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1. Towards Improved Nanosheet-Based Complementary Field Effect Transistor (CFET) Performance Down to 42nm Contacted Gate Pitch

2. 3D Stacked Devices and MOL Innovations for Post-Nanosheet CMOS Scaling

3. Nanosheet-based Complementary Field-Effect Transistors (CFETs) at 48nm Gate Pitch, and Middle Dielectric Isolation to enable CFET Inner Spacer Formation and Multi-Vt Patterning

4. FinFETs and Their Futures

11. Reliability and Variability-Aware DTCO Flow: Demonstration of Projections to N3 FinFET and Nanosheet Technologies

13. FinFETs and Their Futures

15. First Monolithic Integration of 3D Complementary FET (CFET) on 300mm Wafers

16. Buried Power Rail Integration with Si FinFETs for CMOS Scaling beyond the 5 nm Node

17. 3D-carrier Profiling and Parasitic Resistance Analysis in Vertically Stacked Gate-All-Around Si Nanowire CMOS Transistors

18. The future of high- K on pure germanium and its importance for Ge CMOS

21. Single and Double Diffusion Breaks in 14nm FinFET and Beyond

23. Efficient physical defect model applied to PBTI in high-κ stacks

25. Heterostructure at CMOS source/drain: Contributor or alleviator to the high access resistance problem?

26. Statistical model of the NBTI-induced threshold voltage, subthreshold swing, and transconductance degradations in advanced p-FinFETs

28. Towards high performance sub-10nm finW bulk FinFET technology

29. Electrical Characteristics of p-Type Bulk Si Fin Field-Effect Transistor Using Solid-Source Doping With 1-nm Phosphosilicate Glass

32. Self-heating on bulk FinFET from 14nm down to 7nm node

33. 1.5×10−9 Ωcm2 Contact resistivity on highly doped Si:P using Ge pre-amorphization and Ti silicidation

34. A comparison of arsenic and phosphorus extension by Room Temperature and hot ion implantation for NMOS Si bulk-FinFET at N7 (7nm) technology relevant fin dimensions

36. Origins and implications of increased channel hot carrier variability in nFinFETs

38. The device architecture dilemma for CMOS technologies

39. Strain enhanced low-VT CMOS featuring La/Al-doped HfSiO/TaC and 10ps invertor delay

40. A low-cost 90 nm RF-CMOS platform for record RF circuit performance

41. Impact of multi-gate device architectures on digital and analog circuits and its implications on System-On-Chip technologies

42. Improved sidewall doping of extensions by AsH3 ion assisted deposition and doping (IADD) with small implant angle for scaled NMOS Si bulk FinFETs

44. Standard cell level parasitics assessment in 20nm BPL and 14nm BFF

45. Impact of through silicon via induced mechanical stress on fully depleted Bulk FinFET technology

46. Phosphorus doped SiC Source Drain and SiGe channel for scaled bulk FinFETs

47. RMG Tech. Integration in FinFET Devices

50. Impact of single charged gate oxide defects on the performance and scaling of nanoscaled FETs

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