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Effects of ~35 years of aging during storage are investigated on the radiation response and 1/f noise of Oki nMOS and pMOS transistors with high oxygen vacancy densities in SiO2. Short-term interface-trap buildup during irradiation is enhanced significantly, relative to that observed in 1989, 1997, and 2008. In contrast, similar latent interface-trap buildup is observed for aged pMOS devices irradiated and annealed at room and elevated temperatures at positive bias in this and earlier studies. Significant latent interface-trap buildup is observed for nMOS devices irradiated at 0 V and annealed at room and elevated temperatures under positive bias, a condition not evaluated in prior work. Results strongly suggest that latent interface-trap buildup is due to H2 diffusion and dissociation at charged or dipolar O vacancies in SiO2, followed by proton transport to the Si/SiO2 interface and reactions with Si-H complexes. Models that attribute latent interface-trap buildup to long-term proton trapping at O vacancies in SiO2 appear to be ruled out by these results. Additional insight is provided into mechanisms of post-irradiation interface- and border-trap buildup after long-term MOS device storage.

Total ionizing dose (TID) effects at the 7-nm bulk FinFET node are characterized through changes in ring oscillator (RO) frequencies and current as a function of $V_{\mathrm {DD}}$ to model delay and power degradations in digital circuits. At the 7-nm node, tests show that gate delay decreased, and power consumption increased as TID increased. Percent increase in parameter degradations shows an inverse relationship with supply voltage, while percent increase in power consumption shows a direct relationship with supply voltage. Annealing at room temperature did not affect degradations. Circuit-level degradations for the 7-nm technology were less than 1% after TID exposure of 380 krad(SiO2). These TID exposure results will provide insight to designers about circuit-level parameters of interest concerning the 7-nm technology node.

Circular microdisk mechanical resonators vibrating in their various resonance modes have emerged as important platforms for a wide spectrum of technologies including photonics, cavity optomechanics, optical metrology, and quantum optics. Optically transduced microdisk resonators made of advanced materials such as silicon carbide (SiC), diamond, and other wide- or ultrawide-bandgap materials are especially attractive. They are also of strong interest in the exploration of transducers or detectors for harsh environments and mission-oriented applications. Here we report on the first experimental investigation and analysis of energetic proton radiation effects on microdisk resonators made of 3C-SiC thin film grown on silicon substrate. We fabricate and study microdisks with diameters of ∼48 µm and ∼36 µm, and with multimode resonances in the ∼1 to 20 MHz range. We observe consistent downshifts of multimode resonance frequencies, and measure fractional frequency downshifts from the first three flexural resonance modes, up to ∼-3420 and -1660 ppm for two devices, respectively, in response to 1.8 MeV proton radiation at a dosage of 1014/cm2. Such frequency changes are attributed to the radiation-induced Young’s modulus change of ∼0.38% and ∼0.09%, respectively. These devices also exhibit proton detection responsivity of ℜ ≈ -5 to -6 × 10−6 Hz/proton. The results provide new knowledge of proton radiation effects in SiC materials, and may lead to better understanding and exploitation of micro/nanoscale devices for harsh-environment sensing, optomechanics, and integrated photonics applications.

Analog-to-digital converters (ADCs) with different topologies respond differently to total ionizing dose (TID). A flexible behavioral modeling approach is proposed for system-level simulation of TID effects in successive-approximation-register (SAR) ADCs. The radiation-enabled approach can be adapted for a wide range of ADCs of various resolutions, clock speeds, and manufacturers. The empirical model is calibrated and validated, pre-rad and post-rad, for a particular ADC. Pre-rad calibration is performed by introducing distributions of static parameters corresponding to datasheet specifications. The post-rad calibration is accomplished by introducing error sources associated with the comparator and digital-to-analog converter (DAC), corresponding to experimental data. The calibrated model is used to examine the dynamic performance and to estimate the probability of parametric failure during the mission lifetime.

Statistical analysis is performed on the totalionizing-dose (TID) response of fourth-generation silicon–germanium heterojunction bipolar transistors, revealing an increasing variance in base current with increasing dose. A 10-fold increase is observed after 2 Mrad(SiO2) of radiation exposure. The postirradiation performance is shown to be poorly correlated with initial performance, revealing potential difficulties for radiation hardness assurance testing. Simple analytical theory is used to demonstrate how TID exacerbates performance variations due to preexisting process-induced variations. Then, technology computer-aided design (TCAD) simulations are used to investigate the fundamental mechanisms driving these statistical changes, particularly process variations associated with the doping profiles. Simulation results reveal potential methods to both predict TID response and mitigate it at the process level. Finally, implications for hardness assurance testing and radiation-tolerant device and circuit design are discussed, especially the need to consider postirradiation variability in the design process for radiation-intense applications.

Total-ionizing-dose (TID) effects and low-frequency noise are evaluated in advanced bulk nMOS and pMOS FinFETs with SiO2/HfO2 gate dielectrics. Otherwise identical devices built with and without through-silicon via (TSV) integration exhibit threshold voltage shifts of less than 25 mV and changes in maximum transconductance of less than 1% up to 2 Mrad(SiO2). TSV integration negligibly impacts threshold shifts and degradation of subthreshold swing and $I_{\mathrm{\scriptscriptstyle ON}}/I_{\mathrm{\scriptscriptstyle OFF}}$ ratios. Similar low-frequency noise magnitudes and frequency dependencies are observed before and after TID irradiation for each device type. Effective densities of the near-interfacial electron traps responsible for the noise in the nMOS devices increase as the surface potential moves toward midgap, while effective densities of the hole traps that cause the noise in the pMOS devices increase as the surface potential moves toward the valence band edge.

Total-ionizing-dose (TID) effects are investigated for 22-nm fully-depleted silicon-on-insulator (FDSOI) and 14-nm bulk FinFET charge-trap memory transistors. Electron trapping in the gate dielectric establishes the programmed memory state for both silicon on insulator (SOI) and bulk devices. To first order, ionizing radiation does not interact strongly with programing-induced charges in the gate dielectric for either device type. Hole trapping in the buried oxide dominates the TID response of the 22-nm FDSOI devices. The 14-nm bulk devices with two fins and total effective fin widths of 150 nm are minimally affected by TID, but the subthreshold leakage of devices with 40 fins and total effective fin widths of $3~\mu \text{m}$ increases with increasing TID. When devices are programmed or reprogrammed after irradiation, significant increases in subthreshold slope are observed due to the generation of interface traps, border traps, and/or charge lateral nonuniformities.

The energy distributions of electrons in gate-all-around (GAA) Si MOSFETs are analyzed using full-band 3-D Monte Carlo (MC) simulations. Excellent agreement is obtained with experimental current–voltage characteristics. For these 24-nm gate length devices, the electron distribution features a smeared energy peak with an extended tail. This extension of the tail results primarily from the Coulomb scattering within the channel. A fraction of electrons that enter the drain retains their energy, resulting in an out-of-equilibrium distribution in the drain region. The simulated density and average energy of the hot electrons correlate well with experimentally observed device degradation. We propose that the interaction of high-energy electrons with hydrogen-passivated phosphorus dopant complexes within the drain may provide an additional pathway for interface-trap formation in these devices.

Heavy-ion, focused X-ray, and pulsed laser single-event transient (SET) experiments are performed on a silicon epitaxial diode. Collected charge, transient rise times, and transient fall times are calculated and compared between different sources. The transient shape characteristics depend on the source (ion, X-ray, or laser), even when similar amounts of charge are generated. The observed differences are examined and explained in terms of basic charge collection mechanisms.

Peak transient currents due to pulsed-laser or heavy-ion irradiation of Ge $p$ MOS FinFETs are nearly independent of gate bias. This is because the prompt photocurrent is due primarily to a transient source–drain shunt. In contrast, long-term diffusion charge collection is strongly gate-bias dependent. This bias dependence results from hole injection from the source in response to the transient increase in electron concentration in the channel. The transients measured at the source terminal change polarity when the strike location moves from the source to the drain, but this effect does not occur for the transients measured at the drain terminal. Charge collection mechanisms are studied using TCAD simulations.

Pulsed-laser-induced single-event current measurements on two geometries of waveguide-integrated germanium photodiodes were conducted over a range of operating voltages to examine the impact of photodiode geometry on the transient response. Vertical p-i-n photodiodes exhibit transients with a duration that is relatively independent of the operating voltage, while the transient duration in lateral p-i-n photodiodes depends on the operating voltage. Furthermore, the experimental measurements facilitate identification of device dimensions that impact the transient response. These results can be used to identify potential radiation mitigation strategies for photodiodes operating in a radiation environment. Understanding the implications of design choices is critical for designing integrated photonic systems that balance system performance with tolerance for radiation degradation.

Heavy-ion measurements are used to define a multiply nested sensitive-volume model for a 180-nm static random access memory (SRAM) test structure using the Monte Carlo radiative energy deposition (MRED) tool. We demonstrate that the fundamental assumptions of simple rectangular-parallelepiped (RPP) or integral-RPP models are inappropriate for single-event latchup (SEL) in this test structure, indicating that more advanced modeling is needed. We develop an MRED model that agrees well with latchup data at normal incidence and at roll and tilt angles of 60°. This process should facilitate estimates of SEL cross section and event rates for this and similar technologies in space environments.

The total-ionizing-dose (TID) response of indium gallium arsenide (InGaAs) MOSFETs with Al2O3 gate dielectrics and several channel lengths is evaluated under different biases. DC static characteristics show large negative threshold voltage $V_{\text {th}}$ shifts and subthreshold stretchout ( SS ), indicating net positive charge trapping in the gate oxide and generation of the interface and border traps. Hysteresis and $I_{d}$ – $V_{\text {gs}}$ measurements from cryogenic to high temperatures show the important role of defects in the Al2O3 gate dielectric to the TID response. Radiation-induced-hole trapping is attributed to oxygen vacancies in the Al2O3. The relatively large hysteresis in these devices is attributed primarily to dangling Al bonds in the near-interfacial Al2O3. Analysis of the temperature dependence of $V_{\text {th}}$ and SS suggests that the rate at which electrons leave the Al2O3 during a positive-to-negative gate-bias sweep is higher than the rate at which they enter during a negative-to-positive gate-bias sweep.

The effects of high-field stress are evaluated for industrial-quality AlGaN/GaN HEMTs as a function of bias and temperature. Positive and negative threshold voltage shifts are observed, depending on stress conditions, indicating the presence of acceptor-like and donor-like traps in these devices. Worst-case transconductance degradation under rated device operating conditions is observed for devices subjected to high-voltage stress in the ON bias condition at elevated temperature. This contrasts with results on earlier-generation devices, which often show worst-case response under semi-ON bias conditions, emphasizing that each technology requires characterization under multiple bias-stress conditions. Neutral and charged oxygen donor-like DX centers and substitutional acceptor-like $\text{N}_{\mathrm{ Ga}}$ centers are the dominant defects contributing to low-frequency noise in these devices. Dehydrogenation of $\text{O}_{\mathrm{ N}}$ -H complexes during ON-bias stress and the resulting increases in densities of $\text{O}_{\mathrm{ N}}$ -related donor-like defects are evidently the reliability-limiting mechanism in these devices.

Effects of additional thermal budget associated with a three-dimensional (3D) fabrication sequence are evaluated for the total-ionizing dose radiation response of fully depleted silicon-on-insulator (FD-SOI) MOSFETs. Current-voltage and low-frequency (1/ ${f}$ ) noise measurements are compared for (1) conventional planar FD-SOI MOSFETs, and (2) MOSFETs formed in the bottom layer of the 3D process and subjected to the process steps associated with formation of a second active layer. Similar radiation-induced voltage shifts and increases of 1/ ${f}$ noise are observed after irradiation for both types of structures. These similar changes in response show that the additional thermal processing involved with 3D fabrication has little effect on border-trap densities and radiation-induced charge trapping in gate and/or buried oxides of MOSFETs formed in the bottom layer of the 3D process.

Charge transport mechanisms of forward and reverse leakage currents in vertical GaN Schottky barrier diodes are investigated by measuring the temperature-dependent current–voltage characteristics. The results show that the leakage current is primarily governed by dislocation-associated thermionic field emission (TFE). The primary transport path is the reduced, localized conduction band around the dislocation core rather than the continuum defect states. A refined phenomenological physical model is developed for conductive dislocations in GaN, emphasizing that: 1) surface donors, surrounding the core of dislocations, can significantly shrink the barrier region after ionization, causing severe TFE leakage; 2) the $\text{O}_{N}$ donors likely to be responsible for TFE have a typical density of $\sim 1\,\,\!\times \! \,\,10^{{18}}$ cm $^{-{3}}$ at 300 K and activation energy of 78 meV; and 3) the barrier height at donor sites is ~0.65 eV at 300 K, which is reduced by ~0.4 eV with respect to the dislocation-free region.

Total-ionizing-dose (TID) effects and low-frequency noise are evaluated in 30-nm gate-length bulk and silicon-on-insulator (SOI) FinFETs for devices with fin widths of 10–40 nm. Minimal threshold voltage shifts are observed at 2 Mrad(SiO2), but large increases in low-frequency noise are found, and significant changes in defect-energy distributions are inferred. Radiation-induced leakage current is enhanced for narrow- and short-channel bulk FinFETs. Short-channel SOI FinFETs show enhanced degradation compared with longer-channel devices. Narrow- and short-channel SOI devices exhibit high radiation tolerance. Significant random telegraph noise (RTN) is observed in smaller devices due to prominent individual defects.

A sensitive volume is developed using pulsed laser-induced collected charge for two bias conditions in an epitaxial silicon diode. These sensitive volumes show good agreement with the experimental two-photon absorption laser-induced collected charge at a variety of focal positions and pulse energies. When compared to ion-induced collected charge, the laser-based sensitive volume overpredicts the experimental collected charge at low bias and agrees at high bias. A sensitive volume based on ion-induced collected charge adequately describes the ion experimental results at both biases. Differences in the amount of potential modulation explain the differences between the ion- and laser-based sensitive volumes at the lower bias. Truncation of potential modulation by the highly doped substrate, at the higher bias, results in similar sensitive volumes.

Neuromorphic computing endeavors to imitate the way biological brains process information and solve problems. Uses for neuromorphic computing span disciplines and include applications in image processing, audio processing, optimization, and more. This work explores the effect of proton-induced single-event upsets (SEUs) on a neuromorphic computing architecture engaged in image recognition. Two main results are found. One, the overall classification accuracy is unchanged although a high number of hidden, tolerable errors occurred. Additionally, SEUs are found to alter the relative occurrence of false positives and false negatives, which occurred despite the overall classification accuracy remaining unaffected.

Pulsed, laser-induced, single-event current measurements on silicon-on-insulator (SOI) FinFETs at subbandgap wavelength (1260 nm) are affected by the polarization of the laser light used in the experimental testing setup. Such polarization dependence is not observed during pulsed laser, single-event effects testing on large-area silicon diodes, suggesting that polarization dependence arises due to the presence of the nanoscale fin. Plasmonic enhancement is proposed as a likely mechanism for the polarization effects due to the metal/dielectric interfaces in the fin region. The observed polarization dependence has ramifications for collection and interpretation of data acquired by pulsed laser testing. Device orientation of FinFETs and other nanoscale devices during pulsed laser testing should be considered in order to ensure consistent testing conditions and reproducible measurement results across multiple measurement campaigns.

Photodetectors based on graphene attracted widespread attention because of their superior properties. We have evaluated the low-frequency noise of a graphene-based X-ray detector manufactured from graphene oxide (GO) through a laser process. The low-frequency noise's temperature dependence indicates a nonuniform energy distribution of traps in the device due to a distribution of defects and impurities, most likely due to O-vacancies and hydrogen.

We evaluate the total ionizing dose (TID) responses of InGaAs nMOS FinFETs with different gate lengths irradiated with 10-keV X-rays under different gate biases. The largest degradation after irradiation occurs at $V_{\mathrm {G}} = -1$ V. Radiation-induced trapped positive charge dominates the TID response of InGaAs FinFET transistors, consistent with previous results for InGaAs multifin capacitors. Shorter gate-length devices show larger radiation-induced charge trapping than longer gate-length devices, most likely due to the electrostatic effects of trapped charge in the surrounding SiO2 isolation and SiO2/Si3N4 spacer oxides. The 1/ $f$ noise measurements indicate a high trap density and a nonuniform defect-energy distribution, consistent with a strong variation of effective border-trap density with surface potential.

At the 14-/16-nm FinFET technology node, experimental heavy-ion single-event upset (SEU) cross sections have been obtained for a D flip-flop (DFF) with variation in supply voltage over a wide range of particle linear energy transfer (LET). An empirical model for predicting the SEU cross section as a function of supply voltage based on experimental data has been developed and verified. The results are consistent with low-LET particle irradiation findings from previous works that have indicated a strong exponential increase in SEU cross section with supply voltage scaling for FinFET technologies. Furthermore, this paper reveals the impact of supply voltage variations on a sensitive area for high-LET particle irradiation. The increase in cross section from nominal (0.8 V) to a specific reduced supply voltage for high-LET particle irradiation is constant and has been observed through experimental results across the high-LET particle spectrum. The 3-D TCAD simulations are used to characterize sensitive area affecting high-LET supply voltage-dependent SEU cross sections in the FinFET technology. The developed model will allow circuit designers to predict changes in the SEU cross section due to supply voltage variation for the 14-/16-nm technology node without extensive testing.