective solution for generating highly spatially coherent directional LP light, with broad potential applications in fields such as polarized light imaging and advanced 3D micro-LED display systems. [ABSTRACT FROM AUTHOR]

A novel high-power AlGaN/GaN heterojunction lateral photoconductive semiconductor switch (PCSS) based on the SiC substrate is proposed, which achieves high dark-state resistance characteristics by groove etching. Under the action of biased electric field and incident laser, a high concentration of two-dimensional electron gas is formed at the heterojunction interface. The photo-generated free carriers transport along the heterojunction interface, which improves the utilization efficiency of photo-generated carriers. Moreover, the simulation of the current density distribution of the PCSS provides theoretical support for this phenomenon. Compared with the conventional GaN PCSS, the power capacity and conduction characteristics are further improved. The test results show that the output current of the device increases significantly after the introduction of the AlGaN/GaN heterojunction. At the biased voltage of ∼34 kV, the maximum output current of the AlGaN/GaN PCSS reaches 205 A. [ABSTRACT FROM AUTHOR]

Position-dependent three-dimensional reciprocal space mapping (RSM) by nanobeam x-ray diffraction (nanoXRD) was performed to reveal the strain fields produced around individual threading dislocations (TDs) in GaN substrates. The distribution and Burgers vector of TDs for the nanoXRD measurements were confirmed by prerequisite analysis of multi-photon excited photoluminescence and etch pit methods. The present results demonstrated that the nanoXRD can identify change in the lattice plane structure for all types of TDs, i.e., edge-, screw-, and mixed TDs with the Burgers vector of b = 1a, 1c and 1m + 1c. Strain tensor components related to edge and/or screw components of the TDs analyzed from the three-dimensional RSM data showed a nearly symmetrical strained region centered on the TD positions, which were in good agreements with simulation results based on the isotropic elastic theory using a particular Burgers vector. The present method is beneficial in that it allows non-destructive analysis of screw components of TDs that tend to contribute to leakage characteristics and are not routinely accessible by conventional structural analysis. These results indicate that nanoXRD could be a powerful way to reveal three-dimensional strain fields associated with arbitrary types of TDs in semiconductor materials, such as GaN and SiC. [ABSTRACT FROM AUTHOR]

This work reports analysis of the reverse-bias breakdown characteristics of homojunction gallium nitride (GaN) p–i–n (PIN) rectifiers fabricated on bulk GaN substrates. Sub-bandgap photoluminescence mapping at room temperature as a contactless, non-destructive wafer inspection method was performed to analyze the impact of material properties on grown GaN PIN diodes and to study the correlation between defect types and breakdown characteristics of vertical GaN PIN rectifiers. Under the sub-bandgap excitation, yellow luminescence is dominant. The premature breakdown characteristics of the fabricated kV-class vertical GaN PIN rectifiers with nitrogen-implanted floating guard rings are found to be associated with material defects and deep level complexes. Photoluminescence mapping has demonstrated its effectiveness in quantitative analysis of dislocations and other types of defects. [ABSTRACT FROM AUTHOR]

We report the design, fabrication, and measurement of the field emission (FE) characteristics of AlGaN/GaN nanoscale lateral vacuum diodes with triangular cathodes and cathode to anode spacings from 50 to 600 nm. The FE characteristics of the AlGaN/GaN diodes with metallic or AlGaN/GaN anodes show successful rectification with forward bias FE current in the range of microamperes or milliamperes, respectively, when biased within a maximum range varying from 10 to 30 V. In the forward bias mode, the measured current I m vs applied anode to cathode bias V m are well fitted to Murphy–Good profiles associated with FE at higher biases, and an Ohmic leakage profile below the threshold for FE. Our results are the first successful demonstration of FE of electrons between the two two-dimensional electron gases (2DEGs) present on both sides of a nanogap formed by electron lithography through an AlGaN/GaN heterojunction. A qualitative explanation of the loop-type FE characteristics of both AlGaN/GaN vacuum diodes, with either metallic or AlGaN/GaN anodes, is presented. [ABSTRACT FROM AUTHOR]

Unscreened (ungated) plasmons in large-area grating-gate AlGaN/GaN heterostructures were studied experimentally by Fourier-transform spectroscopy. Special attention was paid to the recently discovered THz plasmonic crystal modes observed at totally depleted gated regions when plasma oscillations were localized only in ungated parts of the grating-gate structures. The frequency of these modes is still gate voltage-dependent in the limited range due to the depletion of the ungated parts located close to the gate edges. Double gate structures with an additional bottom gate were fabricated and studied to improve the gate voltage tunability of the unscreened plasmons. Since this gate is located deep below the channel, the plasmons behaved as ungated ones, but their frequency still could be tuned by this bottom gate. We show that the combined effect of the top and bottom gates allows the efficient tuning of terahertz frequencies of unscreened modes in the grating-gate AlGaN/GaN plasmonic crystals. [ABSTRACT FROM AUTHOR]

For rooting the development of GaN-based optoelectronic devices, understanding the roles of midgap recombination centers (MGRCs), namely, nonradiative recombination centers and deep-state radiative recombination centers, on the carrier recombination dynamics is an essential task. By using the combination of time-resolved photoluminescence and positron annihilation spectroscopy (PAS) measurements, the origins of major MGRCs in the state-of-the-art GaN epilayers, bulk crystals, and Mg-implanted layers were identified, and their concentrations were quantified for deriving the capture coefficients of minority carriers. In this article, potential standardization of the room-temperature photoluminescence lifetime for the near-band-edge emission (τ PL RT ) as the concentration of major MGRCs well below the detection limit of PAS is proposed. For n-GaN substrates and epilayers grown from the vapor phase, τ PL RT was limited by the concentration of carbon on N sites or divacancies comprising a Ga vacancy (VGa) and a N vacancy (VN), [VGaVN], when carbon concentration was higher or lower, respectively, than approximately 1016 cm−3. Here, carbon and VGaVN act as major deep-state radiative and nonradiative recombination centers, respectively, while major MGRCs in bulk GaN crystals were identified as VGa(VN)3 vacancy clusters in Na-flux GaN and VGa or VGaVN buried by a hydrogen and/or VGa decorated with oxygen on N sites, VGa(ON)3–4, in ammonothermal GaN. The values of τ PL RT in n-GaN samples are compared with those of p-GaN, in which τ PL RT was limited by the concentration of VGa(VN)2 in Mg-doped epilayers and by the concentrations of VGaVN and (VGaVN)3 in Mg-implanted GaN right after the implantation and after appropriate activation annealing, respectively. [ABSTRACT FROM AUTHOR]

Gallium nitride (GaN) and aluminum nitride (AlN), as examples of third-generation semiconductors, have attracted significant interest due to their remarkable physical attributes, including a wide bandgap, high breakdown voltage, exceptional chemical stability, and high thermal conductivity. These characteristics render GaN and AlN highly promising for use in power and (opto)-electronic devices. Consequently, there is a growing demand for high-quality GaN and AlN crystals on the centimeter scale. As the dislocation density in these materials decreases, the need for a reliable method of dislocation characterization becomes more pressing. Synchrotron radiation x-ray topography (SR-XRT) has emerged as a superior, nondestructive technique for the precise characterization of crystal defects. This review briefly introduced the principle of XRT, and its application in the analysis of dislocations in GaN and AlN crystals is summarized. By examining the relationship between the SR-XRT image contrast and the Burgers vectors of dislocations, it is possible to categorize wafer dislocations and determine the magnitude and direction of Burgers vectors. Additionally, SR-XRT facilitates the analysis of interactions between dislocations in GaN and AlN crystals. These analyses are instrumental in advancing the development of superior crystals. This review concludes with a discussion of the current challenges faced by SR-XRT and a projection of its future applications in characterizing third-generation semiconductor crystal materials. This review offers significant guidance for the characterization of nitride crystal defects using SR-XRT. [ABSTRACT FROM AUTHOR]

This paper provides a comprehensive study of the impact of the gate recess depth (RD) on the GaN-on-Si MOS-HEMTs DC performances. IDS = f(VGS) and IDS = f(VDS) measurements are conducted at 25 and 150 °C, respectively, in forward and blocking modes. The gate recessed depth (50, 150, and 350 nm) is modulated by adjusting the plasma etching time, which is a critical step for improving the dielectric/GaN interface quality and the gate channel electron mobility. Three distinct regions can be defined separately: the bottom, the sidewall, and the corner region being the junction between the two previous regions. To assess the impact of gate recessed depth (RD) on the several mobilities around the gate cavity first, we applied our previous methodology allowing us to extract the bottom (μbot) and the entire sidewall region mobility (μT), without distinction from the corner. The mobility of the transverse region was found surprisingly to increase with deeper RD. To gain insight into the impact of the RD on this transverse section, a new extraction methodology is proposed to extract separately the gate corner (μcorner) and sidewall (μSW) mobility. These extractions show that the corner mobility is found to be reduced compared to the sidewall one (μcorner < μSW) evidencing the different weighting contributions over the transverse mobility. Moreover, these mobilities are found to be more degraded compared to the bottom one, highlighting the different contributions on the on-state resistance (RON). Indeed, the on-state resistance is lowered with the shallower RD due to the reduced sidewall resistance contribution (lower sidewall length) and despite the incremental contribution of the bottom resistance (larger effective gate length). However, the shallower RD shows an increase in the drain–source leakage current in reason of a lower gate electrostatic control. Technology Computer Aided Design (TCAD) simulations of the three RD morphologies are carried out to validate the experimental trends and the proposed methodology. [ABSTRACT FROM AUTHOR]

The spontaneous formation of a Ga-oxide (GaO x ) intermediate layer at the GaN/SiO 2 interface has been reported during the SiO 2 deposition on the GaN substrate. In this study, we have performed first-principles calculations and unveiled atomic and electronic structures of the GaN/SiO 2 interface with 1-nm thick GaO x intermediate layer. Our calculations show that the top-layer Ga atoms on the GaN side are terminated with the O atoms on the GaO x side, leading to the clean GaN/GaO x interface and the absence of the electronic state in the midgap region. However, strongly localized states, which are originated from O atoms lone-pair orbitals in the –GaOSi– local structures, emerge in the gap near the valence-band maximum of GaN. These in-gap states become hole traps in GaN MOS devices, leading to a degradation in device controllability and operational speed. [ABSTRACT FROM AUTHOR]

In this study, the piezoelectric properties of scandium-alloyed gallium nitride (ScGaN), which is expected to be applied to microelectromechanical systems devices, are evaluated by first-principles calculations. The piezoelectric constant (d33) of GaN is found to increase by up to approximately 30 times upon the addition of 62.5 mol. % of Sc. The piezoelectric stress constant (e33) increases and the elastic constant (C33) decreases with increasing Sc content of ScGaN, driving the rise of d33. The improved piezoelectric properties of ScGaN compared with those of GaN are largely attributed to elastic softening, which is thought to be related to the transition from a wurtzite to hexagonal boron nitride (h-BN) structure driven by the change in bonding states between atoms caused by the addition of Sc to GaN. The crystal orbital Hamilton population analysis suggests that addition of Sc to GaN results in the combination of weaker Sc–N and Ga–N bonding, which makes the crystal structure unstable. This weakened bonding is thought to be the main cause of the destabilization of the wurtzite structure and transition to the h-BN structure of ScGaN. The elastic softening associated with this structural transition leads to the dramatic improvement in piezoelectric properties. [ABSTRACT FROM AUTHOR]

Photoluminescence from GaN implanted with Cd or Hg ions was studied and compared with first-principles calculations. In Cd-implanted GaN, the blue band (BLCd) with a maximum at 2.7 eV is attributed to the CdGa acceptor with an ionization energy of 0.55 eV. In Hg-implanted GaN, the green band (GLHg) with a maximum at 2.44 eV is attributed to the HgGa acceptor with an ionization energy of 0.77 eV. The shapes of the BLCd and GLHg bands are asymmetric, with a similar Franck–Condon shift of about 0.28 eV. The electron- and hole-capture coefficients for the CdGa and HgGa acceptors are found. The experimentally found parameters agree reasonably well with first-principles calculations using HSE hybrid functional satisfying the generalized Koopmans' theorem. [ABSTRACT FROM AUTHOR]

In this work, the value and the polarity of the spontaneous and piezoelectric polarization have been investigated, as the use of two different reference structures for wurtzite-type group-III nitrides, namely, the zinc-blende and the layered-hexagonal crystal lattice, have resulted in different predictions. It was found that although the differences in value and polarity of the polarization for heterostructures such as wurtzite Al1−xScxN/GaN lead to similar interface sheet charges, a significant mismatch is observed when polarization reversal is considered. The interface sheet charge predicted before and after the polarization reversal in the wurtzite Al1−xScxN layer on GaN using the zinc-blende lattice as a reference predominantly shows a change in sign. When using the layered-hexagonal lattice as a reference, not only is the same polarity of the interface sheet charge maintained after polarization reversal, but it is even 30 times larger. In this case, the giant and positive spontaneous polarization values for metal-polar Al1−xScxN extracted from the ferroelectric switching, as well as the alignment of the piezoelectric polarization to it, were observed to be consistent with the predictions referenced to the layered-hexagonal lattice. Thus, it is concluded that the layered-hexagonal reference is not only more suitable for predicting the ferroelectric properties of wurtzite Al1−xScxN but should also be the correct reference when considering polarization reversal in heterostructures. If the significant increase in the interface sheet charge after polarization reversal is experimentally detected, it will allow the design and fabrication of novel devices for future high-frequency and power electronics applications. [ABSTRACT FROM AUTHOR]

We used photoluminescence (PL) spectroscopy and first-principles calculations to investigate GaN doped with Mg, Be, and implanted with Ca. The PL spectra revealed distinct red emission bands (RLA, where A = Be, Mg, and Ca) with maxima between 1.68 and 1.82 eV, each associated with a specific impurity. These bands consistently appeared alongside the green GL2 PL band at 2.33 eV, attributed to nitrogen vacancy (VN). Our calculations suggest that these bands result from recombination via defect complexes of group-II acceptors substituting for Ga with VN (AGaVN, A = Be, Mg, and Ca). The experimental + / 0 transition levels for these complexes were estimated to be 0.6, 0.8, and 1.0 eV above the valence band maximum for Mg-, Be-, and Ca-containing complexes, respectively. The radiative recombination is facilitated by excited donor states located close to the conduction band minimum. Furthermore, our theory predicts that ZnGaVN and CdGaVN are stable and possess similar properties, although, no PL was detected from these defect complexes. The presented findings shed light on the identity of compensating donor complexes that impede the efficiency of p -type doping in GaN. [ABSTRACT FROM AUTHOR]

A novel bilateral impact-ionization-avalanche-transit-time (BIMPATT) diode based on AlGaN/GaN two-dimensional electron gas is proposed in this article. The BIMPATT is compatible with the available GaN high electron mobility transistor (HEMT) manufacturing process and has a shorter actual electron transit distance than existing HEMT-like IMPATT (HIMPATT) diodes. Compared with the same-sized HIMPATT, the optimum frequency of BIMPATT rises from 320 to 420 GHz and possesses a far wider operating frequency band, especially in the near 0.9 THz range. The maximum DC-RF conversion efficiency rises from 12.9% to 17.6%. The maximum RF power of BIMPATT is 3.18 W/mm, which is similar to 3.12 W/mm of the HIMPATT. Furthermore, our simulation demonstrated that the characteristics of BIMPATT are significantly affected by the length of anode and the thickness of the AlGaN barrier layer. The effects of ohmic contact resistance and background impurities on BIMPATT are also taken into account. This paper provides a reference for the design and characteristics enhancement of the lateral IMPATT devices. [ABSTRACT FROM AUTHOR]

Nonvolatile memory using intersubband transitions and quantum-well electron accumulation in GaN/AlN resonant tunneling diodes (RTDs) is a promising candidate for high-speed nonvolatile memory operating on a picosecond timescale. This memory has been fabricated on sapphire(0001) substrates to date because of the high affinity between the nitride materials and the substrate. However, the fabrication of this memory on Si(111) substrates is attractive to realize hybrid integration with Si devices and nonvolatile memory and three-dimensional integration such as chip-on-wafer and wafer-on-wafer. In this study, GaN/AlN RTDs are fabricated on a Si(111) substrate using metal-organic vapor phase epitaxy. The large strain caused by the differences in the thermal expansion coefficients and lattice constants between the Si(111) substrate and nitride materials are suppressed by a growth technique based on the insertion of low-temperature-grown AlGaN and thin AlN layers. The GaN/AlN RTDs fabricated on Si(111) substrates show clear GaN/AlN heterointerfaces and a high ON/OFF ratio of >220, which are equivalent to those for devices fabricated on sapphire(0001) substrates. However, the nonvolatile memory characteristics fluctuate by repeated write/erase memory operations. Evaluation of the ON/OFF switching time and endurance characteristics indicates that the instability of the nonvolatile memory characteristics is caused by electron leakage through deep levels in the quantum-well structure. Possible methods for suppressing this are discussed with an aim of realizing high-speed and high-endurance nonvolatile memory. [ABSTRACT FROM AUTHOR]

In this paper, the p-GaN gate AlGaN/GaN high electron mobility transistors (HEMTs) with varying combinations of gate metal work function and gate geometry are fabricated and investigate the influence of gate leakage current (IGS) on the threshold voltage (VTH) and subthreshold swing (SS). The unique dependence of VTH and SS on gate geometry for different metals is observed, which is different from traditional field-effect transistors. A novel hybrid physics model, consisting of the traditional capacitance divider model and hole injection model, is proposed to explain this phenomenon, and the results exhibit an excellent agreement with the experimental data. The holes traverse the gate/p-GaN Schottky barrier by thermal emission or tunneling and inject into the p-GaN layer, generating the IGS. Expanding upon the traditional capacitance divider model, a portion of the injected holes accumulate at the p-GaN/AlGaN interface and induce the corresponding electrons at the AlGaN/GaN heterojunction, which promotes channel conduction. Hence, the transfer curves display the correlation between IGS and VTH as well as SS. The results show that high IGS can alleviate the instability of VTH caused by the lithographic overlay error, and simultaneously optimize SS. This work offers a novel perspective for examining the turn-on mechanism of p-GaN HEMTs, thereby contributing to device design. [ABSTRACT FROM AUTHOR]

Sc0.18Al0.82N/GaN with state-of-the-art x-ray diffraction figures of merit grown by metal modulated epitaxy under metal-rich conditions and a low substrate temperature of 400 °C is demonstrated to have improved crystalline order [250 arc sec for the (0002) reflection and 469 arc sec for the (10 1 ¯ 5)] compared to a previous state-of-the-art sample grown at a more conventional temperature of 650 °C. While both samples show a columnar structure, the higher substrate temperature sample has a good symmetric rocking curve (RC) of 229 arc sec, but unlike the lower temperature sample, the RC of the (10 1 ¯ 5) asymmetric reflection could not be measured, indicating a more columnar structure common among ScAlN films. Local lattice constant maps (LLCMs) from 4D-STEM depict abrupt strain relaxation within ∼2 nm from the ScAlN/GaN interface for the sample grown at Tsub = 400 °C. Since these LLCMs suggest a lattice mismatch in the a-lattice constant, and since the films show a sudden roughening, the composition for lattice match to GaN may be less than the accepted 18%–20% Sc, consistent with the average GaN lattice match from lattice constant values reported in the literature of 12%. Compared to traditional III-Nitrides, ScAlN films have substantially more screw and mixed-type threading dislocations, suggesting substantial shear forces that result in significant twist and distortion leading to orthorhombic diffraction patterns as viewed from plan-view TEM in the Tsub = 650 °C sample. These results offer the possibility of ScAlN integration into low-thermal-budget processes including CMOS but further indicate that structural understanding of ScAlN remains lacking. [ABSTRACT FROM AUTHOR]

The recently demonstrated semiconductor grafting approach allows one to create an abrupt, low interface-trap-density heterojunction between a high-quality p-type single-crystalline semiconductor (non-nitrides) with n-type GaN. However, due to the surface band-bending from GaN polarization, an energy barrier exists at the grafted heterojunction, which can impact the vertical charge carrier transport. Reducing the energy barrier height is essential for some advanced device development. In this work, we employed UV/O3 and O2 plasma to treat a Ga-polar GaN surface with/without an ultrathin (∼2 nm) ALD-Al2O3 coating and studied the effects of the treatments on surface band-bending. Through XPS measurements, it was found that the treatments can suppress the upward band-bending of the Ga-polar GaN by 0.11–0.39 eV. The XPS results also showed that UV/O3 treatment is an effective surface cleaning method with little surface modification, while O2 plasma causes a strong oxidation process that occurs inside the top layer GaN. [ABSTRACT FROM AUTHOR]

This review concentrates on the microstructure of InxGa1−xN layers and quantum wells (QWs) in relation to their optical properties. The microstructure of InxGa1−xN, with a constant In(x) concentration, shifts with layer thickness. Only layers below 100 nm for x = 0.1 are nearly defect-free. A photoluminescence peak is observed at 405 nm, in line with ∼10% In, suggesting band-edge luminescence. Layers with greater thickness and In content present a corrugated surface with numerous structural defects, including V-defects, causing redshifts and multi-peaks in photoluminescence up to 490 nm. These defects, resembling those in GaN, lead to a corrugated sample surface. Atomic force microscopy shows a 3.7-fold larger corrugation in samples with 20 QWs compared to those with 5 QWs measured on 2 × 2 μm2 areas. Like in GaN, dual growth on different crystallographic planes results in varied QW thicknesses, influencing optical traits of devices made from InxGa1−xN layers. The purpose of this review and the chosen subject is to highlight the significant contribution of Wladek Walukiewicz and his group to the current research on the properties of InxGa1−xN, which are crucial alloys in the field of optoelectronics. [ABSTRACT FROM AUTHOR]

GaN/AlxGa1−xN quantum wells were grown by molecular beam epitaxy on high quality bulk (0001) GaN substrates. The quantum well thickness was set in the 6–8 nm range to favor the photoluminescence emission of indirect excitons. Indeed, such excitons are known to be spatially indirect due to the presence of the internal electric field which spatially separates the electron and hole wave functions. The growth conditions were optimized in view of minimizing the photoluminescence peak broadening. In particular, the impact of growth temperature (up to 900 °C) on the surface morphology, structural, and photoluminescence properties was studied. The diffusion of indirect excitons on the scale of tens of micrometers was measured with a micro-photoluminescence setup equipped with a spatially resolved detection. A dedicated model and its analysis allow us to extract from these measurements the exciton diffusion constant and to conclude on the optimum growth conditions for the GaN/AlxGa1−xN quantum well structures suited for studies of quantum collective effects in indirect exciton liquids. [ABSTRACT FROM AUTHOR]

Annealing Mg-implanted homoepitaxial GaN at temperatures above 1400 °C eliminates the formation of inversion domains and leads to improved dopant activation efficiency. Extended defects, in the form of inversion domains, contain electrically inactive Mg after post-implantation annealing at temperatures as high as 1300 °C (one GPa N2 overpressure), which results in a low dopant activation efficiency. Triple-axis x-ray data reveal that implant-induced strain is fully relieved after annealing at 1300 °C for 10 min, indicating that strain-inducing point defects formed during implantation have reconfigured and inversion domains are formed. However, annealing at temperatures of 1400–1500 °C (one GPa N2 overpressure) eliminates the presence of the inversion domains. While residual defects, such as dislocation loops, still exist after annealing at and above 1400 °C, chemical analysis at multiple dislocation loops shows no sign of Mg segregation. Meanwhile, an overall decreasing trend in the dislocation loop density is observed after annealing at the higher temperatures and longer times. Additionally, once inversion domains are formed and the samples are cooled to room temperature, they are shown to dissolve with subsequent annealing above 1400 °C. While such defects have been observed before, the important finding that such defects can be dissolved with a short, higher temperature step is key. Earlier work [Breckenridge et al., J. Appl. Phys. Lett. 118, 022101 (2021)] addressing electrical measurements of these types of samples showed that annealing at 1400 °C leads to a dopant activation efficiency that is an order of magnitude higher than that observed at 1300 °C. This work complements earlier work by identifying the inversion domains, which incorporate Mg, and points to the benefits, in terms of defect density and p-type dopant activation, of using higher temperature (>1400 °C) annealing cycles to activate Mg in GaN, even if the Mg-containing inversion domains had been formed during lower temperature annealing. [ABSTRACT FROM AUTHOR]

Thermal issue has been regarded as one of the bottlenecks for GaN high-electron-mobility transistor (HEMT) performance and reliability, which highlights the importance of accurate thermal modeling. In the present work, we propose a GP (Gaussian process)-resistor–capacitor compact thermal model integrated with the ensemble Kalman filter (EnKF) to handle the nonlinear problems attributed to the temperature-dependent properties of GaN HEMTs under large-signal working conditions. The GP predictor is employed for the nonlinear correction term, with strong ability and extendibility to characterize various temperature-dependent relations resulting from different design configurations and materials. The model is identified via the EnKFs by inputting a sequence of channel temperature oscillations induced by imposing a large-signal continuous wave heating source to the device. Furthermore, an adaptation mode is devised for the in situ and timely update of the model parameters to adapt to the thermal variability of GaN devices, avoiding storing a large amount of historical data and repeated offline regressions. The validation of our modeling scheme is conducted through the case study on GaN-on-SiC HEMT's detailed 3D finite element method simulations. [ABSTRACT FROM AUTHOR]

In this paper, we report an analysis of reverse current mechanisms observed in GaN Schottky barrier diodes leading to hysteretic behavior of the I–V curves at low temperature. By means of DC measurements from 33 to 475 K, we demonstrate the presence of two leakage mechanisms when comparing the experiments with the results obtained using a unified model to predict the ideal reverse current of the diode. Poole–Frenkel emission is the dominant mechanism for temperatures above 200 K, while trap-assisted tunneling prevails for lower temperatures, where also, hysteresis cycles are revealed by means of DC dual-sweep voltage measurements. The energy of the corresponding traps has also been determined, being around 0.2 and 0.45 eV, respectively. The hysteresis phenomenon is attributed to the bias-induced occupancy of the energy states originating the leakage-current processes, which leads to the reduction of the reverse current after a high negative voltage is applied to the diode. [ABSTRACT FROM AUTHOR]

We have analyzed and modeled the reverse-biased gate leakage current in a Schottky-gate AlGaN/GaN high electron mobility transistor. While the Poole–Frenkel emission current along conductive threading dislocations dominates at low negative gate bias, the trap-assisted tunneling of thermally energized electrons and the thermal emission of electrons from threading dislocations aided by dislocation-related states at multiple energy levels within the AlGaN bandgap are dominant at moderate to large reverse bias. Additionally, deep trap levels of high density localized near the gate/AlGaN interface cause significant leakage at 473 K at low to moderate reverse bias, which could be specific to the device we have analyzed. We extracted about 10 12 cm − 2 traps near the AlGaN/GaN interface from the difference of the barrier layer electric field profile obtained from the experimental high-frequency capacitance–gate voltage and the one needed for final matching. The thermionic- and the thermionic field-emission currents are considerably low; the latter, however, dominates in the defect-free case. Finally, the simulation framework we developed here helped us identify various conduction mechanisms contributing to the reverse-biased gate leakage and the density and electronic structure of the responsible defects. [ABSTRACT FROM AUTHOR]

The anisotropic hole transport along [0001] and [11 2 ¯ 0] in the p-doped (10 1 ¯ 0) GaN layer was compared for layers grown on bulk (10 1 ¯ 0) GaN substrates and on (10 1 ¯ 0) sapphire. The sheet resistance along [0001] was 1.1 times larger on GaN substrates and even 1.2 times larger on sapphire than that along [11 2 ¯ 0]. The anisotropic hole transport on bulk GaN substrates is due to the anisotropy of the hole's effective mass and the different contribution of carriers in different bands, whereas the larger anisotropy for GaN on sapphire is also due to additional scattering at stacking faults. The annealing process of metal Mg applied to the m-plane p-type GaN successfully results in a robust p-type ohmic contact, functioning as a p + + layer. [ABSTRACT FROM AUTHOR]

Understanding the interfacial phonon transport is essential for optimizing the thermal management of microelectronics, especially for high energy density devices. Some calculations have suggested that introducing interfacial defects or disorders will increase the interfacial thermal conductance, which helps heat dissipation, while some studies suggested otherwise. In this work, we introduced substitutional impurities in GaN by growing a ∼2-nm-thick AlxGa1−xN or InxGa1−xN alloyed interlayer at the Al/GaN interface and measured the interface thermal conductance by time-domain thermoreflectance at room temperature. Our results show that substituting Ga atoms near the interface with either lighter Al atoms or heavier In atoms at a nominal concentration of 20% or less will not necessarily change the thermal conductance of the Al/alloy interface but is detrimental to the thermal transport across the total Al/GaN interface, which provides an experimental guideline for the thermal design of GaN-based devices. [ABSTRACT FROM AUTHOR]

Strain plays an important role in the performance and reliability of AlGaN/GaN high electron mobility transistors (HEMTs). However, the impact of strain on the performance of proton irradiated GaN HEMTs is yet unknown. In this study, we investigated the effects of strain relaxation on the properties of proton irradiated AlGaN/GaN HEMTs. Controlled strain relief is achieved locally using the substrate micro-trench technique. The strain relieved devices experienced a relatively smaller increase of strain after 5 MeV proton irradiation at a fluence of 5 × 1014 cm−2 compared to the non-strain relieved devices, i.e., the pristine devices. After proton irradiation, both pristine and strain relieved devices demonstrate a reduction of drain saturation current (Ids,sat), maximum transconductance (Gm), carrier density (ns), and mobility (μn). Depending on the bias conditions the pristine devices exhibit up to 32% reduction of Ids,sat, 38% reduction of Gm, 15% reduction of ns, and 48% reduction of μn values. In contrast, the strain relieved devices show only up to 13% reduction of Ids,sat, 11% reduction of Gm, 9% reduction of ns, and 30% reduction of μn values. In addition, the locally strain relieved devices show smaller positive shift of threshold voltage compared to the pristine devices after proton irradiation. The less detrimental impact of proton irradiation on the transport properties of strain relieved devices could be attributed to reduced point defect density producing lower trap center densities, and evolution of lower operation related stresses due to lower initial residual strain. [ABSTRACT FROM AUTHOR]

Control over the two-dimensional electron gas (2DEG) in AlGaN/GaN heterostructures is crucial for their practical applications in current semiconducting devices. However, the oxide surface structures inducing 2DEG are still ambiguous because oxide-stoichiometry (OS) matching structures possess occupied surface donor states at 1.0–1.8 eV below the conduction band minimum of bulk but are usually not available in energy than electron counting (EC) rule structures. In this work, a global optimization algorithm was introduced to explore the possible oxidation structures on GaN (0001) and AlN (0001) surfaces; the method was demonstrated to be available due to the fact that the reported oxidized structures were reproduced at each stoichiometry. Interestingly, the two similar oxide structures with close energy were found in each oxide-bilayer, which can be used to clarify the experimental observations of disordered surface oxide layers below 550 °C. Additionally, new stable oxidation structures with low surface energy were proposed. Interestingly, the new OS matching structures are proposed with remarkably lower energy than EC rule structures under cation-rich and oxygen-poor conditions, which is caused by the large formation enthalpy of Al2O3 and Ga2O3. Further electronic structure calculations demonstrate that the new OS structures possess highest occupied states above the half of the gap and are the origin of 2DEG in AlGaN/GaN heterostructures. [ABSTRACT FROM AUTHOR]

Pt/GaN Schottky barrier diodes and GaN epitaxial layers on sapphire substrates were studied under swift heavy ion irradiation using 100 MeV O7+ ions having fluences in the range of 1 × 1010–6.4 × 1013 ions/cm2. It was observed that ideality factor, Schottky barrier height, and series resistance increased, while carrier concentration decreased with increasing ion fluence. The ex situ measurements, such as x-ray diffraction and UV–Vis spectroscopy, revealed that GaN layers exhibit negligible variation in structural and bandgap characteristics after irradiation with oxygen ions. The cross-sectional transmission electron microscopy images of the GaN epitaxial layer irradiated at 5 × 1012 ions/cm2 confirmed the absence of irradiation-induced tracks or defect clusters, indicating only point defects that can act as charge traps without structural damage. [ABSTRACT FROM AUTHOR]

In this study, the ungated AlGaN/GaN devices with special mesa structures were designed. The hypothesis of effective width expansion was tested experimentally by using ungated samples with different sizes, and an empirical expression for calculating the conduction channel effective width was given according to the experimental results. Finally, split-gate AlGaN/GaN heterostructure field-effect transistors (HFETs) with different gate lengths were prepared, and the channel electron mobility of split-gate samples was calculated by using the empirical expression and polarization Coulomb field (PCF) scattering theoretical model. The results showed that, for split-gate AlGaN/GaN HFETs, with the increase in the gate length, the total amount of additional polarization charges underneath the gate increases, resulting in the enhancement of the PCF scattering intensity. [ABSTRACT FROM AUTHOR]

The formation of a two-dimensional electron gas (2DEG) at the GaN (0001)/AlN interface holds significant implications for GaN-based high-voltage and high-frequency (RF) devices. Due to the promising results provided by the addition of a thin layer of AlN in metal–oxide-semiconductor channel high-electron-mobility transistor devices, this interface can be found in both the access region and near the dielectric gate. Recent ab initio simulations shed light on the crucial role played by spontaneous and piezoelectric polarizations within polar GaN and AlN crystals in driving the formation of the 2DEG. This study explores the underlying mechanisms behind the 2DEG formation and investigates the impact of fixed charges and additional layers, like Al 2 O 3 , on the carrier concentration. Consistent with the literature, our findings highlight the predominant role of polarizations within III–V materials in the formation of the 2DEG. Moreover, we examine the influence of fixed charges on the AlN surface, revealing their ability to accumulate or deplete the 2DEG, while maintaining charge conservation through the emergence of a new two-dimensional charge gas on the AlN surface. Additionally, we explore the effects of incorporating a β -Al 2 O 3 crystal layer on the GaN/AlN structure, finding that the 2DEG's carrier density is reduced, yet not entirely eliminated, while a significant positive charge concentration at the AlN/Al 2 O 3 interface pins the Fermi level. This comprehensive investigation contributes to our understanding of microscopic phenomena in III–V heterostructures, paving the way for future advancements and applications in power electronics. [ABSTRACT FROM AUTHOR]

We investigated the thermal stability and performance of AlGaN/AlN/GaN Hall-effect sensors under industry-relevant atmospheric conditions. The thermal stability and performance of Hall sensors are evaluated by monitoring Hall sensitivity, two-dimensional electron gas density, and Ohmic contact resistance during aging at 200 °C for up to 2800 h under atmospheric conditions. This was accomplished by characterizing AlGaN/AlN/GaN micro-Hall sensors, with and without contacts, and before and after being placed under different thermal aging times. Observed electrical performance was correlated with the micro-structural evolution of AlGaN/AlN/GaN Hall sensor heterostructures. Results indicate that the AlGaN/AlN/GaN Hall sensor provides stable performance for as long as 2800 h aging at 200 °C without any significant degradation of (i) Hall sensitivity, (ii) two-dimensional electron gas, and (iii) Ohmic contacts. However, there was a small change in sheet density and mobility, which is due to a decrease in polarization, resulting from local inhomogeneous strain relief at the barrier layer. During the early stage of thermal aging, a decrease in contact resistance was also observed and attributed to (i) out-diffusion of "Ga" at the vicinity of the contact interface, and (ii) a reduction in oxygen concentration and formation of Al–Ti intermediate alloy at the GaN/Ti interface, resulting in a reduced barrier and enhanced electron transport at the contacts. However, despite these small changes, results indicate that the AlGaN/AlN/GaN Hall sensor provides stable performance for as long as 2800 h thermal aging at 200 °C. [ABSTRACT FROM AUTHOR]

This work highlights the influence of surface properties, on the characteristics of InAlN/GaN based high electron mobility transistor (HEMT) structures grown on the SiC substrate by metalorganic vapor phase epitaxy. The growth parameters, i.e., reactor pressure and V/III ratio were tuned to improve the morphological and two-dimensional electron gas (2DEG) characteristics of the HEMT structure. It was found that V/III ratio plays a significant role in improving surface morphology and 2DEG properties without altering average indium composition. It was also found that 2DEG properties are highly sensitive to surface morphology and its features. The step flow smooth surface morphology with very low surface and interface roughness was observed in optimized lattice-matched InAlN/GaN HEMT structures. The sheet resistance of ∼170 Ω/sq with good 2DEG concentration (∼2.4 × 1013 cm−2) and 2DEG mobility (∼1500 cm2/V s) was achieved in the optimized lattice-matched InAlN/GaN HEMT structure. A comparison between different barrier-based HEMT structures, i.e., lattice-matched InAlN/GaN and strained AlGaN/GaN, was also discussed. Their structural, electrical, morphological, and interfacial characteristics were compared. [ABSTRACT FROM AUTHOR]

In the pursuit of developing high-performance low-dimensional spintronic devices, two-dimensional van der Waals heterostructures comprising non-magnetic nitride and ferromagnetic materials have emerged as a crucial area of investigation. This paper proposes a novel structure that employs hexagonal two-dimensional semiconductor GaN flanked by two half-metallic two-dimensional CrN layers. The stability of the proposed structure is verified via first-principles calculations, which indicate good thermodynamic and magnetic stability. The transport characteristics of electrons in the structure are analyzed through the Band structures and density of states. Specifically, the study examines the spin polarizability of parallel and anti-parallel magnetic configurations of the CrN/GaN/CrN vdW heterostructure, and the results demonstrate a significant spin valve effect. Overall, the study establishes the potential of the CrN/GaN/CrN vdW heterostructure as a candidate for the development of innovative spintronic devices. [ABSTRACT FROM AUTHOR]

Within the framework of an electron transport regime classification scheme, we aim to explore the boundaries that occur between the ballistic, collision-dominated, space-charge injection, and non-space-charge injection electron transport regimes that are experienced by an electron within a semiconducting device, mapping out where these different electron transport regimes are. We do this by determining the electron's mean free path and the relevant screening length. In order to make this analysis concrete, we perform this analysis for four representative semiconductor material systems, including silicon, gallium arsenide, the 4H-phase of silicon carbide, and the wurtzite phase of gallium nitride. The entire analysis is performed using a two-dimensional approach, this being representative of the electron transport that is experienced by an electron in the vicinity of a two-dimensional electron gas. Finally, following an evaluation of the dependence of the ballistic mobility on the device length scale for all four materials, an evaluation of the effective mobility as a function of the channel-length scale is pursued, a Matthiessen-rule based approach being employed for the purposes of this analysis. [ABSTRACT FROM AUTHOR]

The search for contact materials with low contact resistance and tunable Schottky barrier (SB) height of two-dimensional (2D) materials is important for improving the electronic performance. Inspired by the recently synthesized metallic Janus MoSH, this study employs first-principles calculations to investigate the electronic structure, mechanical properties, and interface characteristics of Janus MoSH/GaN and MoHS/GaN van der Waals (vdW) heterostructures. We find that both heterostructures exhibit isotropic mechanical properties and form p-type Schottky barrier contacts (p-ShC) and the SB height of MoHS/GaN is smaller than that of the MoSH/GaN heterostructure. The variation in SB height and contact type under biaxial strain and electric field is also studied for both vdW heterostructures, respectively. Compared to the MoSH/GaN heterostructure, the MoHS/GaN heterostructure can transition to Ohmic contact (OhC) under biaxial strain and electric field, making the S-face contact of MoSH with GaN a more effective contact approach. These findings could provide a new pathway for the design of controllable Schottky nanodevices and high-performance electronic devices on GaN-based vdW heterostructures. [ABSTRACT FROM AUTHOR]

To minimize bowing in a gallium nitride (GaN) template, which is caused by differences in the properties of the GaN film and the sapphire substrate, we studied how to offset bowing by directly growing GaN using the hydride vapor phase epitaxy (HVPE) method on the frontside of a pre-strained sapphire substrate prepared using a backside grinding process. The relationships between the respective thicknesses and stresses of the undamaged sapphire, damaged sapphire, and GaN layers were analyzed by deriving the bow formula, which is a modification of Freund's equation, and the theoretical formula-derived results were compared with experimentally determined values. The bow of the GaN template was measured using a micrometer, and the residual stresses in the GaN and sapphire, carrier mobilities, and GaN crystal qualities were measured using a micro-Raman spectrophotometer. The results confirmed the annealing effect on the damaged sapphire layer, and the introduction of pre-strained GaN templates facilitated easier bow control compared to that afforded by a conventional GaN template. Additionally, we identified trends and optimal conditions for changes in residual stress, carrier mobility, and crystal quality in GaN and the damaged sapphire layer based on layer thickness and stress variations. We explain the mechanisms responsible for changes in bow, stress, carrier mobility, and crystal quality of the GaN template. [Display omitted] • A pre-strained sapphire was introduced to minimize the bow in the GaN template. • The bow of the pre-strained GaN template was counterbalanced by epitaxial GaN growth. • Relationships between composed layers were interpreted using the induced bow formula. • Residual stress, carrier mobility, and crystallinity trends in GaN were analyzed. • Mechanisms governing bow and optical properties were elucidated. [ABSTRACT FROM AUTHOR]

Free‐standing gallium nitride has been prepared using various methods; however, the removal of the original substrate is still challenging with low success rates. In this work, 2‐inch free‐standing GaN films are obtained by direct growth on a fluoro phlogopite mica by hydride vapor‐phase epitaxy. Depending on the van der Waals (vdW) interaction between GaN and mica, the effect of the significant lattice mismatch is effectively reduced; thus, enabling the production of a high‐quality wafer‐scale GaN film on mica. The vdW‐induced cracks at GaN–mica interface are found to be initiated near the interface so that GaN can easily separate from mica during rapid cooling. Owing to the hydrophilic nature of mica, the residual GaN on the mica can be lifted off by following deionized water treatment, and the mica substrate can be repeatedly used to grow free‐standing GaN films. The self‐separated GaN films grown on both pristine and used mica substrates are single crystallinity and strain‐free. Additionally, a fully functional ultraviolet light‐emitting diode is demonstrated to show that the self‐separated GaN films are of device quality. The proposed approach achieves epitaxial growth of wafer‐scale single‐crystalline GaN on 2D materials and provides a new substrate option in the technology of III‐V materials. [ABSTRACT FROM AUTHOR]

In this study, the impacts of fabrication technology and epitaxial layer design on the transconductance (gm) of radio frequency AlGaN/GaN high‐electron‐mobility transistors (HEMTs) are examined. Optimization of the SiNx passivation and AlGaN barrier design of 150 nm gate HEMTs enhances the extrinsic (at Vds = 10 V) and intrinsic (at Vds = 15 V) transconductance from ≈0.47/0.65 to ≈0.62/1.1 S mm−1. Notably, an extrinsic gm of 0.70 S mm−1 at Vds = 5 V is achieved, setting a new benchmark for the extrinsic transconductance of AlGaN/GaN HEMTs designed for the K/Ka frequency range with a breakdown voltage exceeding 100 V. [ABSTRACT FROM AUTHOR]

Highlights: Vertical 1D GaN nanorod arrays/2D MoS2/PEDOT:PSS heterostructures in wafer scale have been fabricated for flexible photodetection firstly. Self-powered flexible photodetector at compressive strain reveals a significantly enhanced photoresponse with a responsivity of 2.47 A W−1 and response times of 40/45 µs, which are superior to the state-of-the-art flexible devices. This work not only provides a valuable strategy for the design and construction of tunable van der Waals heterostructures, but also opens a new opportunity for flexible sensors. van der Waals (vdW) heterostructures constructed by low-dimensional (0D, 1D, and 2D) materials are emerging as one of the most appealing systems in next-generation flexible photodetection. Currently, hand-stacked vdW-type photodetectors are not compatible with large-area-array fabrication and show unimpressive performance in self-powered mode. Herein, vertical 1D GaN nanorods arrays (NRAs)/2D MoS2/PEDOT:PSS in wafer scale have been proposed for self-powered flexible photodetectors arrays firstly. The as-integrated device without external bias under weak UV illumination exhibits a competitive responsivity of 1.47 A W−1 and a high detectivity of 1.2 × 1011 Jones, as well as a fast response speed of 54/71 µs, thanks to the strong light absorption of GaN NRAs and the efficient photogenerated carrier separation in type-II heterojunction. Notably, the strain-tunable photodetection performances of device have been demonstrated. Impressively, the device at − 0.78% strain and zero bias reveals a significantly enhanced photoresponse with a responsivity of 2.47 A W−1, a detectivity of 2.6 × 1011 Jones, and response times of 40/45 µs, which are superior to the state-of-the-art self-powered flexible photodetectors. This work presents a valuable avenue to prepare tunable vdWs heterostructures for self-powered flexible photodetection, which performs well in flexible sensors. [ABSTRACT FROM AUTHOR]