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The primary purpose of this testing is to characterize the Texas Instruments LMV7219 comparator for single-event latchup (SEL) susceptibility. These data will be used to assess the Single-Event Latchup (SEL) risk for the OSIRIS-REx Laser Altimeter (OLA). A secondary goal is to assess the susceptibility of the comparator to single-event transients (SET) and other nondestructive Single-Event Effects (SEE).

The primary purpose of this testing was to characterize the Texas Instruments TLV5618 12-bit digital-to-analog converter (DAC) for single-event latchup (SEL) susceptibility. These data will be used to assess the SEL risk for the OSIRIS-REx Laser Altimeter (OLA). A secondary goal is to assess the susceptibility of the DAC to single-event transients (SET), single-event upsets (SEU), and other nondestructive SEE.

This study was undertaken to determine the total ionizing dose (TID) sensitivity of the PA10 Power Op Amp Manufactured by APEX (figure 1), which is a candidate for use on the LDCM TIRS instrument. The test was conducted with interest in both parametric degradation and functional failure in the configuration like that of the TIRS application. (See figure 2). The DUT was irradiated in a stepwise fashion, with parametric and functional degradation measured between steps. The parts were irradiated with gamma rays at a low dose rate (~0.01 rads(Si)/sec.).

This study was to determine the destructive single-event effect (SEE) susceptibility of the DS25BR100 series Low-Voltage Differential Signaling (LVDS) Buffers with Pre-emphasis and Equalization (DS25BR100, 110, and 120). The device was monitored primarily for destructive events while exposing it to a heavy ion beam at the Texas A&M University’s (TAMU) K500 Cyclotron.

Goal: Enable anyone to SPICE-model and design 500 °C durable integrated circuits for their intended application.

How to layout 500 °C durable integrated circuit cells for fabrication by NASA Glenn.

Goal: Enable anyone to SPICE-model and design 500 °C durable integrated circuits for their intended application.

The NASA Engineering and Safety Center (NESC) sponsored a Technical Assessment relating to the utilization of commercial-off-the-shelf (COTS) electrical, electronic, and electromechanical (EEE) parts in spaceflight systems at NASA Centers. The assessment had two primary goals. The first was to capture each NASA Centers’ current practices, best practices, lessons learned and Center-proposed recommendations on the use of COTS EEE parts and assemblies in critical ground support equipment (GSE). The second was to provide recommendations on the use of COTS, including a set of current best practices based on the Centers’ current and best practices and the NESC team’s discussions. One key achievement made by the assessment team was the characterization of the term Industry Leading Parts Manufacturers (ILPMs) as parts manufacturer with high volume automatic production facilities and which can provide documented proof of the technology, process and product qualification, and its implementation of the best practices for “zero defects” for parts quality, reliability and workmanship. The assessment concluded with numerous findings, takeaways and recommendations that will be discussed during this presentation.

The BioSensor is a fully autonomous 3-color LED-based spectrophotometer paired with a fluidics system that supports microbes in liquid culture. Originally developed for the BioSentinel CubeSat mission to study the response of a wild type and mutant strain of yeast to the deep space environment, the BioSensor consists of a series of 16-well, independently plumbed fluidics cards. The cards utilize filters to allow the fluidic system to administer reagents while constraining the microbes in their wells. Heaters on each card incubate to the appropriate growth temperature once the experiment begins. During the active experiment, the LED/detector system measures the transmission of light through each well at three specific wavelengths, similar to a standard benchtop spectrophotometer. The transmission/ absorbance kinetics curves for each well are telemetered back to Earth, along with temperature data, for analysis on the ground. The BioSensor is being upgraded from its original CubeSat free-flyer interface to be a secondary payload on lunar landers, Gateway, and other BLEO applications, while maintaining the same functionality and science utility for future experiments.

Cyclostationary signal processing (CSP) provides the ability to estimate received waveforms' statistical features blindly. Quadrature amplitude modulated (QAM) waveforms, when filtered by the square-root-raised cosine (SRRC) pulse shape function, have cyclic features that CSP can exploit to detect waveform parameters such as symbol rate (SR) and center frequency (CF). The estimation of these SR-CF pairs enables a cognitive radio (CR) to perform spectrum sensing techniques such as spectrum sharing and interference mitigation. Here, we investigate a field-programmable gate array (FPGA) application of a blind symbol rate-center frequency estimator. First, this study provides a background on the theory behind the cyclic spectral density function (CSD), spectral correlation analyzers (SCA), and spectrum sensing. Following this is a discussion on the motivation for CubeSat spectrum sensing. An SCA implementation for low-memory devices, such as FPGA-based CubeSat, is then describes. The paper concludes by reporting the performance characteristics of the newly developed streaming-based SCA.

The Advanced Exploration Systems (AES) Logistics Reduction (LR) project Radio-frequency identification (RFID) Enabled Autonomous Logistics Management (REALM) task focuses on the subset of autonomous logistics management functions pertaining to automated localization and inventory of all physical assets pertaining to, or within, a vehicle utilizing RFID technologies. REALM technology can provide detailed data to enable autonomous operations such as automated crew procedure generation and robotic interaction with logistics and deep space habitats; this is especially of value where communication delays with Earth drive the need for self-reliance. The REALM project will conduct a series of ISS technology demonstrations. The first ISS demonstration, REALM-1, started in February 2017 and was completed at the end of FY19 when it was transitioned to the ISS program for sustaining operations. The second ISS demonstration, REALM-2, started late2019 and will continue for at least one year.

The lecture presents applications of nanotechnology in aeronautic, space and future planetary exploration.

Silicon carbide (SiC) junction field effect transistor and SiC resistor (SiC JFET-R) integrated circuits(ICs) have uniquely demonstrated prolonged operation above 450 °C that promises significant operational improvements to a variety of NASA missions. However, the SiC epiwafers used to fabricate these ICs suffer from epi-growth process immaturity that imparts large and systematic spreads in JFET threshold voltages as a function of the device distance from the center on the wafer. Furthermore, the unprecedently wide range of intended application operating temperatures (in many cases over 600 °C wide) imparts as much as 5-fold change in JFET bias currents. This Technical Memorandum documents methods by which both temperature and radius associated JFET electrical parameter variances can be adequately eliminated, or even exploited in JFET-R circuit designs. Full analog circuit examples, including operational amplifiers, and SPICE simulations across experimentally documented SiC JFET parameter extremes are given to illustrate the efficacy of these methods. The reader may use the examples in this memorandum as either an end point, to get a desired analog signal conditioning design into hardware implemented in SiC JFET-R ICs, or as a basis point from which to derive further improvement.

The primary purpose of this testing is to characterize the Texas Instruments AZ88923 post amplifier for susceptibility to single-event latchup (SEL) and other destructive Single-Event Effects (SEE). These data will be used to assess the destructive SEE risk for the OSIRIS-REx Laser Altimeter (OLA). A secondary goal is to assess the susceptibility of the post amplifier to single-event transients (SET) and other nondestructive SEE. In particular, the loss-of-signal feature could give rise to some significant anomalies. However, it is not used on OLA.

This document, the JSC Engineering Directorate Avionics Ionizing Radiation Effects Standard (AIRES), provides design, test, and analysis requirements to ensure electronic hardware meets functional, performance and reliability requirements in the mission ionizing radiation environment. This suite of activities is referred to as Radiation Hardening Assurance (RHA) and is an integral part of the hardware design process.

In this presentation, the driving factors changing the world of single-event effects (SEE) testing will be discussed. This includes both semiconductor technological advances and morphing space system philosophies. Considerations for meeting these new challenges will then follow.

The Airspace Operations and Safety Program, System-Wide Safety Project /Technical Challenge 2 – Emerging Operations at NASA Langley aims to increase the flight safety of unmanned aerial vehicles (UAV’s) by informing UAV operators of regions of airspace where the radio frequency (RF) power at designated frequencies exceeds threshold values, indicating possible damage or interference with on-board systems. WinProp electromagnetic simulation software, a commercially available ray tracing program, has been implemented to predict radiated power from known RF sources. As a test case, the NextNav geolocation system, with nine transmitters operating at 926.227 MHz, was selected and modeled together with other existing structures at Langley. The radiated power at street level was calculated and compared with measurements taken at street level by a Signal Hound receiver and an Electro-Metrics antenna mounted on a van. The two sets of results generally agreed to within about 5 dB.

Single-event upsets are observed in a 72-layer 3D NAND flash memory operated in single-level cell mode after low-energy proton (500 keV-1.2 MeV) and heavy ion irradiation. The layer-by-layer error count is analyzed to visualize the stopping of low energy protons within the memory stack, and Monte Carlo simulations are correlated with the experimental data. Direct ionization by low-energy protons is identified by three-dimensional data analysis and the energy dependence of device sensitive cross-section. Heavy ion data is also presented for comparison.

A better understanding of the linear energy transfer and the range of proton recoil ions in gallium nitride is necessary to properly evaluate GaN device radiation tolerance. By analyzing the linear energy transfer (LET) and range of recoil heavy ions in GaN we can begin to reproduce the body of knowledge that exists for Si-based devices for this upcoming technology. Although the previous data on older technology has impressive depth and breadth we must be diligent and cautious in the application of these institutional intuitions when applied to emerging technologies such as GaN. As ever increasing materials science advances emerge, a sound methodology for evaluating new technologies must be established in order to apply what we know towards the effort of ensuring radiation tolerance.

Analog single-event transient results are analyzed for two different applications within one system architecture. Application-specific analyses are presented on the MAX4595 commercial device using single-event effects criticality and goal structuring notation.

The purpose of this study is to examine the low dose rate total ionizing dose (TID) susceptibility of the SFT2222A NPN bipolar junction transistor (BJT) manufactured by Solid State Devices, Inc. (SSDI).

1. Session Proposal o Session Title NASA’s In Space Manufacturing and the On Demand Manufacturing of Electronics o Session Topic Primary -- Space Logistics, Autonomy, and Robotics; Secondary – Transformative Research and Technologies o Session Format: Panel Discussion. o Requested Session Duration: 60 minutes o Short Session Description: The goal of NASA’s On Demand Manufacturing of Electronics project is to develop and demonstrate the feasibility of a low-gravity, on-demand manufacturing system for flexible hybrid electronic devices on the International Space Station. This panel will feature several key collaborators and team members from the commercial sector, academia, and internal to NASA, each of which are contributing an unique and vital role to the design and implementation of this new technology system. o Extended Session Description (Please describe in detail the activity proposed, including how you intend to use the requested session duration. This session description will be provided to the reviewers for consideration and will not be displayed in the online agenda.): The session will be moderated by Curtis Hill, the Project Lead for the On Demand Manufacturing of Electronics (ODME), and he will start by giving a brief introduction to the ODME project which is working to produce a demo system for the manufacturing of electronic devices on the International Space Station. Panelists consisting of collaborators and team members to the ODME project will then give a brief (~5 min) introduction highlighting their contributions to the project, followed by time for Q&A from the audience. The panel will consist of: 1. Kenneth Church, nScrypt. nScrypt is a leader in multi-material printing with a modular system that incorporates a direct write thick film print head, a polymer fused filament fabrication print head, a laser sintering attachment, a drill head attachment for milling, and a pick and place. The system can print a layer and scan for accuracy of prints. The combination of multiple print heads and scanning allows for the on-demand production of intricate electronic components. 2. Andy Kurk, TechShot, Inc. Techshot, Inc. has collaborated extensively with NASA on the in space manufacturing of both printed electronics and fused metal materials. They are currently working to develop and integrate a test system for printed electronics, and a flight demonstration on the International Space Station is anticipated in 2024. 3. Ed Hendricks, NextFlex. NextFlex has the goal of advancing the manufacture of flexible hybrid electronics in the U.S. They are working with ODME on the development of AstroSense, an additively manufactured, wireless, flexible, and wearable health sensor. 4. Dr. Pradeep Lall, Auburn University. Professor Lall is the MacFarlane Endowed Distinguished Professor in the Department of Mechanical Engineering with a Courtesy Joint Appointment in the Department of Electrical and Computer Engineering and a Courtesy Joint Appointment in the Department of Finance. He is collaborating with NASA’s ODME project to develop multilayer printable devices and to develop techniques to test the quality of a printed electronic device. 5. Dr. Wei Gao, California Institute of Technology. Professor Gao is an Assistant Professor of Medical Engineering. His group is developing fully printed, flexible, and wearable biosensors for crew health monitoring in collaboration with NASA’s ODME project. In addition, they are working on using sweat to power biofuel cells for wearable, self-powered electronic devices. 6. Beth Paquette, NASA Goddard. The ODME branch at NASA Goddard is spearheading a sounding rocket flight demo to prove the capability of a printed electronic device with multiple sensors. In addition, they focus on thin film and flexible energy storage evaluations. o Session Goal(s)/Outcome(s): Please list the learning objectives and/or tangible outcomes (technical paper or other publication). The goal of this session is to highlight the internal and collaborative efforts of NASA’s On Demand Manufacturing of Electronics project to develop a system for printing electronics that will be tested on the International Space Station in 2024. In addition, the session with facilitate discussion with the community on the state of the art of printable electronics, current challenges, and new avenues for collaboration.

Soldering have a strong effect on performance and reliability of most surface mount technology components, including tantalum capacitors. High quality tantalum capacitors are likely the only type of components where soldering simulation is the first step during screening. Nevertheless, post-soldering failures of tantalum capacitors do happen and require additional analysis. Popcorning is a well-known effect in plastic encapsulated microcircuits (PEM) and it occurs also in chip tantalum capacitors. The sensitivity of parts to the presence of moisture during soldering is characterized by the moisture sensitivity level (MSL); however, contrary to PEMs, there is no standard procedure for establishing MSL for tantalum capacitors, and standard J-STD-020 is applicable partially only. In this work, the effect of absorbed moisture on soldering related degradation and failures in tantalum capacitors have been studied using 22 types of polymer and 11 types of MnO2 cathodes tantalum capacitors including single and multianode parts. The amount of moisture released during soldering has been estimated by measurements of mass and capacitance variations. Results show that moisture uptake in similar parts is approximately two times greater in polymer than in MnO2 capacitors. Cracking of the case and degradation of parameters can occur in both types of parts, but MnO2 capacitors are much more susceptible to catastrophic short circuit failures and their ignition is possible during the first power-on cycle. This type of failure in MnO2 capacitors is lot-related, can occur even at derated voltages and relatively low levels of moisture sorption corresponding to room conditions. Baking before soldering is an effective measure to prevent failures even in lots susceptible to popcorning damage. Recommendations for testing to establish MSL and for baking to reduce the probability of failures are suggested.

In this presentation, the driving factors changing the world of single-event effects (SEE) testing will be discussed. This includes both semiconductor technological advances and morphing space system philosophies. Considerations for meeting these new challenges will then follow.

Time division multiplexing (TDM) is being developed as the readout technology of the X-ray integral field unit (X-IFU), a 3,168-pixel X-ray transition-edge sensor (TES) imaging spectrometer that is part of the European Space Agency's Athena satellite mission. Recent improvements in the low X-ray event count rate performance of TDM have been driven by increases in multiplexer bandwidth and the mitigation of settling transients. These methods and design changes have improved the 32-row multiplexed resolution of a NASA LPA 2.5a array from an initial (2.73 ± 0.03) eV to (1.97 ± 0.01) eV resolution at 5.9 keV. We discuss these recent advances in TDM readout, which have been implemented in an 8-column × 32-row spectrometer that will be deployed at the Lawrence Livermore National Laboratory electron beam ion trap (EBIT) facility, and present a model that will inform the design of future systems.

The purpose of this testing was to perform a Radiation Lot Acceptance Test (RLAT) for Total Ionizing Dose (TID) of MAX4651 Low-Voltage, 4Ω, Quad, SPST, CMOS Analog Switches for the Roman Space Telescope (RST).

Replacement of MnO2 with conductive polymers as cathode materials in chip tantalum capacitors allows for a substantial reduction of the equivalent series resistance (ESR), improvement of frequency characteristics, and elimination of the possibility of ignition during failures. One of the drawbacks of chip polymer tantalum capacitors (CPTCs) is a relatively poor long-term stability at high temperatures. In this work, variations of capacitance, dissipation factor, and ESR in different types of capacitors including automotive grade parts from three manufacturers have been monitored during storage at temperatures from 100 ºC to 175 ºC for up to 18,000 hours. Results show that ESR is the most and capacitance the least sensitive to degradation parameter. Times to parametric failures have been simulated using a Weibull-Arrhenius model that allowed for assessments of activation energies of the degradation and prediction of times to failure at the use temperature. Degradation of CPTCs was explained by thermo-oxidative processes in conductive polymers that result in exponential increasing of the resistivity with time of ageing. This process starts after a certain incubation period that depends on packaging materials and design and corresponds to the time that is necessary to form delamination between the encapsulating molding compound and lead frame. The effectiveness of the existing qualification procedures to assure stable operation of CPTCs is discussed.

This study was undertaken to determine the single event effect (SEE) susceptibility of two different MOSFET components. Heavy-ion testing was conducted at the Lawrence Berkeley National Laboratory (LBNL) Berkeley Accelerator Space Effects (BASE) Facility 88” Cyclotron. Its purpose was to evaluate these devices as candidates for use on Goddard Modular SmallSat Architecture (GMSA) adapter board for the GTOSat project.

This study is to determine the destructive single event effect susceptibility of the Analog Devices ADG201 quad SPST switch. The device under tested (DUT) was monitored for destructive events by exposing it to a heavy ion beam at the Texas A&M University’s (TAMU) K500 Cyclotron.

The purpose of these tests was to characterize the susceptibility of the LSK389 and LSK489 Dual N-Channel JFET from Linear Systems to Single-Event Latchup due to heavy ions and to Total Ionizing Dose (TID) degradation at -65 °C and intermediate dose rate. The test was carried out to assess suitability of the amplifiers for the Ocean Color instrument (OCI) on the Plankton, Aerosol, Cloud, ocean Ecosystem (PACE) spacecraft.

A nanoscale field emission vacuum channel gated diode structure is proposed and a tungsten cathode with an umbrella-like geometry and sharp vertical edge is fabricated. The edge of the suspended cathode becomes the field emission surface. Unlike in the traditional transistor with the gate typically located between the source and the drain, the bottom silicon plate becomes the gate here and the anode terminal is located between the umbrella cathode and the gate. The fabricated devices show excellent diode characteristics and the gated diode structure is attractive for extremely low gate leakage.

The purpose of this presentation is to familiarize the people attending the JEDEC work meetings about the NEPP Program, and recent tasks we have undertaken. There is a description of the policy and testing guidelines in development and an explanation of the Government Working Group, a collaboration of several US government space agencies that come together to discuss topics relating to the reliable use of electronics. The presentation also includes a brief description of NASA events such as the landing of the next Mars rover in Feb 2021.

Total ionizing dose, displacement damage dose, and single event effects testing were performed to characterize and determine the suitability of candidate electronics for NASA space utilization. Devices tested include FETs, flash memory, FPGAs, optoelectronics, digital, analog, and bipolar devices.

This invited paper describes prototype SiC JFET integrated circuit (IC) and packaging technology that has produced arguably the most harsh-environment durable electronics ever demonstrated. Prototype medium-scale integration (MSI) ICs fabricated by NASA Glenn Research Center have successfully operated for over 1 year in 500 °C air-ambient, over 60 days in 460 °C and 9.3 MPa pressure caustic Venus surface environment test chamber, from -190 °C to +812 °C, and radiation exposure through 7 MRad(Si) total ionizing dose and 86 MeV-cm2/mg heavy ion strikes. Recent on-going work focused on upscaling this “go anywhere” IC capability from MSI to large-scale integration (LSI) prototype via benchmark memory ICs is described.

SMD document of TechPort ID's, titles, and short descriptions.

As humans venture to the Moon and beyond, the need for a small, highly sensitive and fast- responding radiation detection device is needed. Research conducted at KSC in collaboration with the University of Central Florida (UCF) and the small business Pegasense investigated the utilization of Passive Surface Acoustic Wave sensors (PSAWs) for radiation monitoring. PSAWs offer advantages over traditional methods of radiation monitoring techniques because of their low cost, compact size, high sensitivity and immediate response times.

This study was undertaken to determine the destructive single event effect and degradation susceptibility of the 80SCL060SCS Schottky diode. The device was monitored for destructive events and degradation in the reverse bias current during exposure to a heavy ion beam at Texas A&M University's K500 Cyclotron.

Electrochemical power sources based on the Li-O2 couple have potential to achieve more than two-times the specific energy that is achievable with state-of-the-art Li-ion technologies. Despite considerable research, significant practical limitations continue to impede the successful realization of the Li-O2 electrochemistry as a power source in electric and hybrid-electric aviation. In practice, power capability and cycle life present formidable challenges. In this work, projections are presented for Li-O2prismatic cells with lightweight construction and the effect of cathode-limited capacity and discharge rate on specific energy and power are presented.

Analog single-event transient results are analyzed for two applications with a system architecture in mind. Application-specific analyses are presented on the MAX4595 commercial device using single-event effects criticality and goal structuring notation.

Total ionizing dose, displacement damage dose, and single event effects testing were performed to characterize and determine the suitability of candidate electronics for NASA space utilization. Devices tested include FETs, flash memory, FPGAs, optoelectronics, digital, analog, and bipolar devices.

Superconductors can carry an order-of-magnitude higher current than room temperature copper wires and can do so with two orders-of-magnitude lower alternating current (AC) electrical losses. These advantages underlie our estimates that turboelectric propulsion of large aircraft can be enabled by superconducting machines. However, even the much smaller losses of superconductors pose thermal management issues at the low temperatures required for superconductivity, and predicting those losses and validating the predictions has been a developing process at NASA Glenn Research Center over the last decade. Since Glenn’s earliest assessments of the feasibility of fully superconducting machines for turboelectric propulsion, the available models of AC losses in superconductors have changed significantly, as well as the state of development of superconducting wire for the coils of electric machines. While the models available to us have improved significantly, the value of the AC losses predicted by these models have only increased as more fidelity was developed. The fabrication of medium temperature superconducting wires (Tc near 40 K) has advanced, and wires can be produced with finer filaments and tighter twisting than a decade ago. However, the ideal wire configurations, developed decades ago for low temperature superconductors (Tc < 25 K), still elude manufacturers of medium and high temperature (Tc > 77 K) superconductors. This report discusses the developments, the current limitations, and the expectations that future configurations of superconducting wire can yet be produced that will provide suitably low AC losses for the aircraft propulsion application. The report presents a basic discussion of the types of AC losses in superconductors, followed by a discussion of the evolution of our understanding of the practical consequences of those AC losses. Next, there is a discussion of the superconducting wire configurations that have been developed, which were partially guided by that understanding. A brief discussion of the modes of removing the heat produced by the losses is presented. Lastly, a comparison is presented between losses in currently available MgB2 wire and other important cases, including copper at room temperature, copper at liquid hydrogen temperature, and expected future MgB2 wire. Room temperature copper has 100 times the loss of today’s MgB2 and 300 times the expected loss of future MgB2. That implies we can expect much higher efficiency from fully superconducting machines than from machines with copper stators, and high efficiency targets remain the driver behind investment in MgB2 development and medium temperature superconductor research.