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Cleaving Breakthrough: A New Method Removes Old Limitations.
- Source :
-
Electronic Device Failure Analysis . Aug2014, Vol. 16 Issue 3, p26-31. 6p. - Publication Year :
- 2014
-
Abstract
- The article presents case studies related to the indent-and cleaving method developed by LatticeGear LLC, cleaving solutions provider for semiconductor industry. Topics discussed include effectiveness of the method as compare to manual cleaving, factors related to the scribe-and-cleaving method and sample-preparation success through the indent-and-cleaving technique. Several tables are also presented related to the comparison of the methods.
Details
- Language :
- English
- ISSN :
- 15370755
- Volume :
- 16
- Issue :
- 3
- Database :
- Academic Search Index
- Journal :
- Electronic Device Failure Analysis
- Publication Type :
- Academic Journal
- Accession number :
- 96971285
- Full Text :
- https://doi.org/10.31399/asm.edfa.2014-3.p026