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104 results on '"Auersperg, J."'

8. Delamination risk evaluation for plastic packages based on mixed mode fracture mechanics approaches

Author

Auersperg, J., Kieselstein, E., Schubert, A., and Michel, B.

Subjects
Electronic packaging -- Research, Electronics
Abstract

The growing application of advanced electronic packages under harsh environmental conditions, extreme temperatures especially in automotive applications is often a reason for damage, fatigue, and failure of entire components and systems. Consequently, their thermo-mechanical reliability is one of the most important preconditions for adopting these technologies in industrial applications. To prevent chips from being exposed to the external environment integrated circuits are usually encapsulated into packages. As a result, a microelectronic package is basically a compound of several materials with quite different Young's moduli and thermal expansion coefficients. Additionally, various kinds of inhomogeneity, residual stresses from several steps of the manufacturing process contribute to interface delaminations, chip cracking, and fatigue of solder interconnects. This paper intends to investigate mixed mode interface delamination phenomena in micro components by using combined numerical investigations by means of nonlinear FEA and experimental investigations. It explains how experimental data were used as input for the quantitative evaluation of fatigue and fracture of microcomponents. Both numerical and experimental investigations provide the basis for understanding and evaluating failure mechanisms especially in solder joints, as well as several polymer material interfaces, and should support further applications for raising the thermo-mechanical reliability of advanced electronic packages. [DOI: 10.1115/1.1501303]

Published
2002

12. Intrinsic stress measurement by FIB ion milling becomes an industrial-strength method

Author

Vogel, D., Auerswald, E., Gadhiya, G., Auersperg, J., Marco SEBASTIANI, Rzepka, S., D. Vogel, E. Auerswald, G. Gadhiya, J. Auersperg, M. Sebastiani, S. Rzepka, Vogel, Dietmar, Auerswald, Ellen, Gadhiya, Ghanshyam, Auersperg, Juergen, Sebastiani, Marco, and Rzepka, Sven

Subjects
Computer Networks and Communication, Artificial Intelligence, Computer Science Applications1707 Computer Vision and Pattern Recognition
Abstract

Intrinsic stresses in semiconductor and MEMS devices significantly affect functional behaviour and reliability. Trusted knowledge on stress amount and sign is a basic need developing new products. Electronics and MEMS devices often demand an extremely high spatial resolution of stress states. Only a few methods, like X-ray / electron diffraction [1, 2] and microRaman spectroscopy [3, 4] have been established as indirect stress measurement tools. Even finite element simulation reaches its limits to predict reliably mechanical stresses, if systems are rather complex and material laws are insufficiently known [5, 6]. Stress measurement by means of FIB based ion milling and subsequent quantification of stress relief pattern is a new approach, published first, 10 years ago [7]. In the meanwhile the method has been utilized and strengthened by several research labs [8-10]. Currently an extensive European program is realized to qualify this method for commercialization and to apply it under industrial conditions [11]. This contribution gives an overview on the measurement method, the current state-of-art on the method qualification, on measurement capabilities and limits. For example, typical research lab applications on thin layer stacks and 3D integration components like TSVs are demonstrated as well.

Published
2016

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