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Visualization of 3D structure of semiconductor devices by "Dig and See" using GFIS-SIM
- Source :
- Proceedings of SPIE; May 2019, Vol. 10959 Issue: 1 p109591Y-109591Y-12, 10849522p
- Publication Year :
- 2019
Details
- Language :
- English
- ISSN :
- 0277786X
- Volume :
- 10959
- Issue :
- 1
- Database :
- Supplemental Index
- Journal :
- Proceedings of SPIE
- Publication Type :
- Periodical
- Accession number :
- ejs50340537
- Full Text :
- https://doi.org/10.1117/12.2514934