406 results on '"Edelstein, D."'
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2. Metal-induced line width variability challenge and mitigation strategy in advanced post-Cu interconnects
3. Dependence of Cu electromigration resistance on selectively deposited CVD Co cap thickness
4. Rights and indigenous claims in settler colonies
5. Competitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies
6. Co capping layers for Cu/low-k interconnects
7. The Wiring Challenge: Complexity and Crowding
8. First Experimental Demonstration of MRAM Data Scrubbing: 80 Mb MRAM with 40 nm junctions for Last Level Cache Applications
9. Electromigration and Line R of Graphene Capped Cu Dual Damascene Interconnect
10. Changes in the characteristics of ‘wet’ and ‘dry’ Red Sea Trough over the Eastern Mediterranean in CMIP5 climate projections
11. 164P Rapid liquid biopsy genotyping in NSCLC patients
12. A Broadly Tunable cw Femtosecond Source for Ultrafast Spectroscopy
13. High Resolution WRF Simulations for the Tel‐Aviv Metropolitan Area Reveal the Urban Fingerprint in the Sea‐Breeze Hodograph
14. Hyperglycaemia-induced superoxide production decreases eNOS expression via AP-1 activation in aortic endothelial cells
15. A 14 nm Embedded STT-MRAM CMOS Technology
16. Determination of the thermal conductivity of composite low- k dielectrics for advanced interconnect structures
17. Materials and scaling effects on on-chip interconnect reliability
18. Enhanced Cracking Resistance of Plasma Deposited Low-k SiCOH Films with Nano Imbedded Layers Insertion
19. Oral benfotiamine plus α-lipoic acid normalises complication-causing pathways in type 1 diabetes
20. Transduction of non-dividing adult human pancreatic beta cells by an integrating lentiviral vector
21. Aminoguanidine inhibits the development of accelerated diabetic retinopathy in the spontaneous hypertensive rat
22. Inhibition of matrix-induced bone differentiation by advanced glycation end-products in rats
23. Battery energy storage for frequency regulation in an island power system
24. Internationalizing software engineering standards
25. Blood-based testing of mutations in patients with head and neck squamous cell carcinoma (HNSCC) using highly sensitive SafeSEQ technology
26. Technology challenges and enablers to extend Cu metallization to beyond 7 nm node
27. Analyzing the ability to reconstruct the moisture field using commercial microwave network data
28. Effort seeks to develop international software standards
29. Comparison of OncoBEAM and NGS methods to detect plasma EGFR T790M mutations at progression of NSCLC
30. Key parameters affecting STT-MRAM switching efficiency and improved device performance of 400°C-compatible p-MTJs
31. Interface engineering for high interfacial strength between SiCOH and porous SiCOH interconnect dielectrics and diffusion caps.
32. Line Resistance Reduction in Advanced Copper Interconnects
33. Comparison of key fine-line BEOL metallization schemes for beyond 7 nm node
34. Reliable airgap BEOL technology in advanced 48 nm pitch copper/ULK interconnects for substantial power and performance benefits
35. Microstructure modulation for resistance reduction in copper interconnects
36. Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines
37. Via Resistance Reduction in Advanced Copper Interconnects
38. Aminoguanidine ameliorates albuminuria in diabetic hypertensive rats
39. Monte Carlo simulations of surface diffusion at high coverages.
40. 1158P - Blood-based testing of mutations in patients with head and neck squamous cell carcinoma (HNSCC) using highly sensitive SafeSEQ technology
41. Copper Ulsi Interconnect Technology
42. Accuracy of plasma RAS mutation testing for therapy selection and monitoring of colorectal cancer patients
43. Performance assessment of blood based RAS mutation testing: Concordance of results obtained from prospectively collected samples
44. Pre-liner dielectric nitridation for resistance reduction in copper interconnects
45. Experimental study of nanoscale Co damascene BEOL interconnect structures
46. Ultrathin conformal multilayer SiNO dielectric cap for capacitance reduction in Cu/low k interconnects
47. BEOL process integration for the 7 nm technology node
48. 100P - Comparison of OncoBEAM and NGS methods to detect plasma EGFR T790M mutations at progression of NSCLC
49. 2012 Concordance of RAS mutation status in metastatic CRC patients bycomparison of results from circulating tumor DNA and tissue-based RAS testing
50. Enhanced electromigration resistance through grain size modulation in copper interconnects
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