1,306 results on '"Ryssel, H."'
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52. Cell adhesion on modified polyethylene
53. Comparison of CT with diffusion-weighted MRI in patients with hyperacute stroke
54. Revaskularisation und osteozytäre Wiederbesiedlung avitaler Kortikalis unter Verwendung eines vaskularisierten mit osteogen-andifferenzierten adipogenen Stammzellen besiedelten Scaffolds im Kaninchen-Modell
55. FLYING WAFER - A STANDARDISED METHODOLOGY FOR MULTI-SITE PROCESSING OF 300 MM WAFERS AT R&D-SITES
56. Optical and X-ray characterization of ferroelectric strontium–bismuth–tantalate (SBT) thin films
57. Adhesion and proliferation of keratinocytes on ion beam modified polyethylene
58. On the Influence of Boron-Interstitial Complexes on Transient Enhanced Diffusion
59. Ellipsometric study of polycrystalline silicon films prepared by low-pressure chemical vapor deposition
60. Implantation and annealing of aluminum in 4H silicon carbide
61. Characterization of interface state densitiesby photocurrent analysis: comparison of results for different insulator layers
62. Ion sputtering at grazing incidence for SIMS-analysis
63. Influence of RTP on Vacancy Concentrations
64. The effect of random dopant fluctuations on the minimum channel length of short-channel MOS transistors
65. Reliability of metal-oxide-semiconductor capacitors on nitrogen implanted 4H-silicon carbide
66. Atomistic modeling of high-concentration effects of impurity diffusion in silicon
67. Atomistic analysis of the vacancy mechanism of impurity diffusion in silicon
68. Ion-beam mixed ultra-thin cobalt suicide (CoSi2) films by cobalt sputtering and rapid thermal annealing
69. Preparation and characterization of ultra-thin cobalt silicide for VLSI applications
70. Determination of vacancy concentrations in the bulk of silicon wafers by platinum diffusion experiments
71. Three-dimensional simulation of ionized metal plasma vapor deposition
72. Modeling of chemical–mechanical polishing on patterned wafers as part of integrated topography process simulation
73. Fibroblasts adhesion on ion beam modified polyethylene
74. Electrical characterization and reliability aspects of zirconium silicate films obtained from novel MOCVD precursors
75. Optical characterization of ferroelectric strontium–bismuth–tantalate (SBT) thin films
76. Analysis of trace metals on silicon surfaces
77. Gold and platinum diffusion: The key to the understanding of intrinsic point defect behavior in silicon
78. Phosphorus-enhanced diffusion of antimony due to generation of self-interstitials
79. Calculation of the transport matrix for the coupled diffusion of dopants and vacancies
80. Simulation of the step coverage for chemical vapor deposited silicon dioxide
81. Zirconium silicate films obtained from novel MOCVD precursors
82. Adhesion and proliferation of keratinocytes on ion beam modified polyethylene
83. Local material removal by focused ion beam milling and etching
84. Ultrasonic transducer with silicon: a well known material with new applications
85. Strain profiles in phosphorus implanted (100)-silicon
86. Model for the electronic stopping of channeled ions in silicon around the stopping power maximum
87. Recombination of charge carriers in buried layers formed by high energy oxygen or carbon implantation into silicon
88. Photon Assisted Implantation of B and As in Si
89. In situ ellipsometry for real-time feedback control of oxidation furnaces
90. A novel delineation technique for 2D-profiling of dopants in crystalline silicon
91. Application of advanced contamination analysis for qualification of wafer handling systems and chucks
92. Contamination control and ultrasensitive chemical analysis
93. Activities of the German Ion Implantation Users Group
94. Wafer Contamination by Sputtering and Handling in Ion Implantation
95. Characterisation of BaxSr1−xTiO3 films using spectroscopic ellipsometry, Rutherford backscattering spectrometry and X-ray diffraction
96. Effect of barium contamination on gate oxide integrity in high-k dram
97. MOCVD of titanium dioxide on the basis of new precursors
98. Non-destructive characterization of strontium bismuth tantalate films
99. Development of enhanced depth-resolution technique for shallow dopant profiles
100. Simulation of the influence of via sidewall tapering on step coverage of sputter-deposited barrier layers
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