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The effect of nitrogen concentration on the interfacial and optical properties, as well as band offsets of HfTiO thin films by rf sputtering HfTi alloy target has been systematically investigated. The results indicate that an interfacial layer is unavoidably formed between HfTiON thin films and Si substrate, and the main content of the interfacial layer is silicate. No silicide is formed in the interfacial layer which is partly responsible for the poor electrical properties of high-k gate dielectrics. The optical properties of HfTiON films change, such as the refractive index decreases, while the extinction coefficient increases with the increase of N content, due to the defects increase in the films. The results also indicate that the bandgap and VB offset reduce with the introduction of N into HfTiO thin films. The CB offset of the HfTiON thin films is almost unchanged indicating that the N concentration has little effect on CB offset. However, the bandgap and band offsets are all higher than 1 eV, the sufficient band offsets still makes sputtering-derived HfTiON films by HfTi alloy target a promising high-k gate dielectric for future complementary metal oxide semiconductor technology. [ABSTRACT FROM AUTHOR]

The effect of nitrogen incorporation on the band alignment and electrical properties of HfTiO gate dielectric complementary metal-oxide-semiconductor (MOS) capacitors has been investigated by spectroscopy ellipsometry, x-ray photoelectron spectroscopy, and electrical measurements. Reduction in optical band gap and band offsets has been detected. However, improved electrical properties have been achieved from HfTiON gate dielectric MOS capacitors attributed to the nitrogen-induced reduction in oxygen-related traps and the improved interface quality. Although there is a nitrogen-induced reduction in band gap and band offset, the sufficient barrier heights still makes HfTiON a promising high-k gate dielectric candidate for proposed near-future complementary metal-oxide-semiconductor applications. [ABSTRACT FROM AUTHOR]

The effect of nitrogen atom doping on the optical properties and dielectric constant of HfO2 films has been systematically investigated. Spectroscopic ellipsometry was employed to investigate the optical properties of nitrogen incorporated HfO2 films. The values of average oscillator strength and average oscillator position extracted from spectroscopic ellipsometry demonstrated that nitrogen incorporation could influence the dipole oscillator strength and oscillator position of HfO2. A physical model of dipole structures was proposed to verify the enhancement of dielectric constant of HfO2 films by nitrogen incorporation. [ABSTRACT FROM AUTHOR]

The effect of N concentration on the band gap and band offsets of HfOxNy films has been systematically investigated. It was found that the band gap as well as the band offsets of HfOxNy films decreased with the increase of N concentration. When the N concentration reached 16.3%, the conduction band offset (ΔEc) reduced to be 0.88 eV, which is smaller than the minimal requirement of ΔEc values for high-k dielectrics and, thus, leads to unacceptably high leakage currents. Therefore, nitrogen concentration should be carefully controlled to guarantee excellent properties of nitrogen incorporated high-k dielectrics. [ABSTRACT FROM AUTHOR]

Effects of nitrogen incorporation on interfacial property, band gap, and band alignments of high-k Y2O3 gate dielectrics have been investigated. It was found that the incorporation of nitrogen into Y2O3 films can effectively suppress the growth of the interfacial layer between Y2O3 and Si substrate. The incorporation of nitrogen into Y2O3 films leads to the reduction of band gap and valence band offset, but not the conduction offset of Y2O3 films. High temperature annealing will help to increase the band gap and valence band offset of YOxNy film due to the release of the interstitial N atoms. [ABSTRACT FROM AUTHOR]

Spectroscopic ellipsometry with photon energy 0.75–6.5 eV at room temperature has been used to derive the optical properties of nitrogen-incorporated HfO2 films on Si(100) substrates grown by radio-frequency reactive sputtering using different N2/(N2+O2+Ar) gas ratios from 20% to 50%. Excellent agreement has been found between the experimental and the simulated spectra, in which an empirical dielectric dispersion relation based on Tauc-Lorentz model has been successfully adopted. Increases in the refractive index n and the extinction coefficient. k, with increases in nitrogen-incorporation content are observed due to the nitrogen-incorporation-induced higher packing density. The change of the complex dielectric functions and reduction in the optical band gap with an increase in nitrogen concentration resulting from the effect of the nitrogen-incorporation on the structure are discussed in detail. [ABSTRACT FROM AUTHOR]