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We present on a carbon nanoparticle-filled SU-8 photosensitive polymer nanocomposite for use in microelectromechanical systems (MEMS) or microsystems. Exposure and fabrication of the material was carried out using X-ray lithography. The polymer nanocomposite was studied for its electrical, thermal and mechanical characteristics. It was found that at low filler weight percentages, the SU-8 polymer became electrically and thermally conductive. A comparative study of the lithography performance of this functionalized SU-8 to pure SU-8 was also performed. It was determined that UV lithography of the PNC was not suitable for thick films and that by using X-rays, thick film high-aspect-ratio microstructures were achievable. Such results are favorable for many applications such as monolithically integrated polymeric micro-resistive heating elements and polymeric micro-heat sinks.

Since the early 1990s a variety of applications ranging from precision metallic, ceramic, or polymeric parts to complex devices for micro-fluidic and micro-optic applications have been discussed with the assumption that LIGA can either make a significant contribution or is the sole technology able to make these products. The question today is, have individual LIGA groups or even the entire LIGA community achieved this goal? Despite major investments, a lot of hard work from many students and researchers, and some promising “prototypes”, a true mass product made by direct LIGA, i.e., using X-ray lithography and electroplating, has still not entered the market. This paper will briefly present the current status of direct-LIGA technology and discuss some examples of commercialization efforts as well as prospects for high-volume production.

Polymeric microfluidic chips are an enabling component for cost-effective, point of care analytical devices for pharmaceutical, agriculture, health, biological and medical applications. The microfluidic structures can be completed with active elements like pumps and valves as well as sensor components for more complex so called total analysis systems. Often, systems are designed as reader and disposable cartridge where the fluidic structures are simple devices that will be inserted into the reader, which executes the analytical protocol and displays the information in digital form, and disposed after completion of the analysis. In this paper, a hybrid fabrication approach was employed to build a polymeric microfluidic device, so-called sweatstick, suitable for collecting small, precise amounts (600 μl) of human sweat, which were further analyzed for the amount of calcium ions indicating bone mass loss. The device was assembled from different parts fabricated by ultra deep X-ray lithography, precision micro-milling, and molding. Surface treatment of liquid exposed surfaces by oxygen plasma ensures hydrophilic behavior and proper capillary action. Preliminary testing of the device was performed by collecting defined amounts of sweat simulant and determining the calcium ion content using a fluorescent technique. The results for low calcium ion concentration typical for human sweat were excellent and repeatable with variation less than 5% demonstrating the ability to perform indirect bone loss measurements.

In the last years the fabrication of micro components made from ceramic materials became more and more evident with respect to the pronounced chemical stability and the outstanding thermomechanical properties in comparison to plastics and metals. The aim of this work is the lithographic generation of ceramic microstructures avoiding an intermediate molding step using SU8 as pronounced sensitive resist matrix filled with fine ceramic powder in the submicron range. Focus of the research was to investigate the composite formation, patterning by x-ray lithography, developing, debinding and sintering to form stable ceramic parts. The addition of fine ceramic particles to low viscous liquids like SU8-10 leads to an increase of the viscosity. For a successful debinding and sintering a volume content of at least 40% ceramic is required resulting in a change of the viscosity from around 2 Pas up to a value of 1000 Pas at 25 °C and low shear rates. A modified casting procedure was developed for the formation of uniform resist films with a thickness around 300 μm. Optimized exposure and development parameters allow the fabrication of good quality resist structures that can be further transformed into ceramic structures by sintering. Details of the work and results will be presented and discussed in this paper.

A micro corona motor was fabricated using a membraneless built-on X-ray mask. Sharp stator electrodes of this motor ionize air molecules and ionized charges transfer onto the rotor surface, resulting in rotating rotor motions by Coulomb forces. For good performance, the stator’s electrodes should be wide (axial) and have sharp tips. Therefore, X-ray lithography was adopted for precise, high aspect ratio characteristics. To avoid the fabrication difficulty of a membrane X-ray mask, a built-on X-ray mask (conformal mask) technique was employed with negative toned SU-8 photoresist. SU-8 features X-ray fabrication compatibility, X-ray transparency and a large range of thickness. This technique may be suitable for fast fabrication of prototypes or very tall structures, which can be largely affected by printing gaps. For the X-ray built-on mask, 20 μm SU-8 was patterned and 8 μm gold absorber was electroplated on top of the 300 μm PMMA resist. Tests showed good quality pattern transfer from the SU-8 pattern and smooth sidewalls.

Micro bearing systems for Micro Electromechanical Systems (MEMS) have drawn attention for several decades as critical components for micro rotating machinery. Ideally, frictionless bearings are needed, and in practice, micro gas bearings approach the ideal. Typically, bearings function as a separate component, assembled onto sliding counterparts. However, in micro scale devices, assembly procedures are known to be very tedious and time consuming. This leads to the pursuit of single material monolithic structures. Critical issues arising from these approaches include: limitation of materials, friction, and reliability, among others. In this paper, new approaches have been pursued. Micro gas bearings were fabricated as a single component through X-ray lithography. A stainless steel gauge pin, machined to ultra precision, was used as a journal shaft. Simple and very easy assembly processes using self-aligning concepts were developed as an alternative method to conventional assembly. This article presents the design, fabrication, assembly, and testing of micro gas bearings.

With a view to meeting the requirements of high resolution microelectromechanical system applications, we studied high resolution (submicron scale) and high aspect ratio pattern fabrication through x-ray lithography. As a critical part of the x-ray lithography, an x-ray mask should have the properties of high resolution and being a thick absorber. To decrease the scattering effect, a 100 keV e-beam lithography system was used for the fabrication of the high resolution x-ray mask. 3 ?m thick PMMA (polymethylmethacrylate) resist was patterned and 2 ?m thick gold was electroplated onto the patterned resist to form the x-ray mask. Scanning electron microscopy analysis showed that the sidewall and pattern uniformity were sufficient and that the proximity effect did not play a significant role for the selected test patterns. 6 ?m thick PMMA resist was exposed by the x-ray mask; the experimental results proved the feasibility of reproducing submicron features. 0.5 ?m nested patterns with an aspect ratio of 12 were fabricated by this approach.

In this paper, a process for 200 μm high-aspect-ratio micro-optical (HARM) structures fabricated by deep X-ray lithography (DXRL) of polymethylislesuioane-based spin-on glass (SOG) thick films is presented. The SOG material used in the whole procedures is polymethylsilsesquioxane (GR650), which is a kind of sol-gel derived material and can be cured at a reasonable low temperature (75 °C). A technique to cast thick GR650 films was established in the overall process. After consolidation, the GR650 thick films were machined to reach 200 μm uniformly. Then, as negative resists, the GR650 thick films were patterned directly by DXRL. X-ray irradiated regions can be selectively retained with high structural resolution by development in an organic solvent, such as methanol. Parameter screening was done to find minimum and maximum doses needed for patterning/cross-linking, to vary development time, and to explore different film thickness. The whole process is a novel of technique to create HARM structures based on SOG materials without using molds. This technique can be extended to considerably larger structural heights. Surface and bulk compositions of the irradiated films were measured by XPS and Fourier transform infrared spectroscopy. Surface quality by roughness testing system (WYKO RST) was investigated to fabricate the microstructure with a high-accuracy surface.

Micromechanical milling has been shown to be a rapid and direct method for fabricating masks for deep x-ray lithography with lateral absorber features down to 10 micrometers. Conventional x-ray mask fabrication requires complex processes and equipment, and a faster and simpler method using micromechanical milling was investigated for larger microstructures for mesoscale applications. Micromilled x-ray masks consisting of a layered architecture of gold and titanium films on graphite yielded exposures in PMMA with accuracy and repeatability suitable for prototype purposes. A method for compensating milling tool radial runout was adapted, and the average accuracy of mask absorber features was 0.65 micrometers, with an average standard deviation of 0.55 micrometers. The milling process leaves some absorber burrs, and the absorber wall is tapered, which introduces an additional process bias. Mask fabrication by micromilling is fast and, therefore, less costly than conventional mask fabrication processes.

Two advanced processes have been developed for fabricating ultra thick and ultra high aspect ratio (HAR) microstructures. One is the SU-8 based deep X-ray lithography (SU-8 based DXRL) process which uses the normal deep X-ray beam to expose the negative SU-8 resist. Another one is wave length shifter(WLS) based Ultra deep X-ray lithography (WLS-UDXRL) process which uses special ultra deep X-ray beam from wave length shifter to expose the positive PMMA resist. For SU-8 based DXRL process, the typical exposure time of a layer of SU-8 is about 1% of that of PMMA. Even for a few millimeters thick resists the exposure time are just a few minutes. In WLS-UDXRL process, the X-ray beam is strengthened by a wave length shifter(WLS) so the required exposure time for ultra thick PMMA is reduced greatly. In the paper, the characteristic of the these two processes are discussed and the examples of the ultra thick and ultra HAR microstructures fabricated by these processes are presented (ultra thick up to 3600 /spl mu/m and HAR up to 360).

A method to fabricate a high precision X-ray mask for Ultra Deep X-ray Lithography (UDXRL) is presented in this paper by use of a single substrate. Firstly, an 8-μm layer of positive photoresist is patterned on a 500 μm thick beryllium substrate by use of UV lithography and 5 μm gold is electroplated out of a sulfite based commercial plating solution. Secondly, the photoresist is removed and 15 μm of SU-8 is spincoated and baked. The layer of SU-8 is patterned by use of an exposure from the backside of the substrate with a soft X-ray source, followed by post-exposure bake and development. An additional 5 μm layer of gold is electroplated on top of the first gold pattern thereby increasing the total thickness of the absorber on the X-ray mask to 10 μm. After the removal of the SU-8 resist, the second step of the process is repeated by use of a thicker layer of SU-8 (up to 100 μm) to obtain the high-precision and high-aspect ratio absorber pattern. Using this method, the maximum dimensional error of the fabricated gold pattern remains under 1 μm, while the smallest absorber feature size is 10 μm.

Micro production technologies are a driving factor in today’s continuous effort of developing new, highly functional products. The need for increased functionality is met by decreasing the size of individual components as well as consequently miniaturizing components for non-electronic properties including optical, mechanical, and fluidic functions. An important factor in this approach his the right material for a given task and the ability to shape it into the desired geometry as well as to combine micro components in a cost-effective way to build more complex modules and micro systems. One micro production technology that meet several of the above mentioned needs is the LIGA process, a combination of three major fabrication processes — x-ray based micromachining or deep x-ray lithography (DXRL), electroplating, and molding. In x-ray lithography the unique properties of synchrotron radiation, especially high intensity of collimated x-ray photons, permit patterning of extremely precise, very tall primary microstructures up to several millimeters in height with micrometer lateral dimensions and sub-micrometer details (so-called High-Aspect Ratio Microstructures, HARM). These microstructures are attractive for mechanical and optical components in MEMS (MicroElectroMechanicalSystems) devices. While x-ray lithography is crucial to achieve a primary microstructure with superior features, the use of synchrotron radiation is limiting the material choice to only a few polymer materials, so-called x-ray resists. Additional processes including electroplating and molding, however, open up a huge selection of engineering materials such as metals, ceramics, and also a large number of polymers and allow MEMS engineers to combine structural and material properties to build the next generation MEMS devices. This paper is primarily focusing on the DXRL process. Process fundamentals including equipment and infrastructure, x-ray masks, resists, typical structure geometries as well as patterning accuracy will be discussed. A few examples will illustrate ongoing efforts of commercializing this technology and also indicate future areas of applications.Copyright © 2004 by ASME

Micro gas chromatograph (GC) separation columns were fabricated and tested. Rectangular columns with high aspect ratio have inherent benefits over traditional tubular columns and can easily be integrated into a GC sensor system for rapid chromatographic analysis. The 2 m long, 50 μm wide, 500 μm tall columns were fabricated out of electroplated nickel through deep X-ray lithography using the LIGA technique. Critical fabrication issues including reproducible fabrication of compact footprint, deep columns and sealing of the metal columns were addressed. Experiments were conducted to establish the relationship between column head pressure and flow rate. Methane samples analyzed using hydrogen as a carrier gas on uncoated columns showed very little dispersion suggesting that there was no internal leakage in the columns. The sensor performance data compares well with other micro GC sensor systems.Copyright © 2004 by ASME

Challenging requirements in optical and BioMEMS application with high aspect ratios of microstructures in access of 20 and smallest structure details of less than 1 μm have motivated this work to irmpove x-ray mask fabrication. Several approaches to pattern an intermediate x-ray mask with the gold absorber thickness of 1.6-2.2μm using a 1μm thick silicon nitride membrane have been explored. E-beam lithography is employed for primary patterning and experimental results show that high energy (100keV) e-beam lithography is a very promising approach. So-called working x-ray mask can be fabricated from intermediate x-ray mask through x-ray lithography. More than 10μm thick PMMA x-ray resist has been coated on the silicon nitride membrane by multi-coating process without crack. First exposure results indicate that adhesion and stability of sub-micrometer structures wiht these heights is critical. In order to overcome these problems a novel approach has been proposed by coating resist on both sides of the silicon nitride membrane and simultaneous patterning of both sides using x-rays. First successful experimental results have been achieved for proving the feasibility.

The production of X-ray masks is one of the key techniques for X-ray lithography and the LIGA process. Different ways for the fabrication of X-ray masks has been established. Very sophisticated, difficult and expensive procedures are required to produce high precision and high quality X-ray masks. In order to minimize the cost of an X-ray mask, the mask blank must be inexpensive and readily available. The steps involved in the fabrication process must also be minimal. In the past, thin membranes made of titanium, silicon carbide, silicon nitride (2-5μm) or thick beryllium substrates (500μm) have been used as mask blanks. Thin titanium and silicon compounds have very high transparency for X-rays; therefore, these materials are predestined for use as mask membrane material. However, the handling and fabrication of thin membranes is very difficult, thus expensive. Beryllium is highly transparent to X-rays, but the processing and use of beryllium is risky due to potential toxicity. During the past few years graphite based X-ray masks have been in use at various research centers, but the sidewall quality of the generated resist patterns is in the range of 200-300 nm Ra. We used polished graphite to improve the sidewall roughness, but polished graphite causes other problems in the fabrication of X-ray masks. This paper describes the advantages associated with the use of polished graphite as mask blank as well as the fabrication process for this low cost X-ray mask. Alternative membrane materials will also be discussed.

Poly-methylmethacrylate (PMMA), a positive resist, is the most commonly used resist for deep X-ray lithography (DXRL)/LIGA technology. Although PMMA offers superior quality with respect to accuracy and sidewall roughness but it is also extremely insensitive. In this paper, we present our research results on SU-8 as negative resist for deep X-ray lithography. The results show that SU-8 is over two order of magnitude more sensitive to X-ray radiation than PMMA and the accuracy of the SU-8 microstructures fabricated by deep X-ray lithography is superior to UV-lithography and comparable to PMMA structures. The good pattern quality together with the high sensitivity offers rapid prototyping and direct LIGA capability. Moreover, the combinational use of UV and X-ray lithography as well as the use of positive and negative resists made it possible to fabricate complex multi-level 3D microstructures. The new process can be used to fabricate complex multi-level 3D structures for MEMS, MOEMS, Bio-MEMS or other micro-devices.

X-ray lithography is commonly used to build high aspect ratio microstructures (HARMS) in a 1:1 proximity printing process. HARMS fabrication requires high energy X-rays to pattern thick resist layers; therefore the absorber thickness of the working X-ray mask needs to be 10-50 μm in order to provide high contrast. To realize high resolution working X ray masks, it is necessary to use intermediate X-ray masks which have been fabricated using e beam or laser lithographic techniques. The intermediate masks are characterized by submicron resolution critical dimensions (CD) but comparatively lower structural heights (~2 μm). This paper mainly focuses on the fabrication of high resolution X-ray intermediate masks. A three-step approach is used to build the high resolution X-ray masks. First, a so called initial mask with sub-micron absorber thickness is fabricated on a 1 μm thick silicon nitride membrane using a 50KeV e beam writer and gold electroplating. The initial X-ray mask has a gold thickness of 0.56 μm and a maximum aspect ratio of 4:1. Soft X-ray lithography and gold electroplating processes are used to copy the initial mask to form an intermediate mask with 1 μm of gold. The intermediate mask can be used to fabricate a working X-ray mask by following a similar set of procedures outlined above.

The Center for Advanced Microstructures and Devices (CAMD) at Louisiana State University (LSU) supports one of the strongest programs in synchrotron radiation based microfabrication in particular, in deep X-ray lithography (DXRL) in the USA. For taller microstructures above 500 micrometers height, a harder source has been made available at CAMD using a 5-pole 7T super-conducting wiggler that has been installed in one of the straight sections of the synchrotron ring. A beamline and exposure station designed for ultra deep X-ray lithography (UDXRL) has been constructed and connected to the wiggler. An in-air scanner system has been built and installed at the beamline in approximately 10m distance to the source point. The scanner system features a fully water-cooled mask and substrate assembly to allow accurate patterning of high aspect ratio microstructures. The performance of the entire exposure system has been qualified and being proved compatible to standard exposure tools. Simultaneous exposure of a stack of four graphite substrates with 500 micrometers thick PMMA resist layers illustrate the potential for a cost-effective mass production of LIGA microstructures at hard UDXLR sources. The samples have been exposed using a 600 micrometers thick beryllium mask with 50 micrometers gold absorber. Dose calculations for the stacked exposures and preliminary exposure results as well as measurements of patterning accuracy over structure height and structure quality are presented.© (2001) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.

For patterning thick photoresist films, x-ray lithography is superior to optical lithography because of the use of a shorter wavelength and a very large depth of focus. SU-8 negative resist is well suited to pattern tall, high-aspect ratio microstructures in UV optical and x-ray lithography with rapid prototyping capability due to its high sensitivity. The negative tone of the SU-8 resist offers advantages in fabricating multi-level and non-planar microstructures using x-ray lithography or a combination of x-ray and UV optical lithography. In this paper, we present a fabrication process for multi-level metallic mold insert by a combination of multi-layer SU-8 patterning, poly-dimethylsiloxane (PDMS) molding, and nickel electroplating to make final nickel mold inserts that are suitable for injection molding and hot embossing of plastics and ceramics.

Many MEMS applications require multi-level microstructures in which two or more levels have to be aligned to each other in the processing. In this paper a passive alignment system based on a mechanical registration method utilizing reference posts is described. A detailed analysis of the test results was conducted to reveal main error sources and estimate the accuracy of this alignment method. An alignment accuracy of +/- 5(mu) m between 2 layers has been achieved. The further work on improving the alignment accuracy and expending in this alignment method to graphite masks for multi-level X-ray or combined optical/x-ray lithography is proposed.© (2000) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.

The LIGA process is used to fabricate micro-optical benches which allow to mount hybridically active and passive optical components with very high precision and without active alignment. Moreover, also micro mechanical structures like electro-mechanical actuators are fabricated on the same substrate. To avoid any lateral misalignment al fixing structures in the optical bench are produced in the lithography step. Due to the high precision of x-ray lithography lateral tolerances are in the range of 0.1 to 0.2 micrometers depending on thermal distortions. Thus, optical losses for these components are rather small. The potential of the free space concept based on LIGA technology for the fabrication of devices for optical telecommunication has been demonstrated by a bi-directional transceiver module as well as an optical bypass. In the case of the optical bypass element, a movable mirror is fabricated on the substrate together with the fixing elements. This movable mirror is the end face of an electro-static actuator which allows to move the mirror into the collimated light beam between two fibers and thus, change the direction of the light. For the first prototypes the losses in the beam without mirror are about 1.7 dB, whereas the losses in the deflected beam are about 4.5 dB.

Deep-etch x-ray lithography allows the fabrication of micro-optical components with critical lateral dimensions of a few micrometers and structural heights up to several hundred micrometers. Using interferometric methods, the structural tolerances of the side walls of fabricated microstructures are shown to be about 0.3 micrometers per 300 micrometers of structural height. A parallel HeNe laser beam is easily passed through several microprisms, which is evidence for the high precision achievable in positioning micro-optical components on a baseplate. Focussing a light beam by cylinder lenses is also possible. The free two- dimensional shape and the high precision achievable in positioning allow fabrication of micro- optical components with integrated fiber fixing grooves in which multi-mode fibers are precisely positioned. Simple fiber connectors, e.g., fiber forks or Y-couplers, can be achieved. By using a light-guiding resist system, divergence losses can be diminished.© (1991) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.

The advanced requirements of bio-MEMS and MOEMS, i.e., low sidewall surface roughness, submicron critical dimension, and high aspect ratio, necessitate the use of an intermediate mask and a soft x-ray lithography process to fabricate working x-ray masks that are suitable for deep x-ray lithography. Intermediate masks consist of 2 to 2.5-µm gold patterns on membranes/substrates that are highly transparent to x-ray radiation, whereas working masks possess greater than 5 µm of gold patterns. In this work, 1-µm silicon nitride membranes are produced by a low pressure chemical vapor deposition (LPCVD) process on both the front and backside of 100 prime grade wafers and anisotropic wet etch through silicon nitride etch masks. E-beam lithography is used to pattern 0.8- to 3-µm-thick resist layers with submicron resolution. In the case of the 3-µm resist layers, the features are electroplated with approximately 2 µm of gold to form an intermediate mask. The 0.8-µm-thick layers are electroplated with gold up to a thickness of 0.6 µm and form initial masks, which are in turn used in a soft x-ray lithographical process to make intermediate masks. The process of building a high-resolution intermediate x-ray mask, directly by e-beam patterning a 3 µm layer of e-beam resist, followed by gold electroplating, is found to be viable but requires the use of a high energy (>100 keV) e-beam writer. The stability of the resist pattern during soft x-ray lithography (SXRL) by use of an initial mask is found to be problematic. Double-side lithography and gold electroplating, can effectively reduce the aspect ratio of the mask pattern, eliminates the problems associated with the use of an initial mask to fabricate intermediate x-ray masks.