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Four emitters based on the naphthyridine acceptor moiety and various donor units exhibiting thermally activated delayed fluorescence (TADF) were designed and synthesized. The emitters exhibited excellent TADF properties with a small ΔE ST and a high photoluminescence quantum yield. A green TADF organic light-emitting diode based on 10-(4-(1,8-naphthyridin-2-yl)phenyl)-10H-phenothiazine exhibited a maximum external quantum efficiency of 16.4% with Commission Internationale de L'éclairage coordinates of (0.368, 0.569) as well as a high current and power efficiency of 58.6 cd/A and 57.1 lm/W, respectively. The supreme power efficiency is a record-high value among the reported values of devices with naphthyridine-based emitters. This results from its high photoluminescence quantum yield, efficient TADF, and horizontal molecular orientation. The molecular orientations of the films of the host and the host doped with the naphthyridine emitter were explored by angle-dependent photoluminescence and grazing-incidence small-angle X-ray scattering (GIWAXS). The orientation order parameters (ΘADPL) were found to be 0.37, 0.45, 0.62, and 0.74 for the naphthyridine dopants with dimethylacridan, carbazole, phenoxazine, and phenothiazine donor moieties, respectively. These results were also proven by GIWAXS measurement. The derivative of naphthyridine and phenothiazine was shown to be more flexible to align with the host and to show the favorable horizontal molecular orientation and crystalline domain size, benefiting the outcoupling efficiency and contributing to the device efficiency.

Sepsis is a life-threatening condition, and serum lactate levels have been used to predict patient prognosis. Studies on serum lactate levels in patients undergoing regular hemodialysis who have sepsis are limited. This study aimed to determine the predictive value of serum lactate levels for sepsis-related mortality among patients who underwent last hemodialysis at three different times before admission to the emergency department (ED). This retrospective cohort study was conducted from January 2007 to December 2013 in southern Taiwan. All hemodialysis patients with sepsis, receiving antibiotics within 24 hours of sepsis confirmation, admitted for at least 3 days, and whose serum lactate levels were known were examined to determine the difference in the serum lactate levels of patients who underwent last hemodialysis within 4 hours (Groups A), in 4–12 hours (Group B), and beyond 12 hours (Group C) before visited to the ED. All the continuous variables, categorical variables and mortality were compared by using Kruskal-Wallis test or Mann-Whitney test, the χ2 or Fisher exact tests, and multiple logistic regression model, respectively. A total of 490 patients were enrolled in the study, and 8.0% (39), 21.5% (84), and 74.9% (367) of the patients were in Group A, Group B and Group C, respectively; the serum lactate levels (2.91 vs 2.13 vs 2.79 mmol/L, respectively; P = .175) and 28-day in-hospital mortality (17.9% vs 14.6% vs 22.9%) showed no statistically significant difference between 3 groups. The association between serum lactate levels and 28-day in-hospital mortality was reliable in Group B (P = .002) and Group C (P

New derivatives of trifluoromethyl benzene and tert-butyl disubstituted acridan or phenothiazine were designed and obtained by single-step synthesis, i.e., by Buchwald-Hartwig cross-coupling reactions of 1,3-dibromo-5-(trifluoromethyl)benzene with 3,7-di-tert-butyldimethylacridan, or 3,7-di-tert-butyl-10H-phenothiazine. The advantages in high thermal and photophysical characteristics were utilized in exciplex emission based OLEDs. In the optimal case, device showed maximum current, power, and external quantum efficiencies of 27.4 cd/A, 28.6 lm/W and 7.6%, respectively. Taking into account that successful employment of acridan or phenothiazine derivatives as donors in exciplex-forming systems remains scarce, the proposed design of donor compounds in this work shows their potential for successful implementation in complex emissive systems of OLEDs.

Monolithically electro-absorption modulating the DFBLD with pre-emphasized PAM-4 data at 52 Gbaud (104 Gbit/s) for back-to-back link and 48 Gbaud (96 Gbit/s) after 10-km-long SMF transmissions is demonstrated for inter-data-center application.

This paper proposes a modularized three-dimensional (3D) heterogeneous system integration platform architecture, namely, MorPACK (morphing package). The architecture of MorPACK platform achieves high performance and function flexibility with low silicon area cost by sharing the MorPACK common system platform (CSP) on heterogeneous system integration. An efficient reconfiguration is enabled thanks to the use of system bus interfaces and exchange the bare die/module by system dividing and tri-state interface connecting. Six SoC projects/designs are implemented to demonstrate the effectiveness of the proposed MorPACK platform. The average silicon area of each project is about 122.59 mm2 using the TSMC 90 nm CMOS generic logic process technology. Compared with the total chip area 587.44 mm2 obtained by implementing these projects separately, the results show that there are 79.13% fabrication cost reduced by the MorPACK platform. Besides, around 60% performance improvement of operation frequency can be benefited from the 3D-stacking technique.

This paper presents an efficient memory controller VLSI design for integrating a 3D heterogeneous MorPACK system. The MorPACK system is a platform-based integration system and its structure is stacked by heterogeneous sub-modules. In order to reduce fabrication cost and increase the flexibility of memory extension, a novel multimode memory controller is proposed in this paper. The multimode memory controller supports NOR flash, NAND flash, and SDRAM memory with a wide capacity range. Hence, different MorPACK systems for various applications can be integrated by using the same multi-mode memory controller to satisfy different memory requirements. To demonstrate the effectiveness of the proposed methodology, three single-mode memory controllers are also implemented. With the technique of sharing one system-side signals, the pin count can reduce 41.9% while the pin count can reduce 19.2% by applying the technique of sharing memory-side signals. The total silicon area of single-mode memory controllers is about 6.83-mm2 in the TSMC 90 nm CMOS generic logic process technology. Compared with the total chip area 3.1-mm2 of our proposed multi-mode memory controller, the results show that there are 54.7 % fabrication cost reduced.

This paper presents a thermal analysis result for a 3D heterogeneous embedded system integration MorPACK (morphing package) platform. The MorPACK platform is stacked by heterogeneous submodules composed of bare dies, a substrate, connection bridges, and solder balls. Since the tiny, heterogeneous and integrable characteristics of MorPACK platform, it needs to be fabricated in high-density and laminar structure. The cooling ability of forced convection is restricted. This study presents an important characteristic for this 3D structure and two indications to optimize thermal solution for MorPACK structure. The characteristic shows the lowest layer owns the best cooling condition, so the bare die chip with highest power consumption should be placed on the lowest layer. It achieves cooling a 0.45-W consuming chip by 12-degree more than it put on the top layer. One of the indications shows the vertical thermal conductivity can be improved by filling up whole MorPACK with mold material. This skill efficiently cools down the 0.45-W consuming chip by 10-degree more than non-filled-up structure. The other indication shows removing the connection bridges and cutting out the substrate to make a room space for chip placement. With result shown, 50 % height and volume of MorPACK can be minimized and also reduce thermal resistance in out-plan direction.