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This paper presents that advanced actively body-bias controlled (Advanced ABC) technology contributes to enhancing operation margins of static random access memory (SRAM). For the first time, significant enhancement of static noise margin (SNM) is successfully realized by using a body bias of load, access, and driver transistors while suppressing threshold-voltage variations. In this technology, well taps control the body potential of the load transistor and word lines also control the body potential of the access and driver transistors. It is demonstrated that the write and read margins of 65-nm-node silicon-on-insulator (SOI) SRAMs are improved by the Advanced ABC technology. Furthermore, it is found that the SNM is enhanced by 27% for 32 nm and 49% for 22 nm node. It is summarized that this technology is one of countermeasures for emerging generations.

An actively body-bias controlled (ABC) silicon-on-insulator (SOI) static random access memory (SRAM) connecting the bodies of the access and the driver transistors with the word line is proposed to realize high-speed and low-voltage operation. We developed the direct body contact to apply forward biases to the bodies without increases in the area penalty and the parasitic gate capacitance. An increase of the standby current does not occur because the body biases are not applied when the word-line voltage is low level. It is demonstrated that a significant speed improvement and a reduction of performance variations for the SRAM are achieved by applying the body bias. Neutron-accelerated soft-error tests reveal that the ABC structure suppresses soft-error events due to the body-tied SOI structure. In summary, the ABC SOI technology is one of the countermeasures for emerging generations.

A 0.18 /spl mu/m silicon on insulator (SOI) complementary metal-oxide semiconductor (CMOS) technology using hybrid trench isolation with high resistivity substrate is proposed and its feasibility for embedded RF/analog applications is demonstrated. The hybrid trench isolation is a combination of partial trench isolation and full trench isolation. In the partial trench isolation region, a part of the SOI layer remains under the field oxide so as to provide scalable body-tied SOI metal-oxide-semiconductor field-effect transistors (MOSFETs), while in the full trench isolation region, the whole of the SOI layer is replaced by the field oxide so as to provide high quality passives. It is demonstrated that this technology improves the maximum oscillation frequency and the minimum noise figure of the MOSFET and the Q-factor of the inductor, compared with bulk technology. Moreover, it is verified that the partial-trench-isolated body-tied structure suppresses the floating body effect of SOI devices for RF/analog applications and thus guarantees low-noise characteristics, stability, linearity, and reliability. It is concluded that this technology will be one of the key technologies for supporting the evolution of wireless communications.

The substrate-bias effect and source-drain breakdown characteristics in body-tied short-channel silicon-on-insulator metal oxide semiconductor field effect transistors (SOI MOSFET's) were investigated. Here, "substrate bias" is the body bias in the SOI MOSFET itself. It was found that the transistor body becomes fully depleted and the transistor is released from the substrate-bias effect, when the body is reverse-biased. Moreover, it was found that the source-drain breakdown voltage for reverse-bias is as high as that for zero-bias. This phenomenon was analyzed using a three-dimensional (3-D) device simulation considering the body-tied SOI MOSFET structure in which the body potential is fixed from the side of the transistor. This analysis revealed that holes which are generated in the transistor are effectively pulled out to the body electrode, and the body potential for reverse-bias remains lower than that for zero-bias, and therefore, the source-drain breakdown characteristics does not deteriorate for reverse-bias. Further, the influence of this effect upon circuit operation was investigated. The body-tied configuration of SOI devices is very effective in exploiting merits of SOI and in suppressing the floating body-effect, and is revealed to be one of the most promising candidates for random logic circuits such as gate arrays and application specific integrated circuits.

The threshold voltages of thin-film fully-depleted silicon-on-insulator (FDSOI) nMOS and pMOS have been controlled by employing tantalum (Ta) as the gate materials. Ta-gate FDSOI MOSFET's have excellent threshold voltage control for 1.0 V application on low impurity concentration SOI layers in both nMOS and pMOS. The low-temperature processing after the gate oxidation step leads to good on/off characteristics in Ta-gate SOI MOSFET's because of no reaction between Ta gate electrode and SiO/sub 2/ gate insulator. This technology makes it possible to drastically decrease the number of the process steps for CMOS fabrication, because the same gate material is available for both nMOS and pMOS.

A statistical compact RTN (Random Telegraph Noise) model with a fixed V th shift and V gs dependent trap time constants is proposed. It accurately reproduces the experimental observation of larger V th fluctuation at higher |V gs |. The model is also applied to analysis of SRAM V min fluctuation and finds out the distribution follows a log-normal statistics.

This paper presents that advanced actively body-bias controlled (Advanced ABC) technology contributes to enhancing operation margins of SRAMs. Significant enhancement of static noise margin (SNM) is successfully realized by using a body bias of load transistors while suppressing threshold-voltage variations for the first time. It is demonstrated that the write and read margins of 65nm-node SOI SRAMs are improved by the advanced ABC technology. Furthermore, it is found that the SNM is enhanced by 27% for 32nm and 49% for 22nm node. It is summarized that this technology is one of countermeasures for emerging generations.

This paper describes the experimental characteristics of RF components with layout and structural optimization, fabricated in 0.10-/spl mu/m 1.2-V SOI-CMOS technology with partial trench isolation (PTI). ESD protection-grounded gate SOI-NMOSFETs achieve high reliability due to body-tied structure with PTI, and newly proposed ESD diodes also derive superior performance. Moreover, this technology offers a low loss RF switch and a broadband amplifier with low power consumption. These results are very promising for the fabrication of broadband RF integrated circuits.

As the LSI process technology advances, increase of power consumption for the LSIs becomes major issue because of number of transistors and clock frequencies increase. For a reduction of the power consumption of the LSI, lowering supply voltage technology is one of the effective ways such as applying a dynamic threshold voltage (DT) structure as stated in J. P. Colinge (1987). However, a DT SOI MOSFET with T-shape or H-shape gates has disadvantages of area penalties and a gate parasitic capacitance increase. In this paper we describe actively body-bias controlled (ABC) SOI MOSFET technology with hybrid trench isolation (HTI) based in Y. Hirano et al. (2000). This structure doesn't need the T or H gates and realizes low-voltage and high-speed operation with controlling a body potential.

Actively Body-bias Controlled (ABC) SOI SRAM that has a new cell structure including connections of the access and the driver transistor's bodies to the word line is proposed to realize low-voltage operation. We developed the direct body contact technology to apply forward biases to the bodies without area penalties and increases of parasitic gate capacitances by using the hybrid trench isolation for the first time. Moreover, the standby current does not change because the body bias is not applied when the word-line voltage is low level. It is successfully demonstrated that low-voltage and high-speed operation is achieved by using the ABC SOI SRAM.

Reliability against radiation is an important issue in silicon on insulator metal oxide semiconductor field effect transistors (SOI MOSFETs) used in satellites and nuclear power plants and so forth which are severely exposed to radiation. Radiation-caused characteristic change related to the isolation-edge in an irradiated environment was analyzed on SOI MOSFETs. Moreover short channel effects for an irradiated environment were investigated by simulations. It was revealed that the leakage current which was observed in local oxidation of silicon (LOCOS) isolated SOI MOSFETs was successfully suppressed by using field shield isolation. Simulated potential indicated that the potential rise at the LOCOS edge can not be seen in the case of field shield isolation edge which does not have physical isolation. Also it was found that the threshold voltage shift caused by radiation in short channel regime is severer than that in long channel regime. In transistors with a channel length of 0.18 µm, a potential rise of the body region by radiation-induced trapped holes can be seen in comparison with that of 1.0 µm. As a result, we must consider these effects for designing deep submicron devices used in an irradiated environment.