401. Enhancement of boron solid solubility in Si by point-defect engineering.
- Author
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Lin Shao, Jianming Zhang, Chen, John, Tang, D., Thompson, Phillip E., Patel, Sanjay, Xuemei Wang, Hui Chen, Jiarui Liu, and Wei-Kan Chu
- Subjects
BORON ,SILICON ,NONMETALS ,ION implantation ,ION bombardment ,ENGINEERING - Abstract
The technique of point-defect engineering (PDE), with excess vacancies produced near the surface region by MeV Si ion implantation, has been applied to form ultrashallow junctions with sub-keV B implants. PDE can reduce boride-enhanced diffusion that dominates the enhanced diffusion of ultralow energy B implants. PDE can further sharpen the dopant profile and enhance boron activation. For 1×10
15 /cm2 , 0.5 keV B implant, B solid solubility has been enhanced over a wide temperature range of 750–1000 °C, with an enhancement factor of 2.5 at 900 °C. These features have enabled a shallower and sharper box-like boron junction achievable by PDE in combination with ultralow energy 0.5 keV B implantation. © 2004 American Institute of Physics. [ABSTRACT FROM AUTHOR]- Published
- 2004
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