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Start Over Author "Moyal, Efrat" Topic semiconductor industry
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1. Cleaving Breakthrough: A New Method Removes Old Limitations.

Author

Moyal, Efrat and Brandstädt, Ekkehart

Subjects
*SEMICONDUCTOR industry, *SEMICONDUCTOR wafer manufacturing, *SEMICONDUCTOR wafer bonding, *MICROELECTRONICS
Abstract

The article presents case studies related to the indent-and cleaving method developed by LatticeGear LLC, cleaving solutions provider for semiconductor industry. Topics discussed include effectiveness of the method as compare to manual cleaving, factors related to the scribe-and-cleaving method and sample-preparation success through the indent-and-cleaving technique. Several tables are also presented related to the comparison of the methods.

Published
2014
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