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LED has added value as a lighting source in the illμminating industry because of its high efficiency and low power consμmption. In LED production processes, the chip cutting process, which mainly uses a scribing process with a laser has an effect on quality and productivity of LED. This scribing process causes problems like heat deformation, decreasing strength. The inner laser method, which makes a void in wafer and induces self-cracking, can overcome these problems. In this paper, cutting sapphire wafer for fabricating LED chip using the inner laser scribing process is proposed and evaluated. The aim is to settle basic experiment conditions, determine parameters of cutting, and analyze the characteristics of cutting by means of experimentation.

Laser scribing is one of important process in the fields of hard, brittle materials such as silicon and ceramics, films and glasses. To obtain high precision and quality, people should consider all influential factors of laser scribing such as laser scribing parameters and the geometries of specimen size. In this paper, the effect of specimen size on laser scribing width and depth of Al2O3 ceramics was simulated and verified by using ANSYS software and Diode Pumped Solid State laser scribing, respectively. The calculated results and the experimental results all proved that the specimen size had important effect on laser scribing width and depth due to the heat accumulation effect during the laser scribing.

Laser-induced graphene (LIG) has provided a facile and effective strategy for graphene formation via one-step laser scribing on polymer structures. However, the direct utilization of LIG toward multifunctionalization for high-performance fiber-reinforced polymeric composites (FRPs) is rarely explored. Aiming to integrate the laser-induced graphitic structure (LIGS) with FRPs through the most facilitated approach, herein, we innovatively report a self-converted strategy for manufacturing multifunctional LIGS-hybridized FRP-composites (LIGC). By incorporating the laser irradiation process on either pristine or fully-cured epoxy prepregs at different stages of composite manufacturing, two paths of LIGS formation have been naturally developed to respectively implant the designable graphitized patterns interlaminarly or superficially. Benefiting from systematic processing-dependent-structural analysis, diversified properties of LIGC can be modulated for simultaneously achieving the optimized electrical conductivity (~0.74 kΩ/sq) as well as the negligible mechanical degradation (

A methodology for crack propagation using virtual prototyping (VP) is demonstrated. It is based on a classical approach to assess crack propagation, improved with finite element analysis tools. It enables to examine in detail all aspects of crack formation and to evaluate the probability of its occurrence. Performed demonstration is based on Al2O3 substrate laser scribing process and its assessment in direction of possible crack occurrence. Presented study gives basic directions on application of virtual prototyping in crack initiation and propagation prediction. This approach gives the opportunity to monitor various parameters as stresses and to predict influence of various design changes over examined physical process output parameters.

Direct laser writing of graphene electrodes is an emerging research field for the rapid fabrication of two-dimensional carbon electronic materials with wide applications, ranging from supercapacitors and batteries to sensors, electrocatalysts, actuators, etc. Many types of carbon-containing raw materials can be converted to graphene by one-step laser scribing, without complicated chemical synthesis routines, using a variety of lasers. This perspective categorizes the principles of direct laser writing of graphene, according to the different types of raw materials, different types of lasers, and different applications. The future directions of laser synthesized graphene are also discussed.

A novel porous 3D-structured carbon composite material with a unique architecture by combining graphene and carbonized metal-organic framework (C-MOF) (HKUST-1) microrods for high performing supercapacitors has been synthesised and characterised. The HKUST-1 microrods were prepared by a new method, converting their diamond-like shape into microrods via mechanical shear mixing in an aqueous solution. Grinding of HKUST-1 and graphene oxide (GO) resulted in the formation of a 3D GO-MOF composite with intercalated HKUST-1 microrods between GO sheets. The composite film was treated by a laser scribing method and created a highly porous, a high surface area (>600 m²/g) and conductive 3D nanostructured composite film (L-rGO-C-MOF) used as electrodes for supercapacitor applications. The prepared film showed a high capacitance of 390 F/g at 5 mV/s, and a cyclic stability of 97.8% at 10 A/g after 5000 cycles. The symmetrical supercapacitor delivered an excellent power density of 8037.5 W/kg with an outstanding energy density of 22.3 Wh/kg confirming a new pathway to design new 3D porous graphene-MOF composites for high-performance energy storage devices. Refereed/Peer-reviewed

The half-size bifacial silicon solar cells have garnered significant research attention in photovoltaic (PV) modules because they render enhanced power output. Herein, the influence of cutting surface and scribing iteration times on electrical characteristics of bifacial silicon solar cells is investigated in detail. The results reveal that the cutting process should be carried out from the rear side and scribing iteration times should be twice. Moreover, we have studied the cutting losses of n-type passivated emitter and rear totally diffused (n-PERT) bifacial solar cells and demonstrated that not mechanical breaking but laser scribing is a major source of losses during the cell separation process. In addition, the damage induced by the cut was systematically investigated and it was observed that the heat-affected zone resulted in negligible damage under optimal cutting conditions. Overall, n-PERT half-cell bifacial modules, sectioned under optimal cutting conditions, can maintain high efficiency and excellent reliability.

Back end interconnection technology is presented for CIGS using laser scribing and inkjet printing of dielectric material. Shunt-free laser scribing of CIGS is shown, which is essential in the back end approach for monolithic serial interconnection. Full back end interconnected mini-modules of 20x20cm2 were made and show no electrical losses compared to the reference cells. These results show the feasibility of complete module manufacturing after full area deposition of the CIGS stack, enabling cheaper and more flexible production of PV modules.

Soft electroactive devices such as dielectric elastomer actuators have been the subject of research for several decades. One of the reasons they have not found many industrial applications to date is the challenge of manufacturing such devices cost-effectively. 3D printing is now widely used to cut manufacturing time and cost in many industries, but functional and soft materials for 3D printing are still very limited. Here we present a process that could be used to 3D print functional soft, electroactive devices like dielectric elastomer actuators and sensors. We propose a simple, low-cost 3D printing platform that uses direct ink writing of elastomer composites with low filler loading of carbon-based nanoparticles. These composites allow the deposition of smooth, uniform layers as well as rapid curing of printed materials with UV light. A diode laser is then used to induce a chemical transformation of the elastomer to create conductive patterns for electrodes with arbitrary shapes and high detail. The process is still limited by the low elasticity of the laser induced electrode material but if more suitable materials can be found, this process could dramatically reduce the time, cost and complexity involved in manufacturing dielectric elastomer devices while at the same time greatly increasing the possible geometric and functional complexity of the 3D printed devices.

Back end interconnection technology is presented for CIGS using laser scribing and inkjet printing of dielectric material. Shunt-free laser scribing of CIGS is shown, which is essential in the back end approach for monolithic serial interconnection. Full back end interconnected mini-modules of 20x20cm2 were made and show no electrical losses compared to the reference cells. These results show the feasibility of complete module manufacturing after full area deposition of the CIGS stack, enabling cheaper and more flexible production of PV modules. © 2018 IEEE.

In der Arbeit werden Laser-Lift-Off-Prozesse von CIGS-Schichten von einem Mo-Substrat bei einer Wellenlänge von 1342 nm mit Pulsbreiten im ns-Bereich untersucht. Es wird gezeigt, dass dünne CIGS-Schichten durch ns-Laserpulse ablatiert werden können, ohne dass geschmolzene Materialreste am Lasergraben verbleiben. Anhand charakteristischer Merkmale der Lasergräben werden zwei verschiedene Ablationsmechanismen identifiziert. Die experimentellen Ergebnisse werden durch ein Simulationsmodell untermauert, das auf der eindimensionalen Wärmeleitungsgleichung basiert, die modifiziert wurde, um die Absorption von Laserstrahlung einzubeziehen. Das Modell beinhaltet zudem das tiefenabhängige Verhältnis [Ga]/([In]+[Ga]), sowie temperaturabhängige Absorptionskoeffizienten. Mit dem Modell wird der Einfluss bestimmter Probenparameter wie dem [Ga]/([In]+[Ga])-Verhältnis, der Mo-Dicke und Grenzflächenhaftung sowie Laserwellenlänge und Pulsform bewertet und in Bezug auf die experimentellen Daten diskutiert., Laser lift-off ablation processes of CIGS layers from a Mo substrate are investigated at 1342 nm wave length and ns pulse widths. It is shown that ns laser pulses are capable of removing thin CIGS layers without molten residuals which might lead to shunted scribe edges. Two different lift-off mechanisms are identified based on characteristic features of the laser scribes. The experimental results are backed up by an optical thermal model based on the one dimensional heat equation which was modified to include optical laser absorption. The model also incorporates the depth dependent ratio [Ga]/([In]+[Ga]) and temperature dependent absorption coefficients. Based on this model the influence of particular sample parameters like [Ga]/([In]+[Ga]) ratio, Mo thickness and interface adhesion as well as laser wave length and pulse shape are evaluated and discussed in relation to obtained experimental data.

Organic–inorganic halide perovskite solar cells show increasing power conversion efficiencies, approaching the values of silicon-based devices. To date, however, most of the reported record efficiencies for perovskite solar devices are obtained on single cells with active areas significantly below 1 cm2. Hence, demonstrating highly efficient devices with an upscaled active area is one of the key challenges faced by this technology. Here, we demonstrate the successful use of thin-film laser patterning techniques to produce 14 cm2 modules with steady-state aperture area efficiencies as high as 16% and a geometrical fill factor of 92%.

a b s t r a c t Ablation experiments of molybdenum (Mo) thin film on flexible polyimide (PI) substrate are conducted using femtosecond laser pulses focused by an axicon lens. The purpose is to assess the capability of axicon lens in producing narrow grooves and how robustness the scribing process is. We first obtain the damage threshold of Mo and PI and then characterize the spatial beam profile produced by the axicon lens through both theoretical calculations and experimental measurements. Then scribing experiments are performed with different pulse energy, scanning speed, and the distance between the axicon tip and the sample's surface. Optical microscope and atomic force microscope are used to examine the microgrooves from the experiments. It is shown that high quality narrow scribes can be produced with axicon focused beam which can tolerate large height fluctuations of moving flexible substrate expected in an industrial setting.

Graphene-based materials have attracted much attention in recent years. Many researchers have demonstrated prototypes using graphene-based materials, but few specific applications have appeared. Graphene-based acoustic devices have become a popular topic. This paper describes a novel method to fabricate graphene-based earphones by laser scribing. The earphones have been used in wireless communication systems. A wireless communication system was built based on an ARM board. Voice from a mobile phone was transmitted to a graphene-based earphone. The output sound had a similar wave envelope to that of the input; some differences were introduced by the DC bias added to the driving circuit of the graphene-based earphone. The graphene-based earphone was demonstrated to have a great potential in wireless communication.

This paper develops fifth-generation-sized silicon thin-film tandem photovoltaic (PV) modules with animated images. Front PV cell stripes are created using a laser scribing technique, and specially edited and shifted images are printed onto the back glass. After encapsulating the front PV module with the back glass, the animated image effect can then be clearly seen from various positions. The PV module that can display three images has a stabilized power output of 87 W. The remarkable features of this module such as its animated image display, semitransparency, and acceptable power loss give it great potential for use in building-integrated photovoltaics. This paper could help improve the aesthetic appearance of PV modules, which may increase users’ or architects’ willingness to install PV modules on buildings.

Based on recent advancements of radial junction silicon nanowire (RJ SiNWs) solar cells, a demonstration of $5\mathrm{x}5 \pmb{\mathrm{cm}^{2}}$ RJ $\mathbf{SiNW}$ solar mini-module is presented in this work. The $\mathbf{SiNW}$ devices were grown by plasma-assisted vapor-liquid-solid technique at low temperature in a plasma-enhanced chemical vapor deposition reactor. The $\pmb{5\mathrm{x}5\ \mathrm{cm}^{2}}$ mini-modules have been obtained using a commercial laser scribing apparatus. The laser scribing insures a monolithic integration of electrically separated cells. We have obtained a power generation of 10 $\mathbf{mW}$ from 5 individual cells of total active area of 8.6 $\pmb{\mathrm{cm}^{2}}$. The mini-module has an open-circuit voltage of 3.85 V. The performance was evaluated using solar simulator and short comings (high series resistance) were analyzed using a home-made electroluminescence setup.

Graphene-based devices have attracted a lot of researchers' interests due to its excellent mechanical and electrical properties. However, graphene fabrication methods, such as CVD and mechanical exfoliation, have obvious drawbacks. Laser scribing technology is a novel method to fabricate graphene. In this paper, some electron devices based on laser scribed graphene, such as acoustic devices, strain sensors, light-emitting devices and memories shows great potentials for commercialization in the future.

In this paper, we investigate the laser processing of the CIGS thin-film solar cells in the case of the high-speed regime. The modern ultra-short pulsed laser was used exhibiting the pulse repetition rate of 1 MHz. Two main P3 scribing approaches were investigated – ablation of the full layer stack to expose the molybdenum back-contact, and removal of the front-contact only. The scribe quality was evaluated by SEM together with EDS spectrometer followed by electrical measurements. We also modelled the electrical behavior of a device at the mini-module scale taking into account the laser-induced damage. We demonstrated, that high-speed process at high laser pulse repetition rate induced thermal damage to the cell. However, the top-contact layer lift-off processing enabled us to reach 1.7 m/s scribing speed with a minimal device degradation. Also, we demonstrated the P3 processing in the ultra-high speed regime, where the scribing speed of 50 m/s was obtained. Finally, selected laser processes were tested in the case of mini-module scribing. Overall, we conclude, that the top-contact layer lift-off processing is the only reliable solution for high-speed P3 laser scribing, which can be implemented in the future terawatt-scale photovoltaic production facilities.

Robust high-throughput laser scribing processes for monolithic interconnection of Cu(In, Ga)Se 2 absorber based thin-film solar cells were developed, validated and assessed for industrial roll-to-roll production of photovoltaic modules. Here we present results of the FP7-project APPOLO.

This paper reports on a non-invasive, flexible, and wireless pH sensing system for monitoring wound healing progress and identifying the possibility of infection at an early stage. The device consists of a disposable, flexible pH sensor interfaced with a custom-designed, flexible, battery-less and reusable wireless (13.5 MHz, near field communication) data transmitting platform. The sensing electrodes are fabricated by low-cost direct laser scribing of ITO films, resulting in optically transparent sensors which allows for visual inspection of the wound. The sensor accurately measures a physiologically relevant range of pH 4–10 with an average sensitivity of −55 mV/pH.

TFA-MOD process is expected to be promising for future applications since it can produce high performance YBCO coated conductors (CCs) with low cost. Applying YBCO CCs to the power electric devices such as transformers and power cables, the reduction of alternating current (AC) loss for long wire is necessary. Multi-filamentation process, which is one of the most effective approaches for AC loss reduction, has been developed by the scribing process. We have developed the filamentation process using chemical etching. MOD derived CCs are, however, easily damaged in the chemical etching process due to existence of pores in a YBCO layer, resulting in critical current ( I c )-degradation and weak delamination strength. Consequently, it is difficult to scribe MOD derived CCs into 1mm-wide filaments for long length using the chemical etching process. Accordingly, we have studied a scribing process using an excimer laser without chemical etching. We defined P’ value in this study as a function of irradiated laser power [J] divided by processing speed[m/s]. We studied relationship between the P’ value and the results of scribing. It was found that we could scribe the C.C. with a sufficient depth in the condition of large P’ value. Furthermore, we found that the I c was degraded with further increase of the P’ value. A 5 mm wide short sample was divided into 10 filaments by the excimer laser scribing process at the P’ of 9[J/(m/s)]. The sample revealed reduction of the hysteresis loss down to 1/10 which could be expected from a theoretical prediction using the numbers of the filaments. I c -degradation was suppressed as 28%, which was smaller than that of the scribed sample using chemical etching ( I c degradation was 38%). Subsequently, we applied the technique to a 100m long YBCO CC. The hysteresis loss of the 100m long MOD derived CC was reduced down to 1/10 (1/the number of filaments) after the multi-filamentation.

The optimization of laser scribing for the interconnection of CIGS solar cells is a current focus of laser process development. In addition to the geometry of the laser scribes the impact of the laser patterning to the electrical properties of the solar cells has to be optimized with regards to the scribing process and the laser sources. In-process measurements provide an approach for reliable evaluation of the electrical characteristics. In particular, the parallel resistanceR p that was calculated from the measured I–V curves was measured in dependence on the scribing parameters of a short-pulsed ns laser in comparison to a standard ps laser at a wavelength of 1.06 μm. With low pulse overlap of ∼20% a reduction of R p to 2/3 of the initial value has been achieved for ns laser pulses. In comparison to ps laser slightly more defects were observed at the investigated parameter range.

In this work, a graphene loudspeaker is designed using laser scribing technology, and its theoretical model with AC and (AC + DC) excitation is established, which focuses on the effect of different excitations on the performance of graphene loudspeakers. The proposed theoretical model consists of a temperature gradient model and a sound pressure model. The application of (AC + DC) excitation helps to mitigate the frequency doubling effect caused by AC excitation. Sound pressure level (SPL) measurements with AC and (AC + DC) excitations are carried out to verify the theoretical model. The measured results show that the SPL is proportional to the input power and inversely proportional to the measurement distance. The highest SPL produced by the graphene loudspeaker is 53.3 dB with (5 VAC + 5 VDC) excitation. The theoretical model of the graphene loudspeaker with different excitations has a certain reference value for further research on thermoacoustic effects and improving the efficiency of graphene loudspeakers.

Inherently soft electroactive devices will enable a range of novel applications in biomedical, wearable, and robotics technology. In this area, dielectric elastomers (DEs) are particularly promising electromechanical transducers. One major challenge for DEs and other soft devices is the fabrication and precise patterning of thin stretchable conductors. Conventional methods such as pad printing and spray deposition require pre-fabricated molds or stencils, and inkjet printing relies on organic solvents to tune the rheology of inks. In this work, laser-scribed graphene oxide (LSGO) is proposed to fabricate patterned, stretchable electrodes for DE actuators (DEAs). The method uses a low-cost laser engraver that can produce arbitrary patterns with 0.l mm resolution. The process is green (free of organic solvents) and does not require molds or stencils. DEAs with regular and complex LSGO electrodes were fabricated and characterized. In a direct comparison with DEAs made using conductive carbon grease as electrode material, LSGO DEAs show higher maximum actuation strain. Areal strain of 8.8% was observed in a planar LSGO DEA with patterned electrodes.

The core loss of the grain-oriented silicon steel influences the energy loss of transformer. Pulse energy, point spacing, and scribing spacing are the three key parameters of laser scribing process, which determine the core loss of silicon steel. In this study, the relationship between the three key parameters and core loss reduction was investigated and analyzed. Experiments of laser scribing on 30Q130 silicon steel with different parameter combinations were implemented. The results showed that there was no obvious silicon coating burns in the surface of the steel after laser scribing and that the core loss reduction rate (reduction rate) significantly increased with the increasing laser energy density. However, when the energy density exceeded a certain range, the reduction rate decreased and gradually tended to a stable level. Hence, the parameters had significant influence on the reduction rate of core loss, and the two-factor interaction effects of reduction rate of core loss were prominent when parameters of high pulse energy, small point spacing, and small scribing spacing were selected. The optimization combination values of the three key parameters of laser scribing process on 30Q130 silicon steel was acquired by genetic algorithm–enhanced artificial neural network algorithm. For achieving high reduction of core loss, the optimized combination of pulse energy of 2.52 mJ, small point spacing of 0.22 mm, and small scribing spacing of 3.03 mm were selected, and the reduction rate of 13.12 % was verified through experiment.

The core loss of grain oriented electrical steel can be improved by an additional treatment process. For the industrial utilization, the CO2 or Nd:YAG lasers are most widely used for laser scribing with typical core loss improvements of about 10%. In this work, a high power CO2 laser and fiber laser up to 4 kW laser power are investigated under the aspect of industrial utilization. It was found that a specific parameter range for both laser beam sources was necessary to improve the core losses for the applied parameter range. Furthermore, an increase of the core loss improvement of 0.3 mm HiB (High-Permeability) electrical steel was investigated by using the fiber laser compared to the CO2 laser.

State-of-the-art Cu(In,Ga)Se2 thin-film technology allows the industrial production of highly efficient solar modules. A significant growth of CIGS-based solar cell production volume can be expected for the coming years. One of the critical manufacturing steps in module production is thin-film patterning which allows the monolithic integration of cell-to-cell interconnects. Today, solar module manufacturers seek to replace sub-optimal needle scribing by suitable laser processes. It has been demonstrated, that ultra-short pulse laser scribing can reduce the overall width per interconnect and increase scribe quality. A promising tool for picosecond laser-scribing is the fiber laser. Here we present the successful implementation of all fiber laser patterning of CIGS modules.

Due to its particular optical and mechanical properties, fused silica is one of the most relevant materials for the production of optical, opto-mechanical and opto-electrical components and systems. Since such glasses feature a high transmittance in the ultraviolet (UV) spectral range, deep UV-laser irradiation or several hybrid methods are usually applied in laser-based manufacturing of optically operative micro-structures on fused silica substrates. Against this background, the development of novel methods for increasing the UV-absorption temporarily is of great interest for laser scribing of optical gratings, micro optics and integrated optical systems. Here, cost- and energy-efficient plasma treatment techniques at atmospheric pressure offer different approaches that can also be applied to other optical glasses.

This paper focuses on the development of patterned graphene/substrate by means of green nanosecond pulse laser irradiation. Monolayer graphene samples supported on a Si/SiO2 substrate were patterned using 532 nm laser irradiation under fluence conditions ranging from 31 mJ/cm2 and to 4240 mJ/cm2. Raman spectroscopy was used to investigate the effect of laser irradiation on the graphene. It was found that at 356 mJ/cm2 selective ablation of the graphene occurs. However, at fluence values above 1030 mJ/cm2 (when damage to the substrate is observed) no ablation of the graphene takes place. In contrast, its graphenic structure was found to have been modified. Only at fluence values where the ablation of the substrate occurs, is graphene eliminated in an area almost equivalent to that of the ablated substrate. In this case, additional damage to the graphene sheet edges is produced. The increment in the number of oxygenated functional groups in these regions, as measured by XPS spectroscopy, suggests that this damage is probably caused by thermal phenomena during the ablation of the substrate., The research leading to these results has received funding from the European Union’s Research Fund for Coal and Steel research program under Grant Agreement number RFCR-CT-2013-00006 and the European Union Seventh Framework Programme (FP7/ 2007-2013) under grant agreement nº 600849 (INSIDDE Project). Assistance from the Spanish MINECO (project ref: MAT2013-48107-C3-1-R) and the Principado de Asturias-PCTI (Ramon y Cajal research contract [GRUPINN 14-118] of Dr. P. Álvarez and Severo Ochoa pre-doctoral grant of AM. P. Mas) is also acknowledged.

The measurement of contact resistivity between the grid metallization of a solar cell and the underlying silicon wafer is most conveniently performed by cutting strips from solar cells rather than fabricating dedicated structures with variable spaced contacts. We studied the effect of strip width on the measurements and found the lowest values in the range of 10–15 mm. We found laser scribing conditions whereby strips could be successfully isolated on the emitter side without snapping strips from the rest of the cell.

To obtain high precision and quality of laser ceramic scribing , people should consider the laser scribing parameters and the geometries of specimen size. In this paper, the effect of specimen size on laser scribing width and depth of Al 2 O 3 ceramics was simulated and verified by using ANSYS software and Diode Pumped Solid State (DPSS) laser scribing, respectively. The calculated results and the experimental results all proved that the specimen size had important effect on laser scribing width and depth due to the heat accumulation effect during laser scribing.

This study proposes a novel configuration and algorithm to develop real-time online monitoring of ultra-fast scribing process utilizing high speed camera. The target process was ultra-fast low energy scribing processes performed by nanosecond laser. A configuration in which the high speed camera planned out of the scanner head unit and received the reflection light of the micro processing has been developed. Typical applications include process monitoring or determination of a work piece’s orientation during laser processing.This study proposes a novel configuration and algorithm to develop real-time online monitoring of ultra-fast scribing process utilizing high speed camera. The target process was ultra-fast low energy scribing processes performed by nanosecond laser. A configuration in which the high speed camera planned out of the scanner head unit and received the reflection light of the micro processing has been developed. Typical applications include process monitoring or determination of a work piece’s orientation during laser processing.

Within this paper a multiphysical simulation model is presented that is capable for simulating a wide range of laser processes like e.g. laser beam welding, brazing, cutting, drilling or ablation. Some important aspects of the model are explained more in detail and results from test cases are compared with analytical solutions revealing the high accuracy of the model. Finally exemplary results from process simulations on laser beam remote cutting of steel and laser beam scribing of silicon wafers are given.

The optical and electrical properties of LEDs scribed using both traditional and advanced laser scribing were investigated. Variations in scribe line texture and depth were examined and monitored for both laser types using both optical and electron microscopy. Simulation was conducted and verified by the experimental results on laser scribing depth versus LED light output. The metrology techniques also correlated the sidewall roughness with light output of LED between traditional and advanced laser scribing. Improvements by the advanced laser scribing were demonstrated for different LED designs, such as DBR with metal mirrors. Our study showed that the advanced laser scribing is comparable to the sidewall etching process which is the current industrial standard. Our advanced laser scribing system can process different types of metal mirrors on top of DBR structures in a single tool solution. We also presented our latest results on the emerging new substrates of vertical LEDs on Si and other advanced non-sapphire substrates.