587 results on '"Adan, Ofer"'
Search Results
152. YieldStar uDBO overlay metrology in Samsung D1y DRAM volume production
153. Study on a feasibility of dark-field illumination for the near-field microscope
154. Area-framing optical defect review under optical resolution using multi-NA dark-field microscopy images
155. Enhanced wafer overlay residuals control; deep sub-nanometer at sub-millimeter lateral resolution
156. Deep learning's impact on pattern matching for design based metrology and design based inspection
157. CD and OCD sampling scheme optimization for HVM environment
158. Casual modeling of yield
159. Applications of machine learning at the limits of form-dependent scattering for defect metrology
160. Detection of particle defect components on silicon wafer with laser induced breakdown spectroscopy combined laser cleaning technology
161. Surface effects in simulations of scanning electron microscopy images
162. Edge placement error measurement in lithography process with die to database algorithm
163. Influence of sidewall perturbations of CD-SEM line roughness metrology
164. Visualization of 3D structure of semiconductor devices by "Dig and See" using GFIS-SIM
165. Process window discovery methodology for extreme ultraviolet (EUV) lithography
166. SEM inspection and review method for addressing EUV stochastic defects
167. Spectroscopic reflectometry in the extreme ultraviolet for critical dimension metrology
168. Multiple beam inspection (MBI) for 7nm node and beyond: technologies and applications
169. New approach for APC and measurement sampler interaction in a complex process mix logic fab
170. Localized power spectral density analysis on atomic force microscopy images for advanced patterning applications
171. Scatterometry and AFM measurement combination for area selective deposition process characterization
172. Focus budget improvement using optimized wafer edge settings
173. 3D optical proximity model optimization using inline 3DSEM metrology
174. Contour based metrology: getting more from a SEM image
175. AI: from deep learning to in-memory computing
176. Intra-field stress impact on global wafer deformation
177. Smart implant-layer overlay metrology to enable fab cycle time reduction
178. Color mixing in overlay metrology for greater accuracy and robustness
179. Edge placement error and line edge roughness
180. Improved accuracy and robustness for advanced DRAM with tunable multi-wavelength imaging and scatterometry overlay metrology
181. High-resolution low-shrinkage CD metrology for EUV resist using high voltage CD-SEM
182. Evaluation of the accuracy and precision of STEM and EDS metrology on horizontal GAA nanowire devices
183. Depth measurement technique for extremely deep holes using back-scattered electron images with high voltage CD-SEM
184. Investigating process variability at ppm level using advanced massive eBeam CD metrology and contour analysis
185. Tilted beam SEM, 3D metrology for industry
186. Optical characterization of multi-NST nanowire test structures using Mueller matrix spectroscopic ellipsometry (MMSE) based scatterometry for sub 5nm nodes
187. Application of PSD for the extraction of programmed line roughness from SAXS
188. Roughness decomposition: an on-wafer methodology to discriminate mask, metrology, and shot noise contributions
189. Linewidth and roughness measurement of SAOP by using FIB and Planer-TEM as reference metrology
190. Unbiased roughness measurements: subtracting out SEM effects, part 3
191. Full structure transistor process monitoring of boron and germanium in PFET EPI using in-line XPS
192. Nano-scale molecular analysis of photo-resist films with massive cluster secondary ion mass spectrometry
193. Quantitative tomography with subsurface scanning ultrasound resonance force microscopy
194. Machine learning for predictive electrical performance using OCD
195. Development of standard samples with programmed defects for evaluation of pattern inspection tools
196. E-beam inspection of single exposure EUV direct print of M2 layer of N10 node test vehicle
197. Gas-enhanced PFIB surface preparation enabled metrology and statistical analysis of 3D NAND devices
198. Statistical significance of STEM based metrology on advanced 3D transistor structures
199. Image quality enhancement of a CD-SEM image using conditional generative adversarial networks
200. Process monitoring using automatic physical measurement based on electrical and physical variability analysis
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