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In this paper, we demonstrate a new bottom-antireflective coating (BARC) layer for KrF lithography. The antireflective layer is composed of a commercial low-dielectric constant FLARE 2.0-based film. By adding an optimized etching hard-mask layer, reflectance of less than 3% at the resist/silicon substrate interface can be achieved. FLARE 2.0 films also have great potential to be used as BARC layers on highly reflective substrates for metal interconnect applications. It is easy to reduce reflectance without adding an extra BARC layer for patterning low-dielectric materials. It is convenient to use this novel BARC structure in KrF lithography. In this paper, suitable etching characteristics of FLARE 2.0-based BARC layers are also described. [Copyright &y& Elsevier]

Abstract: We demonstrated a new imprint method named nanoimprinting in metal/polymer bi-layer structures (NIMB) for patterning metal films with varied profiles. Converse with conventional nanoimprint lithography, the patterned mold is directly imprint in metal films not in polymer based resists. In general, direct imprint in metal films need ultra-high pressure or temperature to form patterns. In this paper, we improve the direct imprint processes by using a sharp mold and an underlying soft pad layer for the reduction of the imprint pressure and temperature. The imprint pressure can be reduced to be compatible with the conventional nanoimprint instrument. For the direct contact the metal film with mold, no surfactant should be coated on the surface of mold. It also indicates no mold-rework-processes are necessary for this direct imprint method. [Copyright &y& Elsevier]