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Optimization of Electronics Assemblies towards Robust Design under Fracture, Delamination and Fatigue Aspects.

Authors :
Auersperg, J.
Klein, M.
Michel, B.
Source :
2007 8th International Conference on Electronic Packaging Technology; 2007, p1-7, 7p
Publication Year :
2007

Details

Language :
English
ISBNs :
9781424413928
Database :
Complementary Index
Journal :
2007 8th International Conference on Electronic Packaging Technology
Publication Type :
Conference
Accession number :
80877696
Full Text :
https://doi.org/10.1109/ICEPT.2007.4441403
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