Passive alignment and its application in multilevel x-ray lithography

Many MEMS applications require multi-level microstructures in which two or more levels have to be aligned to each other in the processing. In this paper a passive alignment system based on a mechanical registration method utilizing reference posts is described. A detailed analysis of the test results was conducted to reveal main error sources and estimate the accuracy of this alignment method. An alignment accuracy of +/- 5(mu) m between 2 layers has been achieved. The further work on improving the alignment accuracy and expending in this alignment method to graphite masks for multi-level X-ray or combined optical/x-ray lithography is proposed.© (2000) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.