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2. Atomistic insights into ultrafast SiGe nanoprocessing

3. Impact of surface reflectivity on the ultra-fast laser melting of silicon-germanium alloys

7. Low Temperature Junction Formation for EZ-FET

13. Use of Nanosecond Laser Annealing for Thermally Stable Ni(GeSn) Alloys

14. Polycrystalline silicon PhC cavities for CMOS on-chip integration

16. Multiscale modeling of ultrafast melting phenomena

17. Solid Phase Recrystallization in Arsenic Ion-Implanted Silicon-On-Insulator by Microsecond UV Laser Annealing

19. Enfermedades crónicas no transmisibles, biomarcadores y riesgo suicida. Una revisión de literatura

22. Solid phase recrystallization induced by multi-pulse nanosecond laser annealing

23. Recrystallization of thick implanted GeSn layers with nanosecond laser annealing.

24. A differential Hall effect measurement method with sub-nanometre resolution for active dopant concentration profiling in ultrathin doped Si1−xGex and Si layers

25. Study of recrystallization and activation processes in thin and highly doped silicon-on-insulator layers by nanosecond laser thermal annealing.

26. Eco-Efficiency of the Fisheries Value Chains in the Gambia and Mali

27. Estimation of the melting threshold of Ti supersaturated Si using time resolved reflectometry and haze measurements

29. Co-designing Climate-Smart Farming Systems With Local Stakeholders: A Methodological Framework for Achieving Large-Scale Change

31. Study of recrystallization and activation processes in thin and highly doped Silicon-On-Insulator layers by nanosecond Laser Thermal Annealing

32. Surface-Localized 15R Formation on 4H-SiC (0001) Si-Face by Laser Annealing for Power N-Type MOSFETs

33. Opportunities and challenges brought by 3D-sequential integration

34. A Review of Low Temperature Process Modules Leading Up to the First (≤500 °C) Planar FDSOI CMOS Devices for 3-D Sequential Integration

35. Defect Engineering for Enhanced Silicon Radiofrequency Substrates

37. 28nm FDSOI CMOS Technology (FEOL and BEOL) Thermal Stability for 3D Sequential Integration: Yield and Reliability Analysis

38. First Demonstration of Low Temperature (≤500°C) CMOS Devices Featuring Functional RO and SRAM Bitcells toward 3D VLSI Integration

39. Inter-tier Dynamic Coupling and RF Crosstalk in 3D Sequential Integration

40. Dopant Activation in Ultra-thin SiGeOI and SOI layers characterised by Differential Hall Effect

41. A Differential Hall Effect method with sub-nanometre resolution for active dopant concentration profiling in ultra-thin Si 1-x Ge x and Si doped layers

44. A review of the full 500°C low temperature technological modules development for high performance and reliable 3D Sequential Integration

46. Breakthroughs in 3D Sequential technology

48. Developments in 300mm silicon photonics using traditional CMOS fabrication methods and materials

49. Wrinkles Emerging in SiO2/Si Stack during UV Nanosecond Laser Anneal

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