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In this study, an advanced supercritical fluid (SCF) technique that is suitable for materials and electronic devices with low temperature (80 °C) and high pressure (4000 psi) is proposed for a ZnO-based resistive random access memory (RRAM). After an SCF treatment, X-ray photoelectron spectroscopy (XPS) analysis confirms that the concentration of oxygen ions increases in the zinc oxide thin film. Moreover, electrical measurements confirm that the treated ZnO-based random access memory exhibits a lower forming voltage, lower set voltage, and higher ratio of high and low resistance states compared with a device without treatment. Next, the carrier transport mechanism is investigated by fitting the current–voltage curves. Finally, physical models are introduced to illustrate the extra oxygen ions that create better memory characteristics in the random access memory device after the SCF treatment. This significant SCF technique increases the content of oxygen ions without altering the original element ratio and maintains a simple device structure. Thus, the technique shows potential for feasible material improvement capable of effective real applications in the near future. [ABSTRACT FROM AUTHOR]

This study investigates an improvement in memory characteristics through depositing an In2O3 layer as an oxygen ion reservoir in the switching layer (SL) of resistive random access memory (RRAM). The deposition of In2O3, denoted as Pt/HfO2/In2O3/TiN device, provides better memory characteristics including lower forming voltage (VF), set/reset voltage (VSET/VRESET), larger memory window, and higher resistances with higher uniformity at low resistance state (LRS) and high resistance state (HRS), compared to the devices without the In2O3 deposition, denoted as Pt/HfO2/TiN device. The conduction mechanisms, verified through fitting current–voltage (I - V) curves, are consistent with the results of a varied temperature I - V experiment. Finally, a physical model is proposed to explain our observations. [ABSTRACT FROM AUTHOR]

This research investigates one of the process or element doping methods used to enhance the reliability of resistive random access memory (RRAM). A supercritical fluid process combines the advantages of the high permeability of gas with the solubility of liquids, and this novel process introduces water molecules into the supercritical fluid for oxidation in order to improve the resistance of random storage. In terms of reliability of the memory, while previous research has used an oxygen plasma treatment to improve RRAM device performance, this work performed a comparison of the two methods and found that the supercritical oxidation treatment can reduce the forming voltage by 25% and produce superior electrical operation, with an endurance test exhibiting an increase to 108 cycles and an improvement of 102. The material analysis confirmed that, during the resistance switching process, the switching layer was more oxidized after this novel supercritical oxidation, resulting in the reduction of operating current and improved reliability compared with the plasma oxidation device. [ABSTRACT FROM AUTHOR]

In this study, a one transistor one resistor (1T1R) structure combining a fin‐like low‐temperature polycrystalline‐silicon (LTPS) transistor and a resistive random access memory (RRAM) is successfully fabricated. For the fin‐like LTPS transistor, both n‐type and p‐types show excellent electrical output characteristics. Fin‐like structure produces more stable output characteristics. Also, the forming and current–voltage (I–V) characteristics are measured in this study, and the RRAM exhibits a forming voltage of about −1.9 V. As for the I–V switching property, the devices are stable and show excellent performance, with the set and reset voltages showing only minimal change over 100 cycles. Moreover, combining the fin‐like LTPS transistor and RRAM into a 1T1R structure results in favorable operation over 100 cycles, with excellent retention and endurance. According to these results, RRAM can be successfully combined with a fin‐like LTPS transistor for application in current integrated circuit processes without difficulty. [ABSTRACT FROM AUTHOR]

In this letter, we determine the importance of the electrical field distribution and strength during the switching process by demonstrating different trends in the degree of reset and the reset pulse time. In general, a longer reset pulse time results in a higher reset energy; a higher reset energy leads to a higher degree of reset, which we obtained by applying different width square waves. But quite notably, the opposite result was obtained using triangle waves, where a higher degree of reset occurred with a shorter rising time and lower reset energy. We believe that this is due to the electric field effect: if the voltage rises faster than the filament oxidation, the device can produce a larger effective electric field and a higher resistance in the reset process. To further investigate the mechanism, the procedure of the reset process was analyzed in detail, and COMSOL simulation is also carried out for confirmation. [ABSTRACT FROM AUTHOR]