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7. Reliability challenges in Forksheet Devices: (Invited Paper)

12. Unveiling the Vulnerability of Oxide-Breakdown-Based PUF

17. Evaluating Forksheet FET Reliability Concerns by Experimental Comparison with Co-integrated Nanosheets

18. Modeling Analysis of BTI-Driven Degradation of a Ring Oscillator Designed in a 28-nm CMOS Technology

20. Comparison of Electrical Performance of Co-Integrated Forksheets and Nanosheets Transistors for the 2nm Technological Node and Beyond

27. Impact of self-heating on reliability predictions in STT-MRAM

30. X-Ray and Proton Radiation Effects on 40 nm CMOS Physically Unclonable Function Devices

37. Impact of processing and stack optimization on the reliability of perpendicular STT-MRAM

38. Benchmarking time-dependent variability of junctionless nanowire FETs

41. NBTI in Replacement Metal Gate SiGe core FinFETs: Impact of Ge concentration, fin width, fin rotation and interface passivation by high pressure anneals

42. Self-heating on bulk FinFET from 14nm down to 7nm node

44. The defect-centric perspective of device and circuit reliability — From individual defects to circuits

46. Characterization of self-heating in high-mobility Ge FinFET pMOS devices

47. Origins and implications of increased channel hot carrier variability in nFinFETs

50. Guidelines for reducing NBTI based on its correlation with effective work function studied by CV-BTI on high-k first MOS capacitors with slant-etched SiO2

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