101. Manufacturing Benefits of Disilane as a Precursor. for Polycrystalline Silicon Films for the Advanced CMOS Gate Electrode.
- Author
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Yuanning Chen, Haowen Bu, Watts Butler, Stephanie, Cunningham, Kevin L., Shulin Wang, and Spicer, Bill
- Subjects
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POLYCRYSTALLINE semiconductors , *SEMICONDUCTOR wafers , *SEMICONDUCTORS , *TRANSMISSION electron microscopes , *CHEMICAL vapor deposition , *OPTICAL instruments - Abstract
The polycrystalline silicon deposited by single-wafer rapid thermal chemical vapor deposition with both silane (SiH4) and disilane (Si2H6) precursors have been characterized for across wafer uniformity, thickness repeatability, and basic mate- rial properties such as grain structure and surface topography. The results show that the disilane process greatly improves the manufacturabiity of the single-wafer polycrystalline silicon process. Specifically, a ∼50% improvement in the thickness uniformity, ∼25% improvement in surface roughness, arid a significantly less sensitivity of the process to hardware have been achieved with similar particle performance. The grain structure of as-deposited and postimplant and anneal films have been compared by X-ray diffraction and transmission electron microscope. NMOS and PMOS capacitors have been fabricated with poly- crystalline silicon using silane and disilane precursors. The grain structure and electrical parameters, such as gate leakage currents and gate capacitance, show no significant difference between these two precursors. [ABSTRACT FROM AUTHOR]
- Published
- 2005
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