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In this paper, we carried out a systematic comparison between the enhancement-mode GaN-based fully recessed metal-insulator-semiconductor field-effect transistors (MIS-FETs) and partially recessed MIS-high-electron-mobility transistors (MIS-HEMTs) with the same gate dielectric stack (LPCVD-SiNx/PECVD-SiNx) that has delivered promising long-term reliability and stability. Despite a moderately larger on-resistance (${R}_{ \mathrm{ON}}$), the MIS-FETs deliver superior ${V}_{\text {TH}}$ uniformity and thermal stability. Under long-term gate bias stress, both the MIS-HEMT and MIS-FET deliver similar small positive-bias temperature instability, while the negative-bias temperature instability of the MIS-HEMT is much larger than that of MIS-FET. The MIS-FET also delivers a higher ${V}_{\text {TH}}$ stability than the MIS-HEMT under dynamic gate bias stress. It is suggested that the differences in ${V}_{\text {TH}}$ stability mainly originate from the different spatial separation between the trap states and the conducting channel, with it being larger in MIS-HEMT than in MIS-FET. [ABSTRACT FROM AUTHOR]

In this work, characterizations are conducted to investigate the threshold voltage (VTH) stability of the normally‐off GaN metal–insulator–semiconductor (MIS‐) field‐effect transistor (FET) with fully recessed gate structure and highly reliable low‐pressure chemical vapor deposition SiNx gate dielectric. We conducted bias‐temperature instability (BTI) tests under both positive and negative gate bias. We demonstrated the highly stable VTH of the high‐performance MIS‐FETs with small BTI, which benefits from the effective interfacial protection layer. More specifically, combining the BTI tests and drain current 1/f noise analysis, we present extensive investigation of the physical origins of BTI. According to the experimental evidence and analysis, we ascribe the VTH instability to the trapping/detrapping of the pre‐existing trap states located at the SiNx/GaN interface and/or in the gate dielectric. [ABSTRACT FROM AUTHOR]

In this letter, we investigated the threshold voltage V\text {TH} stability under reverse-bias step-stress in the E-mode LPCVD-SiNx/PECVD-SiNx/GaN MIS-FET. Under the OFF-state reverse-bias stress with the same net gate-to-drain voltage ( V\text {GD} ), the V\text {TH} shift shows an obvious dependence on the negative gate bias. With a V\text {GS} of 0 V, the V\text {TH} shift is small and recoverable, while the V\text {TH} shifts are substantially larger with more negative gate bias ( V\text {GS}=-20 V). This larger V\text {TH} shifts caused by the negative V\text {GS} can be explained with a hole-induced degradation model. An important indication revealed by this model is that negative gate bias should be well confined in high-power switching applications of GaN E-mode MIS-FET for a stable V\text {TH} . [ABSTRACT FROM PUBLISHER]

Improving the energy conversion efficiency of light-emitting diodes (LEDs) for blue light emission has been a continuing pursuit for the past several decades. Here, we report InGaN/GaN LEDs with improved energy efficiency through the simple deposition of multifunctional ultrathin AlN/Al 2 O 3 layers on top of p-type GaN (i.e., GaN:Mg) using remote plasma pretreatment and plasma-enhanced atomic-layer deposition (PEALD). The AlN/Al 2 O 3 stacked layers played principal roles in improving the LED energy efficiency: 1) The surface defect states of p-type GaN were reduced to minimize leakage current and oxidation was prevented by passivating the GaN surface; 2) the net positive charges formed at the AlN/GaN interface enhanced the hole injection rate into the multi-quantum well (MQW) by formation of downward band bending with the increased surface potential; and 3) the increased hole injection rate induced the band-filling effect and screening of internal polarization fields in the MQW. The AlN/Al 2 O 3 stacked layers deposited on the GaN:Mg have overall improved the radiative recombination rate of the InGaN/GaN LEDs and thus light-emission efficiency. X-ray photoelectron spectroscopy was used to characterize the surface potential change of GaN. The peak efficiency values of wall-plug efficiency, the external-quantum efficiency, and the efficacy of the AlN/Al 2 O 3 coated InGaN/GaN LEDs were improved by 29%, 29%, and 30%, respectively. The corresponding efficiency droop rates were decreased by 13%, 6% and 3%, respectively, as compared to those of reference LEDs. [ABSTRACT FROM AUTHOR]

Dynamic ON-resistance ( \mathrm RON ) of 650-V GaN-on-Si lateral power devices with a floating Si-substrate termination is investigated. Compared with the grounded substrate termination, the floating substrate could deliver smaller dynamic \mathrm RON under higher drain bias (> 400 V) switching operation, but leads to larger dynamic \mathrm RON under low-drain bias (< 400 V). The underlying physical mechanisms are explained by the tradeoff between charge storage in the Si substrate and electron trapping effect in the GaN buffer layer. [ABSTRACT FROM AUTHOR]

P-grid is a typical feature in power devices to block high off-state voltage. In power devices, the p-grid is routinely coupled to an external electrode with an Ohmic contact, but Schottky contact to the p-grid is also proposed/adopted for certain purposes. This work investigates the role of contact to p-grid in power devices based on the commonly adopted technology computer-aided design (TCAD) device simulations, with the silicon carbide (SiC) junction barrier Schottky (JBS) diode as a case study. The static characteristics of the JBS diode is independent of the nature of the contact to p-grid, including the forward voltage drop (VF) and the breakdown voltage (BV). However, during the switching process, a Schottky contact would cause storage of negative charges in the p-grid, which leads to an increased VF during switching operation. On the contrary, an Ohmic contact provides an effective discharging path for the stored negative charges in the p-grid, which eliminates the dynamic degradation issues. Therefore, the necessity of an Ohmic contact to p-grid in power devices is clarified. [ABSTRACT FROM AUTHOR]

β-Ga2O3 has been subjected to intense research interest as an ultrawide bandgap semiconductor. The epitaxial growth technique of β-Ga2O3 thin films plays a fundamental and vital role in Ga2O3-based device fabrication. In this work, the epitaxial growth mechanisms of β-Ga2O3 on four low-Miller-index facets, (100), (010), (001), and ( 2 ¯ 01), are systematically explored using large-scale machine-learning molecular dynamics simulations at the atomic scale. The simulations reveal that the migration of the face-centered cubic stacking O sublattice plays a dominant role in the different growth mechanisms between the (100)/(010)/(001) and ( 2 ¯ 01) orientations. The resultant complex combinations of the stacking faults and twin boundaries are carefully identified and show good agreement with experimental observations and ab initio calculations. Our results provide useful insights into the gas-phase epitaxial growth of β-Ga2O3 thin films and suggest possible ways to tailor its properties for specific applications. [ABSTRACT FROM AUTHOR]

In this work, we focused on investigating the transport-limited trapping effects in GaN-on-Si buffer layers as well as impact of the thickness of buffer layers (TBuf) upon such effects. Vertical transport dynamics of charges within the buffer layers and their key energy levels are quantitatively and statistically investigated and analyzed. The results show that an increased TBuf diminishes both impurity conduction of the defect band formed by carbon doping as well as the injection of electrons from the substrate, greatly diminishing the current collapse and improving the stability of the device. Such enhancement is mainly attributed to the reduced vertical electric field within the thickened epitaxy, which provides an additional pathway to address the current collapse and yields more efficient power GaN-on-Si devices. [ABSTRACT FROM AUTHOR]

β -Ga 2 O 3 , known as a next-generation wide-bandgap transparent semiconducting oxide (TSO), has considerable application potential in ultra-high-power and high-temperature devices. However, fabricating a smooth β -Ga 2 O 3 substrate is challenging owing to its strong mechanical strength and chemical stability. In this study, an atomic-scale smoothing method named plasma-enabled atomic-scale reconstruction (PEAR) is proposed. We find that three reconstruction modes, namely, 2D-island, step-flow, and step-bunching, can be identified with the increase in the input power; only the step-flow mode can result in the formation of an atomically smooth β -Ga 2 O 3 surface (S a = 0.098 nm). Various surface and subsurface characterizations indicate that the smooth β -Ga 2 O 3 surface shows excellent surface integrity, high crystalline quality, and remarkable photoelectric properties. The atomic-scale density functional theory-based calculations show that the diffusion energy barrier of a Ga atom is only 0.46 eV, thereby supporting the atomic mass migration induced by high-energy plasma irradiation in the experiment. Nanoscale molecular dynamics simulations reveal that O atoms firstly migrate to crystallization sites, followed by Ga atoms with a lower migration rate; reconstruction mainly proceeds along the <010> direction and then expands along the <100> and <001> directions. The millimeter-scale numerical simulations based on the finite element method demonstrate that the coupling of the thermal and flow fields of plasma is the impetus for PEAR of β -Ga 2 O 3. Furthermore, the smoothing generality of PEAR is demonstrated by extending it to other common TSOs (α -Al 2 O 3 , ZnO, and MgO). As a typical plasma-based atomic-scale smoothing method, PEAR is expected to enrich the theoretical and technological knowledge on atomic-scale manufacturing. [Display omitted] • Plasma-enabled atomic-scale reconstruction (PEAR) is developed to polish β -Ga 2 O 3. • The coupled thermal and flow fields are the impetus for atoms' mass reconstruction. • The reconstruction features of β -Ga 2 O 3 are revealed by multi-scale simulations. • The surface and subsurface quality of oxides can be greatly improved via PEAR. • PEAR shows excellent polishing generality for common semiconducting oxides. [ABSTRACT FROM AUTHOR]

We present evidence of homogenization of atomic diffusion properties caused by C and N interstitials in an equiatomic single-phase high entropy alloy (FeMnNiCoCr). This phenomenon is manifested by an unexpected interstitial-induced reduction and narrowing of the directly experimentally determined migration barrier distribution of mono-vacancy defects introduced by particle irradiation. Our observation by positron annihilation spectroscopy is explained by state-of-the-art theoretical calculations that predict preferential localization of C/N interstitials in regions rich in Mn and Cr, leading to a narrowing and reduction of the mono-vacancy size distribution in the random alloy. This phenomenon is likely to have a significant impact on the mechanical behavior under irradiation, as the local variations in elemental motion have a profound effect on the solute strengthening in high entropy alloys. [Display omitted] [ABSTRACT FROM AUTHOR]

Two-dimensional van der Waals heterostructures with strong intrinsic ferroelectrics are highly promising for novel devices with designed electronic properties. The polarization reversal transition of the 2D ferroelectric Ga 2 O 3 monolayer offers a new approach to tune the photocatalytic and electrical properties of MoS 2 /Ga 2 O 3 heterogeneous bilayers. In this work, we study MoS 2 /Ga 2 O 3 heterogeneous bilayers with different intrinsic polarization using hybrid-functional calculations. We closely investigate the structural, electronic and optical properties of two stable stacking configurations with opposite polarization. The results reveal a distinct switch from type-I to type-II heterostructures owing to polarization reversal transition of the 2D ferroelectric Ga 2 O 3 monolayer. Biaxial strain engineering leads to type-I-to-II and type-II-to-III transitions in the two polarized models, respectively. Intriguingly, one of the MoS 2 /Ga 2 O 3 heterolayers has a larger spatial separation of the valence and conduction band edges and excellent optical absorption ranging from infrared to ultraviolet region under biaxial strain, thus ensuring promising novel applications such as flexible electrical and optical devices. Based on the highly tunable physical properties of the bilayer heterostructures, we further explore their potential applications, such as photocatalytic water splitting and field-controlled switch channel in MOSFET devices.

Electrically interfacing atomically thin transition metal dichalcogenide semiconductors (TMDSCs) with metal leads is challenging because of undesired interface barriers, which have drastically constrained the electrical performance of TMDSC devices for exploring their unconventional physical properties and realizing potential electronic applications. Here we demonstrate a strategy to achieve nearly barrier-free electrical contacts with few-layer TMDSCs by engineering interfacial bonding distortion. The carrier-injection efficiency of such electrical junction is substantially increased with robust ohmic behaviors from room to cryogenic temperatures. The performance enhancements of TMDSC field-effect transistors are well reflected by the low contact resistance (down to 90 Ωµm in MoS 2 , towards the quantum limit), the high field-effect mobility (up to 358,000 cm 2 V -1 s -1 in WSe 2 ), and the prominent transport characteristics at cryogenic temperatures. This method also offers possibilities of the local manipulation of atomic structures and electronic properties for TMDSC device design., (© 2022. The Author(s).)

A two-dimensional (2D) Ga 2 O 3 monolayer with an asymmetric quintuple-layer configuration was reported as a novel 2D material with excellent stability and strain tunability. This unusual asymmetrical structure opens up new possibilities for improving the selectivity and sensitivity of gas sensors by using selected surface orientations. In this study, the surface adsorptions of nine molecular gases, namely, O 2 , CO 2 , CO, SO 2 , NO 2 , H 2 S, NO, NH 3 , and H 2 O, on the 2D Ga 2 O 3 monolayer are systematically investigated through first-principles calculations. The intrinsic dipole of the system leads to different adsorption energies and changes in the electronic structures between the top- and bottom-surface adsorptions. Analyses of electronic structures and charge transport calculations indicate a potential application of the 2D Ga 2 O 3 monolayer as a room-temperature NO gas-sensing device with high sensitivity and tunable adsorption energy using plenary strain-induced lattice distortion.

A novel two-dimensional (2D) Ga 2 O 3 monolayer was constructed and systematically investigated by first-principles calculations. The 2D Ga 2 O 3 has an asymmetric configuration with a quintuple-layer atomic structure, the same as the well-studied α-In 2 Se 3 , and is expected to be experimentally synthesized. The dynamic and thermodynamic calculations show excellent stability properties of this monolayer material. The relaxed Ga 2 O 3 monolayer has an indirect band gap of 3.16 eV, smaller than that of β-Ga 2 O 3 bulk, and shows tunable electronic and optoelectronic properties with biaxial strain engineering. An attractive feature is that the asymmetric configuration spontaneously introduces an intrinsic dipole and thus the electrostatic potential difference between the top and bottom surfaces of the Ga 2 O 3 monolayer, which helps to separate photon-generated electrons and holes within the quintuple-layer structure. By applying compressive strain, the Ga 2 O 3 monolayer can be converted to a direct band gap semiconductor with a wider gap reaching 3.5 eV. Also, enhancement of hybridization between orbitals leads to an increase of electron mobility, from the initial 5000 to 7000 cm 2 V -1 s -1 . Excellent optical absorption ability is confirmed, which can be effectively tuned by strain engineering. With superior stability, as well as strain-tunable electronic properties, carrier mobility, and optical absorption, the studied novel Ga 2 O 3 monolayer sheds light on low-dimensional electronic and optoelectronic device applications.

Using remote N 2 plasma treatment to promote dielectric deposition on the dangling-bond free MoS 2 is explored for the first time. The N 2 plasma induced damages are systematically studied by the defect-sensitive acoustic-phonon Raman of single-layer MoS 2 , with samples undergoing O 2 plasma treatment as a comparison. O 2 plasma treatment causes defects in MoS 2 mainly by oxidizing MoS 2 along the already defective sites (most likely the flake edges), which results in the layer oxidation of MoS 2 . In contrast, N 2 plasma causes defects in MoS 2 mainly by straining and mechanically distorting the MoS 2 layers first. Owing to the relatively strong MoS 2 -substrate interaction and chemical inertness of MoS 2 in N 2 plasma, single-layer MoS 2 shows great stability in N 2 plasma and only stable point defects are introduced after long-duration N 2 plasma exposure. Considering the enormous vulnerability of single-layer MoS 2 in O 2 plasma and the excellent stability of single-layer MoS 2 in N 2 plasma, the remote N 2 plasma treatment shows great advantage as surface functionalization to promote dielectric deposition on single-layer MoS 2 .