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Directly patterning metal films by nanoimprint lithography with low-temperature and low-pressure

Authors :
Chen, H.L.
Chuang, S.Y.
Cheng, H.C.
Lin, C.H.
Chu, T.C.
Source :
Microelectronic Engineering. Apr-Sep2006, Vol. 83 Issue 4-9, p893-896. 4p.
Publication Year :
2006

Abstract

Abstract: We demonstrated a new imprint method named nanoimprinting in metal/polymer bi-layer structures (NIMB) for patterning metal films with varied profiles. Converse with conventional nanoimprint lithography, the patterned mold is directly imprint in metal films not in polymer based resists. In general, direct imprint in metal films need ultra-high pressure or temperature to form patterns. In this paper, we improve the direct imprint processes by using a sharp mold and an underlying soft pad layer for the reduction of the imprint pressure and temperature. The imprint pressure can be reduced to be compatible with the conventional nanoimprint instrument. For the direct contact the metal film with mold, no surfactant should be coated on the surface of mold. It also indicates no mold-rework-processes are necessary for this direct imprint method. [Copyright &y& Elsevier]

Details

Language :
English
ISSN :
01679317
Volume :
83
Issue :
4-9
Database :
Academic Search Index
Journal :
Microelectronic Engineering
Publication Type :
Academic Journal
Accession number :
20574533
Full Text :
https://doi.org/10.1016/j.mee.2006.01.095