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Your search keyword '"Crimp, M.A."' showing total 157 results
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157 results on '"Crimp, M.A."'

25. Effect of growth temperature on the structure and magnetic properties of sputtered biepitaxial (111) permalloy films

Author

Loloee, R. and Crimp, M.A.

Subjects
Sputtering (Physics) -- Analysis, Electrons -- Diffraction, Electrons -- Analysis, Physics
Abstract

Electron backscatter diffraction (EBSD) patterns and coercivity values obtained from magnetization hysteresis loops of several sputtered biepitaxial (111)Py films grown at different temperatures on sputtered biepitaxial (111)Cu buffer layers are collected. Strain-induced uniaxial anisotropy was observed in all biepitaxial Py films.

Published
2002

36. On predicting nucleation of microcracks due to slip-twin interactions at grain boundaries in duplex near y-TiAI

Author

Kumar, D., Bieler, T.R., Eisenlohr, P., Mason, D.E., Crimp, M.A., Roters, F., and Raabe, D.

Subjects
Finite element method -- Usage, Plasticity -- Analysis, Stress analysis (Engineering), Science and technology
Abstract

The article explains the combined micorscopic and crystal plasticity finite element providing insights on local stress-strain relationships to evaluate a fip in the context of hetrogenous deformation in multigrain ensembles.

Published
2008

37. Self-assembled thulium silicide nanostructures on silicon(001) studied by scanning tunneling microscopy and transmission electron microscopy

Author

Crimp, M.A. and Nogami, J.

Subjects
Silicon compounds -- Optical properties, Scanning tunneling microscopy -- Observations, Epitaxy -- Analysis, Physics
Abstract

A combination of scanning tunneling microscopy (STM) and transmission electron microscopy (TEM) were used to study the initial stages of epitaxial growth of thulium (Tm) silicide on Si(001). The degree of correspondence observed between features of STM and TEM indicated that the hexagonal phase might form nanowires or elongated islands with some periodic lateral relaxation.

Published
2008

50. >Examination of the distribution of the tensile deformation systems in tension and tension-creep of Ti-6Al-4V (wt.%) at 296 K and 728 K.

Author

Li, H., Boehlert, C.J., Bieler, T.R., and Crimp, M.A.

Subjects
DEFORMATIONS (Mechanics), TENSILE strength, CREEP (Materials), TITANIUM alloys, SCANNING electron microscopy, TEMPERATURE effect
Abstract

The deformation behaviour of an α + β Ti–6Al–4V (wt.%) alloy was investigated duringin situdeformation inside a scanning electron microscopy (SEM). Tensile experiments were performed at 296 and 728 K (~0.4Tm), while a tensile-creep experiment was performed at 728 K and 310 MPa (σ/σys = 0.74). The active deformation systems were identified using electron backscattered diffraction-based slip-trace analysis and SEM images of the specimen surface. The distribution of the active deformation systems varied as a function of temperature. Basal slip deformation played a major role in the tensile deformation behaviour, and the relative activity of basal slip increased with increasing temperature. For the 296 K tension deformation, basal slip was less active than prismatic slip, whereas this was reversed at 728 K. Twinning was observed in both the 296 and 728 K tension experiments; however, no more than 4% of the total deformation systems observed was twins. The tension-creep experiment revealed no slip traces, however grain boundary ledge formation was observed, suggesting that grain boundary sliding was an active deformation mechanism. The results of this work were compared with those from previous studies on commercially pure Ti, Ti–5Al–2.5Sn (wt.%) and Ti–8Al–1Mo–1V (wt.%), and the effects of alloying on the deformation behaviour are discussed. The relative amount of basal slip activity increased with increasing Al content. [ABSTRACT FROM PUBLISHER]

Published
2015
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