Search

Contactless plating with electroless solutions can provide self-aligned high-efficiency contacts with very low silver content, using simple and inexpensive equipment. With prior surface activation, it can even be used to metallize both sides of bifacial silicon solar cells simultaneously. However, we observe in such a coplating process with nickel, where surface activation is achieved by immersion plating and thickening by electroless plating, that V oc and fill factor can sometimes significantly decrease with immersion-plating time. To understand the reason for this electrical degradation, we studied the impact of immersion plating on the microstructure of the plated silicon surface. The evolution of the Si-Ni interface was studied by scanning and transmission electron microscopies, energy-dispersive X-ray analysis, secondary ion mass spectrometry, and scanning spreading resistance microscopy. Our attention focused on metal in-diffusion, silicon roughening and etching as the origin for increased recombination. Etching was found to have a significant impact on V oc. The thickness of N + Si etched during Ni deposition can in fact suppress in a few locations most of the field-effect passivation underneath the contacts. This means that a thicker surface field with doping beyond 1019/cm3 must be foreseen under the plated areas, or that the amount of Si lost in the reaction must be reduced. Our observations also confirm that immersion plating can hinder silicide formation and allow Ni in-diffusion, which may be a concern for reliability.

Perovskite/crystalline-silicon (c-Si) tandem solar cells offer a viable roadmap for reaching power conversion efficiencies beyond 30%. In this configuration, however, the silicon cell now mainly receives an infrared rich illumination spectrum where the absorption coefficient of silicon is poor. To boost the light absorption in this wavelength interval, transmitted through the top cell, a solution is to introduce a dedicated nanoscale texture on the front side of the silicon bottom cell and tweaking the optical elements in its design. These optical elements are manifold, with tunable geometrical dimensions, layer thicknesses, and refractive indices. For optically optimizing nanostructured silicon solar cells, electromagnetic wave solving methods, such as the rigorous coupled-wave analysis (RCWA), are normally used but they become computationally infeasible when several design variables are involved in an optimization problem. In this work, a natural selection algorithm, known as the genetic algorithm, is coupled with RCWA for extracting the optimal values of various design parameters in four-terminal perovskite/c-Si tandem devices in parallel. Both two-side-contacted and interdigitated back-contacted silicon heterojunction cell structures, featuring an inverse nanopyramid grating texture on the front, are optimized for five interdependent variables using a genetic algorithm for the bottom cell application and benchmarked against their random pyramid textured analogs. Our study shows that an optimized inverse nanopyramid grating texture can outperform the standard random pyramid texture when considering incidence angle variations. More importantly, the study illustrates how a genetic algorithm can support modeling complex solar cell structures with numerous degrees of freedom.

Utilisation of expensive silicon (Si) material in crystalline Si modules has come down to 4 g Si per watt-peak in 2018, mainly as a result of reduction in wafer thickness and kerf losses as well as increase in module efficiencies. With continued progress in conventional multi-wire sawing of ingots, wafers as thin as 100 mu m could eventually be produced. Beyond this, kerfless lift-off technologies are being investigated which enable wafer thicknesses well below 100 mu m with negligible Si kerf waste. Such thin Si wafers and foils would be much lighter in weight than today's standard 165-180 mu m-thick wafers and would exhibit considerable flexibility and fragility. This necessitates a rethink about how to handle and process thin Si into solar devices in a manufacturing line with high mechanical yield and high throughput. This paper gives a broad overview of the different approaches for fabricating solar cells on thin Si foils. In particular, three routes are discussed in detail, namely (1) freestanding processing of thin Si, (2) processing of thin Si supported mechanically on a conductive low-cost Si substrate ("wafer-equivalent" approach) and (3) processing of thin Si bonded to a transparent glass superstrate. In each case, the main challenges are explained and the recent progress in addressing them are summarised. Kerfless 50 mu m-thick epitaxial Si foils lifted-off using porous Si and thinned-down Si wafers (below 70 mu m) are used as model substrates for this work. The authors gratefully acknowledge the efforts of several people who were involved in this work over the last few years, namely Jonathan Govaerts, Stefano Granata, Menglei Xu, Ergi Donercark, Ivan Sharlandshiev, Shashi Kiran Jonnak, Shruti Jambaldinni, Robert Roozeman, Jarkko Heildcinen, Thomas Kaden, Zuzana Kovacova, Erich Neubauer, Michael Grimm and Kaori Nagaoka. The authors also acknowledge the funding received for this work from the European Commission for the H2020 project CABRISS under grant agreement No. 641972. Imec is a partner in EnergyVille (www.energyville.be), a collaboration between the Flemish research partners KU Leuven, VITO, imec, and UHasselt in the field of sustainable energy and intelligent energy systems. Radhakrishnan, HS (reprint author), Imec Vzw Partner EnergyVille, Kapeldreef 75, B-3001 Leuven, Belgium. sivarama@imec.be

In order to reduce the material cost for silicon solar cells, several research groups are investigating methods to minimize the silicon consumption for making monocrystalline silicon wafers. One promising approach is deposition of an epitaxial layer on porous silicon, followed by detachment of the layer. This contribution discusses improvements in the epitaxial wafer fabrication by optimization of the porosification process. The introduction of a layered porous silicon structure allows to independently improve both epitaxial layer quality and detachment yield. In this way, we have managed to obtain 100µm thick silicon wafers with effective lifetimes up to 1.3ms, and 40µm thick wafers with effective lifetimes up to 700µs. We will also review the current status of the process development for solar cells made on thin wafers. Two approaches are presented. In the first approach, heterojunction solar cells are fabricated on freestanding epitaxial wafers of 40µm thickness. In the second approach, high efficiency (21%) heterojunction back-contacted cells are fabricated on wafers that are bonded to a glass superstrate. Challenges for device processing and limitations in cell performance are discussed.

Fabrication of high-quality ultrathin monocrystalline silicon layers and their transfer to low-cost substrates are key steps for flexible electronics and photovoltaics. In this work, we demonstrate a low-temperature and low-cost process for ultrathin silicon solar cells. By using standard plasma-enhanced chemical vapor deposition (PECVD), we grow high-quality epitaxial silicon layers (epi-PECVD) from SiH4/H2 gas mixtures at 175 °C. Using secondary ion mass spectrometry and transmission electron microscopy, we show that the porosity of the epi-PECVD/crystalline silicon interface can be tuned by controlling the hydrogen accumulation there. Moreover, we demonstrate that 13–14% porosity is a threshold above which the interface becomes fragile and can easily be cleaved. Taking advantage of the H-rich interface fragility, we demonstrate the transfer of large areas (∽10 cm2) ultrathin epi-PECVD layers (0.5–5.5 µm) onto glass substrates by anodic bonding and moderate annealing (275–350 °C). The structural properties of transferred layers are assessed, and the first PECVD epitaxial silicon solar cells transferred on glass are characterized. Copyright © 2016 John Wiley & Sons, Ltd.

Dry plasma etching, commonly used by the Photonics community as the etching technique for the fabrication of photonic nanostructures, could be a source of device performance limitations when used in the frame of silicon photovoltaics. So far, the lack of silicon solar cells with state-of-the-art efficiencies utilizing nanophotonic concepts shows how challenging their integration is, owing to the trade-off between optical and electrical properties. In this study we show that dry plasma etching results in the degradation of the silicon material quality due to (i) a high density of dangling bonds and (ii) the presence of sub-surface defects, resulting in high surface recombination velocities and low minority carrier lifetimes. On the contrary, wet chemical anisotropic etching used as an alternative, leads to the formation of inverted nanopyramids that result in low surface recombination velocity and low density of dangling bonds. The proposed inverted nanopyramids could enable high efficiency photonic assisted solar cells by offering the potential to achieve higher short-circuit current without degrading the open circuit voltage. (© 2016 WILEY-VCH Verlag GmbH &Co. KGaA, Weinheim)

In the frame of the development of thin crystalline silicon solar cell technologies, surface nanopatterning of silicon is gaining importance. Its impact on the material quality is, however, not yet fully controlled.We investigate here the influence of surface nanotexturing on the series resistance of a contacting scheme relevant for thin-film crystalline silicon heterojunction solar cells. Two dimensional periodic nanotextures are fabricated using a combination of nanoimprint lithography and either dry or wet etching, while random pyramid texturing is used for benchmarking. We compare these texturing techniques in terms of their effect on the series resistance of a solar cell through a study of the sheet resistance (Rsh ) and contact resistance (Rc) of its front layers, i.e., a sputtered transparent conductive oxide and evaporated metal contacts. We have found by four-point probe and the transfer length methods that dry-etched nanopatterns render the highest Rsh and Rc values. Wet-etched nanopatterns, on the other hand, have less impact on Rc and render Rsh similar to that obtained from the nontextured case., Authors' post-print version in Abdo et al., IEEE Journal of Photovoltaics, July 2015

Two important aspects for the success of the porous silicon-based layer transfer method in producing kerfless thin ( 15 cm −3 which corresponds to a minimum minority carrier diffusion length of ~670 µm (> 16 times the silicon thickness). With such high quality epitaxial foils combined with high detachment yield, very high efficiency solar devices on thin silicon substrates would be a reality in the near future.

We have studied surface passivation on nanopatterned crystalline silicon (c-Si) wafers (280 µm), thin c-Si wafers (25 µm), ultrathin (~1–6 µm) low temperature epitaxial PECVD and epitaxy-free silicon. Nanopatterned front surfaces were produced by combining nanoimprint lithography with dry or wet etching. The impact of the nanopatterning on the effective lifetime is investigated by means of photoconductance and time-resolved microwave conductivity measurements. Passivation of flat ultra-thin monocrystalline layers by a-Si:H demonstrates effective lifetimes of a few µs. Flat, dry and wet etched c-Si wafers were also passivated by hydrogenated amorphous silicon, thus forming a heterojunction interface. The measured effective lifetimes were 2.2 ms for the flat, 484 μs for the dry and 709 μs for the wet etched wafers, respectively. It is noteworthy that despite the plasma damage associated with the dry etching process, the lifetime measured after passivation remains high enough for the targeted ultrathin solar cells. Solar cells fabricated on wafers nanopatterned via wet etching have reached an open circuit voltage as high as the flat sample thus demonstrating the potential of the use of wet etched nanopatterned surfaces for high efficiency solar cells.

Texturing of crystalline silicon at the light wavelength scale is a promising approach for light management in ever thinner cells. However, this approach requires adapting the device design and process, which has so far revealed to be a challenging task. Indeed, successful integration requires compromising the excellent optical properties for preserving the electrical ones. We briefly summarize what has been learned so far in the community and illustrate some of these learnings with the fabrication and improvement of 1-μ m-thin monocrystalline nanotextured silicon solar cells.

We propose a back reflecting scheme in order to enhance the maximum achievable current in one micron thick crystalline silicon solar cells. We perform 3D numerical investigations of the scattering properties of metallic nanostructures located at the back side and optimize them for enhancing absorption in the silicon layer. We validate our numerical results experimentally and also compare the absorption enhancement in the solar cell structure, both with quasi-periodic and random metallic nanostructures. We have looked at the interplay between the metallic nanostructures and an integrated back reflector. We show that the combination of metallic nanoparticles and a metallic reflector results in significant parasitic absorption. We compared this to another implementation based on titanium dioxide nanoparticles, which act as a Lambertian reflector of light. Our simulation and experimental results show that this proposed configuration results in reduced absorption losses and in broadband enhancement of absorption for ultra-thin solar cells, paving the way to an optimal back reflector for thin film photovoltaics.

We report on the fabrication, integration, and simulation, both optical and optoelectrical, of two-dimensional photonic nanostructures for advanced light trapping in thin crystalline silicon (c-Si) solar cells. The photonic nanostructures are fabricated by the combination of various lithography (nanoimprint, laser interference, and hole mask colloidal) and etching (dry plasma and wet chemical) techniques. The nanopatterning possibilities thus range from periodic to random corrugations and from inverted nanopyramids to high aspect ratio profiles. Optically, the nanopatterning results in better performance than the standard pyramid texturing, showing a more robust behavior with respect to light incidence angle. Electrically, wet etching results in higher minority carrier lifetimes compared to dry etching. From the integration of the photonic nanostructures into a micron-thin c-Si solar cell certain factors limiting the efficiencies are identified. More precisely: (a) the parasitic absorption is limiting the short circuit current, (b) the conformality of thin-film coatings on the nanopatterned surface is limiting the fill factor, and (c) the material damage from dry etching is limiting the open circuit voltage. From optical simulations, the optimal pattern parameters are identified. From optoelectrical simulations, cell design considerations are discussed, suggesting to position the junction on the opposite side of the nanopattern.

A porous silicon-based layer transfer process to produce thin (30-50 μm) kerfless epitaxial foils (epifoils) is a promising approach toward high-efficiency solar cells. For high efficiencies, the epifoil must have high minority carrier lifetimes. The epifoil quality depends on the properties of the porous layer since it is the template for epitaxy. It is shown that by reducing the thickness of this layer and/or its porosity in the near-surface region, the near-surface void size is reduced to

To push silicon solar cells up to their theoretical limit and, in the meantime, minimize the amount of active material employed, many researchers have proposed to fabricate silicon solar cells starting from substrates of 100 μm or below. A considerable number of methods have been proposed to overcome the limitations of the standard sawing technique but, all of them present some drawbacks. One of these methods, the Slim-cut method, exploits the stress-induced by the deposition of a layer on top of a thick silicon substrate to separate a thin silicon foil. This process however did not solve the issues linked to the processing of free-standing foils. In this work we present a flow to process the Slim-cut foils into solar cells by minimizing the number of process steps performed on free-standing foils to just one step. The possibility to tune the thickness of the obtained silicon foil is investigated both by analytical calculations and experimental results. Moreover, a solution to remove the stress-inducing layer compatible with the flow is reported and lifetime measurements of samples bonded on glass demonstrate that the quality of the samples is high enough for the fabrication of solar cells.

In the last decades many techniques have been proposed to manufacture thin (Several parameters can be adjusted to change the morphology and, hence, the properties of the porous layer, both in the porous silicon formation and the succeeding thermal treatment. This work focuses on the effect of the parameters that control the porous silicon formation on the structure of the porous silicon layer after annealing and, more specifically, on the roughness of the top surface. The reported analysis shows how the roughness of the seed layer can be reduced to improve the quality of the epitaxial growth.

Module-level processing of silicon heterojunction interdigitated back-contacted (SHJ-IBC) solar cells while bonded to glass, in the so-called i2-module concept, is discussed. In this approach, a key challenge is the interdigitated patterning of a-Si:H without compromising on the rear-surface passivation. Process adaptations involving more resistant bonding agents and a milder wet etchant enabled bonded cells with the best efficiency of 21.7% and Voc of 734 mV, which are the highest reported for bonded cells processed partially at module level, and which undoubtedly proves the potential of this i2-module concept to reach high Voc and efficiency. Yet another challenge is to make the process flow cost-effective and industrially-relevant, i.e. a litho-free, all-dry process flow, analogous to thin-film PV module fabrication. As a first step, dry etching of a-Si:H was developed to replace wet etching, and was successfully incorporated in a SHJ-IBC process flow to fabricate freestanding cells with the best efficiency of 22.9% and above 20% on thick (190 μm) and thin (56 μm) EVA-bonded silicon.

While the number of techniques for patterning materials at the nanoscale exponentially increases, only a handful of methods approach the conformal patterning of strongly non-planar surfaces. Here, using the direct surface self-assembly of colloids by electrostatics, we produce highly conformal bottom-up nanopatterns with a short-range order. We illustrate the potential of this approach by devising functional nanopatterns on highly non-planar substrates such as pyramid-textured silicon substrates and inherently rough polycrystalline films. We further produce functionalized polycrystalline thin-film silicon solar cells with enhanced optical performance. The perspective presented here to pattern essentially any surface at the nanoscale, in particular surfaces with high inherent roughness or with microscale features, opens new possibilities in a wide range of advanced technologies from affordable photovoltaics and optoelectronics to cellular engineering.

We report on the fabrication of disordered nanostructures by combining colloidal lithography and silicon etching. We show good control of the short-range ordered colloidal pattern for a wide range of bead sizes from 170 to 850 nm. The inter-particle spacing follows a Gaussian distribution with the average distance between two neighboring beads (center to center) being approximately twice their diameter, thus enabling the nanopatterning with dimensions relevant to the light wavelength scale. The disordered nanostructures result in a lower integrated reflectance (8.1%) than state-of-the-art random pyramid texturing (11.7%) when fabricated on 700 µm thick wafers. When integrated in a 1.1 µm thin crystalline silicon slab, the absorption is enhanced from 24.0% up to 64.3%. The broadening of resonant modes present for the disordered nanopattern offers a more broadband light confinement compared to a periodic nanopattern. Owing to its simplicity, versatility and the degrees of freedom it offers, this potentially low-cost bottom-up nanopatterning process opens perspectives towards the integration of advanced light-trapping schemes in thin solar cells. ispartof: Optics Express vol:24 issue:2 pages:A191-A201 ispartof: location:United States status: published

Crystalline Si (c-Si) technology is dominating the photovoltaics market. These modules are nonetheless still relatively expensive, in particular because of the costly silicon wafers, which require large thickness mostly to ease handling. Thin-film technologies, on the other hand, use much less active material, exhibit a much lower production cost per unit area, but achieve an efficiency still limited on module level, which increases the total system costs. A meet-in-the-middle is possible and is the object of this paper. The development of c-Si thin-foil modules is presented: first, the fabrication of the active material on a glass module and then the processing of the Si foils into solar cells, directly on module level. The activity of IMEC in this area is put into perspective with regard to worldwide research results. It appears that great opportunities are offered to this cell concept, although some challenges still need to be tackled before cost-effective and reliable industrial production can be launched. Copyright © 2012 John Wiley & Sons, Ltd.

Monolithic solar modules made from thin-film crystalline-silicon layers of high quality on glass substrates could lower the price of photovoltaic electricity substantially. This paper describes three different approaches that we are currently investigating to address the challenge to form high-quality crystalline-silicon layers on glass substrates. The SLiM-Cut approach is a wafering technique that results in 50-micron thick layers with a minimum of material loss. We show that crack initiation can be used as a means to better control the lift-off process. The epifree approach involves the lift-off of ultra-thin monocrystalline films formed by reorganization of cylindrical macropore arrays in silicon upon annealing. So far, films with a thickness of around 1 μm and very simple cells with an efficiency of up to 4.1% have been achieved. Finally, a seed layer approach is presented based on the epitaxial thickening by thermal CVD of monocrystalline silicon layers bonded on glass-ceramic substrates. Very promising cell efficiencies of 11% and Voc values of up to 610 mV have been achieved using a very simple and non-optimized cell structure.

This work initiates an investigation of the impact of high-temperature annealings on the material quality of reusable substrates for an "Epifree" solar-cell process, where the substrate itself provides the active layer of the cell. The minority-carrier lifetime of simple bulk wafers is monitored by photoconductance decay and the mechanisms affecting it are explored by deep-level transient spectroscopy. The lifetime is found to drop from the first annealing and then to stabilize to values sufficient for solar-cell application, at a minimum of 101 μs. The amplitude of this drop is strongly related to the wafer type (MCz or Cz) and no major recombination center could be identified as possible cause.

The “Epifree” process involves the lift-off of a high-quality monocrystalline film formed by reorganization upon annealing of cylindrical macropore arrays in silicon, and can thus provide high-quality silicon films without resorting to costly epitaxy. The challenge of this new process lies in etching controlled and regular pores in silicon in a cost-efficient way, and in developing a process compatible with the difficulty of handling a micron-thin material. Proof-of-concept cells have previously been achieved and this paper presents the latest progress, with a first development of thicker films and the inclusion of rear-side passivation. The energy-conversion efficiency of 1-µm-thin Epifree cells was improved from 2.6 to 4.1% by depositing a stack of amorphous silicon (a-Si) layers as rear-side passivation. The increase in Voc was, however, limited and bound to a drop in Jsc. The choice of a-Si was revealed to be unsuitable because of the thinness of the film and the presence of a full aluminum rear contact. The thinness of the film leads to a decrease in rear-side reflectivity by the a-Si absorption, and the aluminum, although not leading to crystallization, partly migrates inside the a-Si stack upon anodic bonding as shown by TEM. These factors indicate that an alternative surface passivation should be developed. In parallel to process developments, the material was thickened by modifying the macropore array dimensions, leading to a 2.4-µm-thick material over 1 cm × 1 cm areas. The efficiency of the next cells is expected to increase with this thicker material. Copyright © 2010 John Wiley & Sons, Ltd.

To answer the challenge of obtaining thinner silicon solar cells, we developed a technique based on the transfer of a thin layer of high-quality monocrystalline silicon to a foreign low-cost substrate. The transfer is enabled by the reorganisation of macroporous silicon at high temperature: driven by the minimisation of their surface energy, pores close and, in specific situations, merge to form a large single void, a few micrometers under the wafer surface. As demonstrated in this paper, the micron-thick film above it may be detached and used to process a solar cell. The difficulty of this approach lies in appropriately ordering the macropores, while its originality is to enable processing of a high-quality material directly from porous silicon. (© 2009 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)

To answer the challenge of less expensive renewable electricity, the photovoltaics community is focusing on producing thinner silicon solar cells. A few years ago, in the field of silicon-on-nothing structures, micron-thick monocrystalline layers suspended over their parent wafer were produced by high-temperature annealing of specific arrays of macropores. Those macropores reorganise into one single void and leave a thin overlayer on top. Since this method may be an inexpensive way of fabricating high-quality silicon films, this paper investigates its potential for photovoltaic applications. In particular, we investigated if large surfaces can be produced and transferred to foreign substrates with this method. We fabricated basic solar cells, without rear-surface passivation, on 5 cm × 5 cm-large and 1-μm-thick films transferred to glass, that showed energy-conversion efficiencies up to 2.6%. These cells demonstrate the feasibility of the presented concept as a layer-transfer process for solar-cell application. After formation by annealing, the film is only barely attached to its parent wafer, but can still safely be handled provided that any abrupt gas flow or pumping to vacuum is avoided. After transfer and permanent bonding, the sample can be handled as any bulk wafer.

Thin layers of silicon for solar cells can be lifted-off from wafers by taking advantage of the property of macropores to reorganise at high temperature and, in specific conditions, to form a high-quality layer on top of an empty space. Those conditions need to be identified and this work focuses in particular on the annealing ambient composition. Its influence was investigated by scanning and transmission electron microscopy and by Fourier-transform infrared spectroscopy. Apart from hydrogen, which has been used in previous studies, argon was found to be also compatible with the reorganisation. This result points out that the presence of oxygen impurities may not be as deleterious as expected, but that those impurities complicate the set of reactions taking place during the high-temperature process.

The growth of well-defined regular columnar macropores under front-side illumination on medium doped n-type silicon has been investigated. The various morphologies observed, with branched or columnar pores, differ from those reported so far on substrates of both higher and lower resistivities. Unlike stated by the macropore growth model, current density is found to influence the pore growth rate. These observations indicate that, under the conditions used in this work, the pore growth is at the border between meso- and macroporous mechanism. (© 2007 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)

We present an improved process for free-standing monocrystalline silicon (FMS) thin film solar cells developed at IMEC. We demonstrate that a thick annealed porous layer, or the quasi-monocrystalline silicon (QMS) layer, incorporated into a two-side contacted thin film solar cell structure does not produce any considerable series resistance. The best cell so far exhibits a conversion efficiency of 12.6% with a fill factor of 75.7% for an active layer thickness of 20 μm. This cell process includes emitter formation by phosphorous diffusion, silicon nitride deposition for antireflection coating and front surface passivation, and 50-μm-thick annealed porous layer remained on the rear. Despite the expected small reduction in solar cell's efficiency, maintaining the porous layer in the device structure renders the processing and handling of the thin FMS film much easier, thus leading to a better yield and up-scalability. PC1D simulations show that a thick QMS layer can lessen the short circuit current density in some degree, depending on the active layer quality, thickness, optical confinement, etc., while the other cell parameters remain substantially unvaried; a 10% to 15% higher process yield is expected to be sufficient to reach a break-even between the two processes.

Introducing nanophotonics into photovoltaics sets the path for scaling down the surface texture of crystalline-silicon solar cells from the micro-to the nanoscale, allowing to further boost the photon absorption while reducing silicon material loss. However, keeping excellent electrical performance has proven to be very challenging, as the absorber is damaged by the nanotexturing and the sensitivity to the surface recombination is dramatically increased. Here we realize a light-wavelength-scale nanotextured monocrystalline silicon cell with the confirmed efficiency of 8.6% and an effective thickness of only 830 nm. For this we adopt a self-assembled large-area and industry-compatible amorphous ordered nanopatterning, combined with an advanced surface passivation, earning strongly enhanced solar light absorption while retaining efficient electron collection. This prompts the development of highly efficient flexible and semitransparent photovoltaics, based on the industrially mature monocrystalline silicon technology.

In this study nanodisks made from aluminum are incorporated in a back-reflector scheme in order to enhance the maximum achievable current in one-micron thick crystalline silicon solar cells. We perform three-dimensional numerical investigations of the backward scattering properties of aluminum nanodisks located at the back side, and optimize them for enhancing the absorption in the silicon layer. We also compare our results with previously optimized silver nanodisks and show that Al nanodisks are nearly as efficient as Ag counterpart. We show that if the absorption in the metallic back reflector (flat metal layer) can be avoided; this results in a further enhancement in absorption in the ultra-thin silicon layer. The proposed configuration results in a broadband (500nm to 1200nm) enhancement of absorption (~ 58 %) for ultra-thin solar cells and has a great potential in thin film photovoltaic.

A 2-D photonic crystal was integrated experimentally into a thin-film crystalline-silicon solar cell of 1-{\mu}m thickness, after numerical optimization maximizing light absorption in the active material. The photonic crystal boosted the short-circuit current of the cell, but it also damaged its open-circuit voltage and fill factor, which led to an overall decrease in performances. Comparisons between modeled and actual optical behaviors of the cell, and between ideal and actual morphologies, show the global robustness of the nanostructure to experimental deviations, but its particular sensitivity to the conformality of the top coatings and the spread in pattern dimensions, which should not be neglected in the optical model. As for the electrical behavior, the measured internal quantum efficiency shows the strong parasitic absorptions from the transparent conductive oxide and from the back-reflector, as well as the negative impact of the nanopattern on surface passivation. Our exemplifying case, thus, illustrates and experimentally confirms two recommendations for future integration of surface nanostructures for light trapping purposes: 1) the necessity to optimize absorption not for the total stack but for the single active material, and 2) the necessity to avoid damage to the active material by pattern etching., Comment: Authors' postprint version - Editor's pdf published online on Nov. 5

Patterning the front side of an ultra-thin crystalline silicon (c Si) solar cell helps keeping the energy conversion efficiency high by compensating for the light absorption losses. A super-Gaussian mathematical expression was used in order to encompass a large variety of nanopattern shapes and to study their influence on the photonic performance. We prove that the enhancement in the maximum achievable photo-current is due to both impedance matching condition at short wavelengths and to the wave nature of light at longer wavelengths. We show that the optimal mathematical shape and parameters of the pattern depend on the c Si thickness. An optimal shape comes with a broad optimal parameter zone where fabricating errors would have much less influence on the efficiency. We prove that cylinders are not the best suited shape. To compare our model with a real slab, we fabricated a nanopatterned c Si slab via Nano Imprint Lithography., 21 pages, 7 figures

International audience; In this paper, we present the integration of an absorbing photonic crystal within a monocrystalline silicon thin film photovoltaic stack fabricated without epitaxy. Finite difference time domain optical simulations are performed in order to design one-and two-dimensional photonic crystals to assist crystalline silicon solar cells. The simulations show that the 1D and 2D patterned solar cell stacks would have an increased integrated absorption in the crystalline silicon layer would increase of respectively 38% and 50%, when compared to a similar but unpatterned stack, in the whole wavelength range between 300 nm and 1100 nm. In order to fabricate such patterned stacks, we developed an effective set of processes based on laser holographic lithography, reactive ion etching and inductively coupled plasma etching. Optical measurements performed on the patterned stacks highlight the significant absorption increase achieved in the whole wavelength range of interest, as expected by simulation. Moreover, we show that with this design, the angle of incidence has almost no influence on the absorption for angles as high as around 60°.

In this paper, we present the integration of an absorbing photonic crystal within a monocrystalline silicon thin film solar cell stack. Optical simulations performed on a complete solar cell revealed that patterning the epitaxial monocrystalline silicon active layer as a 1D and 2D photonic crystal enabled to increase its integrated absorption by 38% rel and 50% rel in the whole 300-1100 nm range, compared to a similar but unpatterned stack. In order to fabricate such promising cells, a specific fabrication process based on holographic lithography, inductively coupled plasma etching and reactive ion etching has been developed and implemented to obtain such photonic crystal patterned solar cells. Optical measurements performed on the patterned stacks highlight the significant absorption enhancement, as expected by simulation. A more advanced structuration combining a front and a rear 1D binary photonic patterning with different periods is designed, enabling a 60% abs larger absorption in silicon.

Foil creation by lifting off a thin layer of a high quality silicon substrate is one of the promising substitutes for wafer sawing to create substrates thinner than 100 µm. The porous silicon-based layer transfer process is a well known method to obtain high quality foils. Despite a number of convincing lab-based solar cell show-cases, there is no breakthrough of this technology at (semi)-industrial level, because of the poor yield of processing free standing foils. This paper presents a method to fabricate back contacted solar cells based on epitaxial foils avoiding processes on free-standing foils. First, a porous silicon layer is electrochemically etched, acting as a weak sacrificial layer to detach the foil that is epitaxially grown on top of the porous silicon layer. Characterization of the epitaxial foils shows a good crystalline quality and an effective lifetime around 100 µs. Those results give indications that the obtained foils are well suited for solar cell fabrication. Front-side processing is done while the epitaxial foil is still attached to its parent substrate. A good yield is obtained for epitaxial foils that underwent the front-side processing sequence consisting of wet chemical texturing, FSF formation, passivation and ARC deposition. Afterwards, the front-side of the foil is bonded to a glass carrier and the foil is detached from its parent substrate. Silicone adhesives are used for this permanent bond. The rear-side of the solar cell is processed while bonded to glass. Therefore, only low temperature processes (

The effect of silver nanoparticles showing localised plasmonic resonances on the efficiency of thin film silicon solar cells is studied. Silver (Ag) nanodiscs were deposited on the surface of silicon cells grown on highly doped silicon substrates, through hole-mask colloidal lithography, which is a low-cost and bottom-up technique. The cells have no back reflector in order to exclusively study the effect of the front surface on their properties. Cells with nanoparticles were compared with both bare silicon cells and cells with an antireflection coating. We optically observe a resonance showing an absorption increase controllable by the disc radius. We also see an increase in efficiency with respect to bare cells, but we see a decrease in efficiency with respect to cells with an antireflection coating due to losses at wavelengths below the plasmon resonance. As the material properties are not notably affected by the particles deposition, the loss mechanism is an important absorption in the nanoparticles. We confirm this by numerical simulations.

Light scattering from ZnO nanorods (NR) is investigated, modeled, and applied to a solar cell. ZnO NR (120-1300 nm long, 280-60 nm large), grown by low-cost chemical bath deposition at 90 degrees C, exhibit diffused-to-total transmitted light as high as 70% and 30% in the 400 and 1000 nm wavelength range, respectively. Data and scattering simulation show that ZnO NR length plays a crucial role in light diffusion effect. A transparent ZnO NR film grown on glass and placed on top of a 1 mu m thick c-Si solar cell is shown to enhance the light-current conversion efficiency for wavelengths longer than 600 nm. (C) 2015 AIP Publishing LLC.

This paper describes our progress achieved in thin-film free-standing monocrystalline silicon (FMS) solar cells by layer transfer process using porous silicon. The highest cell efficiency achieved for a 1times1 cm2 FMS solar cell is 13.5% with an open circuit voltage Voc=612 mV, current density Jsc =28.9 mA/cm2 and fill factor of FF=76.7%. In the effort of scaling-up of the cell area, the lift-off process was adapted to 10times10 cm2 substrates. The large-area epilayers from APCVD and LPCVD, respectively, were successfully processed into FMS solar cells, giving the best efficiency of 11.4% for the APCVD-FMS cell with an area of 11.1 cm2. Detailed study by quantum efficiency measurements, combined with SEM, revealed that the enhanced internal quantum efficiency and reflectance in the spectral range of lambda>825 nm for the APCVD-FMS cell can be attributed to the internal light reflection from the well-defined interface between the epilayer and the sintered porous, or quasi-monocrystalline silicon (QMS) layer

We report on the drastic improvement of the quality of thin silicon foils produced by epoxy-induced spalling. In the past, researchers have proposed to fabricate silicon foils by spalling silicon substrates with different stress-inducing materials to manufacture thin silicon solar cells. However, the reported values of effective minority carrier lifetime of the fabricated foils remained always limited to ∼100 μs or below. In this work, we investigate epoxy-induced exfoliated foils by electron spin resonance to analyze the limiting factors of the minority carrier lifetime. These measurements highlight the presence of disordered dangling bonds and dislocation-like defects generated by the exfoliation process. A solution to remove these defects compatible with the process flow to fabricate solar cells is proposed. After etching off less than 1 μm of material, the lifetime of the foil increases by more than a factor of 4.5, reaching a value of 461 μs. This corresponds to a lower limit of the diffusion length of more than 7 times the foil thickness. Regions with different lifetime correlate well with the roughness of the crack surface which suggests that the lifetime is now limited by the quality of the passivation of rough surfaces. The reported values of the minority carrier lifetime show a potential for high efficiency (>22%) thin silicon solar cells.

The deep levels present in p-type Czochralski silicon with processing-induced macropores in the depletion region have been studied by the deep-level transient (DLT) spectroscopy technique. It is shown that a broad band is present for a bias pulse close to the interface with the Al Schottky contact, which exhibits anomalously slow hole capture and is ascribed to the internal interface states of the macropores. For depths beyond the pore region, other deep levels, associated with point defects—possibly metal contamination during the high-temperature annealing step under H2 ambient–-have been observed. The impact of the observed defects on the lifetime of thin-film solar cells, fabricated using macropore-based layer transfer is discussed. Finally, it is shown that the presence of pores in the depletion region, which also affects the DLT-spectrum, alters the capacitance–voltage characteristics.

A concept that could provide a thin monocrystalline-silicon absorber layer without resorting to the expensive step of epitaxy would be very appealing for reducing the cost of solar cells. The empty-space-in-silicon technique by which thin films of silicon can be formed by reorganization of regular arrays of cylindrical voids at high temperature may be such a concept if the high quality of the thin film could be ensured on centimeter-large areas. While previous works mainly investigated the influence of the porous array on the final structure, this work focuses on the practical aspects of the high-temperature step and its application to large areas. An insight into the defects that may form is given and the origin of these defects is discussed, providing recommendations on how to avoid them. Surface roughening, pitting, formation of holes, and silicon pillars could be attributed to the nonuniform reactions between Si, SiO2, and SiO. Hydrogen atmospheres are therefore preferred for reorganization of macropo...

Because of its optical and electrical properties, large surfaces, and compatibility with standard silicon processes, porous silicon is a very interesting material in photovoltaic and microelectromechanical systems technology. In some applications, porous silicon is annealed at high temperature and, consequently, the cylindrical pores that are generated by anodization or stain etching reorganize into randomly distributed closed sphere-like pores. Although the design of devices which involve this material needs an accurate evaluation of its mechanical properties, only few researchers have studied the mechanical properties of porous silicon, and no data are nowadays available on the mechanical properties of sintered porous silicon. In this work we propose a finite element model to estimate the mechanical properties of sintered meso-porous silicon. The model has been employed to study the dependence of the Young's modulus and the shear modulus (upper and lower bounds) on the porosity for porosities between 0% to 40%. Interpolation functions for the Young's modulus and shear modulus have been obtained, and the results show good agreement with the data reported for other porous media. A Monte Carlo simulation has also been employed to study the effect of the actual microstructure on the mechanical properties.