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In this study, an advanced supercritical fluid (SCF) technique that is suitable for materials and electronic devices with low temperature (80 °C) and high pressure (4000 psi) is proposed for a ZnO-based resistive random access memory (RRAM). After an SCF treatment, X-ray photoelectron spectroscopy (XPS) analysis confirms that the concentration of oxygen ions increases in the zinc oxide thin film. Moreover, electrical measurements confirm that the treated ZnO-based random access memory exhibits a lower forming voltage, lower set voltage, and higher ratio of high and low resistance states compared with a device without treatment. Next, the carrier transport mechanism is investigated by fitting the current–voltage curves. Finally, physical models are introduced to illustrate the extra oxygen ions that create better memory characteristics in the random access memory device after the SCF treatment. This significant SCF technique increases the content of oxygen ions without altering the original element ratio and maintains a simple device structure. Thus, the technique shows potential for feasible material improvement capable of effective real applications in the near future. [ABSTRACT FROM AUTHOR]

The HfZrOx (HZO) ferroelectric material is a promising material for ferroelectric memory and is compatible with the semiconductor process for ferroelectric random access memory (FeRAM) and negative capacitance field effect transistor. However, defects often exist in the grain boundary to influence the performance or reliability of devices. In addition, uniformity between devices must be considered when they are mass-produced. Therefore, the grain size will become important in determining the performance and reliability. In this study, we use electrical measurements of current–voltage, capacitance–voltage, and polarization–voltage measurements to test high- and low-temperature deposition devices, with a transmission electron microscope (TEM) image to confirm the grain size. Finally, we propose a model to explain the phenomenon and provide a method to obtain better ferroelectric memory. [ABSTRACT FROM AUTHOR]

This study investigates an improvement in memory characteristics through depositing an In2O3 layer as an oxygen ion reservoir in the switching layer (SL) of resistive random access memory (RRAM). The deposition of In2O3, denoted as Pt/HfO2/In2O3/TiN device, provides better memory characteristics including lower forming voltage (VF), set/reset voltage (VSET/VRESET), larger memory window, and higher resistances with higher uniformity at low resistance state (LRS) and high resistance state (HRS), compared to the devices without the In2O3 deposition, denoted as Pt/HfO2/TiN device. The conduction mechanisms, verified through fitting current–voltage (I - V) curves, are consistent with the results of a varied temperature I - V experiment. Finally, a physical model is proposed to explain our observations. [ABSTRACT FROM AUTHOR]

HfZrOx (HZO)-based materials have received much attention due to their special film characteristics in recent years. Ferroelectric random access memory (FeRAM) based on this HZO material also has promising potential as a next generation memory due to its non-volatile characteristics, excellent endurance, and low power consumption. Previous research has mainly focused on the material properties of HZO-based FeRAM. However, an in-depth investigation of the electrical properties of HZO-based FeRAM is necessary to better understand its transporting mechanism. In this contribution, this study aims to investigate the mechanism of an HZO-based metal–ferroelectric-metal capacitor using comprehensive experimental results, including current–voltage, capacitance–voltage, and polarization–voltage measurements. Experiments at various temperatures are also conducted to help verify the transport mechanism. The low current transport by the Fowler–Nordheim tunneling mechanism does not change with temperature, whereas the high current transport via the Schottky mechanism increases with increasing temperature. We found that the orientation of the dipole plays an important role. Finally, we also propose a band model to explain the electron transport in this HZO-based FeRAM. [ABSTRACT FROM AUTHOR]

In this study, a one transistor one resistor (1T1R) structure combining a fin‐like low‐temperature polycrystalline‐silicon (LTPS) transistor and a resistive random access memory (RRAM) is successfully fabricated. For the fin‐like LTPS transistor, both n‐type and p‐types show excellent electrical output characteristics. Fin‐like structure produces more stable output characteristics. Also, the forming and current–voltage (I–V) characteristics are measured in this study, and the RRAM exhibits a forming voltage of about −1.9 V. As for the I–V switching property, the devices are stable and show excellent performance, with the set and reset voltages showing only minimal change over 100 cycles. Moreover, combining the fin‐like LTPS transistor and RRAM into a 1T1R structure results in favorable operation over 100 cycles, with excellent retention and endurance. According to these results, RRAM can be successfully combined with a fin‐like LTPS transistor for application in current integrated circuit processes without difficulty. [ABSTRACT FROM AUTHOR]

This letter investigates Au30Ag70 (alloy electrode)/SiO2/TiN conductive-bridge random access memory (CBRAM) to verify the influence of ambient conditions on forming voltage ($\text{V}_{\textsf {F}}$) and the location of galvanic reaction. Previous literature demonstrates that the galvanic reaction in CBRAM with an alloy electrode results in a lower $\text{V}_{\textsf {F}}$. In this work, a higher environmental H2O concentration results in a decrease in $\text{V}_{\textsf {F}}$. From this change in $\text{V}_{\textsf {F}}$ , we infer that environmental H2O concentration influences the amount of galvanic reaction. Moreover, we verify the location of the galvanic reaction by varying electrode thickness. Finally, we propose a physical model to explain our observations. [ABSTRACT FROM AUTHOR]