351. Refueling: Preventing wire degradation due to electromigration
- Author
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Osman Unsal, Oguz Ergin, Antonio González, Xavier Vera, J. Tschanz, Jaume Abella, Universitat Politècnica de Catalunya. Departament d'Arquitectura de Computadors, and Universitat Politècnica de Catalunya. ARCO - Microarquitectura i Compiladors
- Subjects
Failure analysis ,Electromigration ,Computer science ,Fault tolerance ,ComputerApplications_COMPUTERSINOTHERSYSTEMS ,Integrated circuits ,Hardware_PERFORMANCEANDRELIABILITY ,Reliability engineering ,Design styles ,Hardware and Architecture ,Hardware_INTEGRATEDCIRCUITS ,Circuits integrats ,Electrical and Electronic Engineering ,Informàtica::Arquitectura de computadors [Àrees temàtiques de la UPC] ,Software ,Reliability (statistics) ,Hardware_LOGICDESIGN - Abstract
Electromigration is a major source of wire and via failure. Refueling undoes EM for bidirectional wires and power/ground grids-some of a chip's most vulnerable wires. Refueling exploits EM's self-healing effect by balancing the amount of current flowing in both directions of a wire. It can significantly extend a wire's lifetime while reducing the chip area devoted to wires.
- Published
- 2008
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