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Stent implantation is a percutaneous interventional procedure that mitigates vessel stenosis, providing mechanical support within the artery and as such a very valuable tool in the fight against coronary artery disease. However, stenting causes physical damage to the arterial wall. It is well accepted that a valuable route to reduce in-stent re-stenosis can be based on promoting cell response to nano-structured stainless steel (SS) surfaces such as by patterning nano-pits in SS. In this regard patterning by focused ion beam (FIB) milling offers several advantages for flexible prototyping. On the other hand FIB patterning of polycrystalline metals is greatly influenced by channelling effects and redeposition. Correlative microscopy methods present an opportunity to study such effects comprehensively and derive structure–property understanding that is important for developing improved patterning. In this chapter we present a FIB patterning protocol for nano-structuring features (concaves) ordered in rectangular arrays on pre-polished 316L stainless steel surfaces. An investigation based on correlative microscopy approach of the size, shape and depth of the developed arrays in relation to the crystal orientation of the underlying SS domains is presented. The correlative microscopy protocol is based on cross-correlation of top-view scanning electron microscopy, electron backscattering diffraction, atomic force microscopy and cross-sectional (serial) sectioning. Various FIB tests were performed, aiming at improved productivity by preserving nano-size accuracy of the patterned process. The optimal FIB patterning conditions for achieving reasonably high throughput (patterned rate of about 0.03 mm2/h) and nano-size accuracy in dimensions and shapes of the features are discussed as well.

Surface roughness (SR) and, especially, the closely related line-edge roughness (LER) of nanostructures are important issues in advanced lithography. In this study, the origin of surface roughness ...

The effect of high frequency (1MHz) acoustic agitation (megasonic agitation) on development of electron beam exposed poly(methylmethacrylate) (PMMA) nanostructures is investigated. Test patterns consisting of dense holes, isolated lines, and gratings with high aspect ratios have been used. Compared to conventional dip development, the sensitivity of the development process is increased and the homogeneity of nanopatterns is improved considerably. Furthermore, experiments towards ultimate aspect ratios and resolution of PMMA in the range of 2–3nm with megasonically assisted development have been carried out. The physical mechanisms for the observed enhanced development performance which is particularly attractive for nanostructuring are discussed.

A high precision alignment concept is evaluated for suitability in UV-based nanoimprint lithography. Through three consecutive alignment steps an overlay accuracy of 50nm is obtained with ample room for further improvements.

An extensive study of parameters pertinent to electron beam lithography with hydrogen silsesquioxane as a negative tone electron beam resist is presented. With higher developer concentrations contrast and reproducibility are improved significantly at the expense of lower sensitivity. In a similar way extended delays between the baking and exposure degrade the sensitivity but increase the contrast. In contrast, at higher baking temperatures the sensitivity is improved but the contrast and reproducibility deteriorate. These results are discussed within a microscopic model. Contrast values as high as 10 and good reproducibility have been obtained with a developer concentration of 25% tetramethyl ammonium hydroxide and a baking temperature of 90 °C. With these optimal parameters an experimental lithographic pattern of 50 nm lines and spaces could be resolved in 220 nm thick HSQ resist film exposed at 50 keV.

Electrically variable shallow junction metal–oxide–semiconductor field effect transistors on silicon on insulator have been fabricated to evaluate the suitability of fabrication processes on a nanoscale. In addition, the limits of scalability have been explored reducing gate lengths down to 12 nm. Specific attention has been paid to the overlay accuracy as required for the fabrication of these double gate structures. The superior quality of hydrogen silsesquioxane (HSQ) as electron beam resist and as mask material is demonstrated. The transistor fabricated exhibits extremely low leakage currents and relatively high on currents. The 8 orders of magnitude difference between the on and off states demonstrates conclusively large potentials for metal–oxide–semiconductor structures with critical dimensions in the 10 nm regime.

Silicon nanowire (SiNW) field effect transistors (FETs) have been widely investigated as biological sensors for their remarkable sensitivity due to their large surface to volume ratio (S/V) and high selectivity towards a myriad of analytes through functionalization. In this work, we propose a long channel (L > 500 nm) junctionless nanowire transistor (JNT) SiNW sensor based on a highly doped, ultrathin body field-effect transistor with an organic gate dielectric epsilon(r) = 1.7. The operation regime (threshold voltage V-th) and electrical characteristics of JNTs can be directly tuned by the careful design of the NW/Fin FET. JNTs are investigated through 3D Technology Computer Aided Design (TCAD) simulations performed as a function of geometrical dimensions and channel doping concentration N-d for a p-type tri-gated structure. Two different materials, namely, an oxide and an organic monolayer, with varying dielectric constants er provide surface passivation. Mildly doped N-d = 1 x 10(19) cm(-3), thin bodied structures (fin width F-w < 20 nm) with an organic dielectric (epsilon(r) = 1.7) were found to have promising electrical characteristics for FET sensor structures such as V-th similar to 0 V, high relative sensitivities in the subthreshold regime S > 95%, high transconductance values at threshold g(m),(Vfg=0V) > 10 nS, low subthreshold slopes SS similar to 60 mV/dec, high saturation currents I-d,I-max similar to 1-10 mu A and high I-on/I-off > 10(4)-10(10) ratios. Our results provide useful guidelines for the design of junctionless FET nanowire sensors that can be integrated into miniaturized, low power biosensing systems. (c) 2013 Elsevier B.V. All rights reserved.

Silicon nanowire (Si NW) sensors have attracted great attention due to their ability to provide fast, low-cost, label-free, real-time detection of chemical and biological species. Usually configured as field effect transistors (FETs), they have already demonstrated remarkable sensitivity with high selectivity (through appropriate functionalisation) towards a large number of analytes in both liquid and gas phases. Despite these excellent results, Si NW FET sensors have not yet been successfully employed to detect single molecules of either a chemical or biological target species. Here we show that sensors based on silicon junctionless nanowire transistors (JNTs), the simplest possible transistors, are capable of detecting the protein streptavidin at a concentration as low as 580 zM closely approaching the single molecule level. This ultrahigh detection sensitivity is due to the intrinsic advantages of junctionless devices over conventional FETs. Apart from their superior functionality, JNTs are much easier to fabricate by standard microelectronic processes than transistors containing p–n junctions. The ability of JNT sensors to detect ultra-low concentrations (in the zeptomolar range) of target species, and their potential for low-cost mass production, will permit their deployment in numerous environments, including life sciences, biotechnology, medicine, pharmacology, product safety, environmental monitoring and security.

A 3D, vertically stacked silicon nanowire (SiNW) field effect transistor (FET) featuring a high density array (7×20) of fully depleted channels has been successfully fabricated by a CMOS compatible process on silicon on insulator (SOI) and functionalized for streptavidin detection for the first time. The channels are surrounded by conformal high-κ gate dielectrics (HfO2), and their conductivity can be uniquely tuned by three gates; a backgate (BG) and two symmetrical Pt side gates (SG) through a liquid, offering unique sensitivity tuning with high gate coupling (SS=75 mV/dec, α'=SS60mV/dec/SSmeasured=0.8, with highest sensitivity=93-99%, obtained for I=1 0pA-10nA, in weak inversion) ever published. © 2013 IEEE.