1. Wafer Level Back to Back Hybrid Bonding for Multiple Wafer Stacking
- Author
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Hong Miao Ji, C. S. Lim, Lin Ji, Hongyu Li, and Masaya Kawano
- Subjects
010302 applied physics ,Materials science ,Silicon ,business.industry ,Semiconductor device modeling ,Stacking ,Process (computing) ,chemistry.chemical_element ,ComputerApplications_COMPUTERSINOTHERSYSTEMS ,Hardware_PERFORMANCEANDRELIABILITY ,02 engineering and technology ,021001 nanoscience & nanotechnology ,01 natural sciences ,Wafer stacking ,Finite element method ,chemistry ,Stack (abstract data type) ,0103 physical sciences ,Hardware_INTEGRATEDCIRCUITS ,Optoelectronics ,Wafer ,0210 nano-technology ,business - Abstract
This paper describes the demonstration of a 4-layer wafer stack using a combination of face-to-face and back-to-back, wafer-to-wafer hybrid bonding process. Details of process flow, process characterization and challenges in multi-layer wafer stacking are included in this paper. Wafer warpage of different pattern density is simulated with 3D finite element analysis (FEA) model. Wafer bow results match with low warpage results of simulation. 4-layer wafer was stacked together without separation. The process development and improvement carries out.
- Published
- 2020
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