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This paper reports the infrared spectral responses of 17 and 35 μm uncooled bolometers fabricated at INO. They are measured by making use of an external readout circuit along with a monochromator. As expected, the spectral absorption strongly depends on the bolometer stack as well as the pixel layout. By proper selection of design parameters, the spectral response can be made flat from 3 to 14 μm without significant deterioration of the detector figure of merit.

This paper reviews recent developments in customized packaged bolometers at INO with an emphasis on their applications. The evolution of INOs bolometer packages is also presented. Fully packaged focal plane arrays of broadband microbolometers with expanded absorbing range are shown, for applications in spectroscopic and THz imaging. This paper also reports on the development of customized packaged bolometer focal plane arrays (FPAs) for space applications such as a multispectral imaging radiometer for fire diagnosis, a far infrared radiometer for in-situ measurements of ice clouds and a net flux radiometer for Mars exploration.

This paper reports on the development of a fully packaged focal plane array of broadband microbolometers. The detector makes use of a gold black thin film to expand its absorption range from 3 to 14 μm. A low temperature packaging process was developed to minimize sintering of the gold black absorber during vacuum sealing of the bolometer array package. The gold black absorber was also laser trimmed to prevent lateral diffusion of heat and promote a better MTF. The resulting FPAs show a NETD lower than 25 mK at a frame rate of 50 Hz

This paper reports the NETD values of various uncooled bolometers fabricated at INO. They are measured using an external readout circuit that emulates the readout scheme of a commercial ROIC. The measured NETD values range between 6 and 75 mK, depending on the pixel pitch and response time. Pixel pitches of 12, 17 and 35 μm are considered. The figure of merit of the characterized detectors is below 350 mK*ms.

A THz frequency selective microbolometer focal plane array (FPA) with 35 μm pixel pitch and a resolution of 384×288 pixels was recently developed at INO. The FPA was fabricated on a CMOS readout circuit using MEMS surface micromachining techniques. The uncooled microbolometer detectors, based on vanadium oxide technology, were optimized for detection at 4.25 THz. A high performance frequency selective THz camera operating at 4.25 THz was also demonstrated.

Terahertz is a field in expansion with the emergence of various security needs such as parcel inspection and through-camouflage vision. Terahertz wavebands are characterized by long wavelengths compared to the traditional infrared and visible spectra. However, it has recently been demonstrated that a 52 μm pixel pitch microscanned down to an efficient sampling pitch of 26 μm could provide useful information even using a 118.83 μm wavelength. With this in mind, INO has developed a terahertz camera core based on a 384x288 pixel 35 μm pixel pitch uncooled bolometric terahertz detector. The camera core provides full 16-bit output video rate.

A THz VOx-based 160×120 microbolometer FPA camera with 52 μm pixel pitch has been developed at INO. Radiometric NEP values have been measured at different wavelengths. Real-time video-rate reflectance imaging using large beam area from a high-power FIR optically pumped THz laser has been also performed, demonstrating high sensitivity for stand alone applications.

Large area microbolometer detectors are very attractive for applications where high sensitivity is required. This is particularly important for long wavelength spectroscopy in the far-infrared and sub-millimeter region. This paper presents current progress in the development of large area uncooled microbolometer FPAs at INO.

A THz camera based on an uncooled microbolometer 160X120 pixel array with nominal pitch of 52 μm has been developed at INO and initial transmission and reflection images showed promise. In the present paper, the characterization of both standard infrared and THz-optimized uncooled microbolometer pixel arrays are presented at both infrared and THz wavelengths. Measurements in the THz region has been performed using non-uniform low-power quantum-cascade laser (QCL) and uniform high-power far-infrared laser (FIR laser) beams at 3 THz and 4.25 and 2.54 THz, respectively. A measurement comparison has been achieved in the infrared using a blackbody radiation. Different methods for noise-equivalent power (NEP) measurements have been investigated. These characterization methods are promising especially for non-uniform laser beams irradiated on pixel arrays. The NEP results obtained from the different methods are in good agreement independent of the method used in the experiments. The results show a high sensitivity of the THz-optimized pixel array in the THz region. Large beam area reflection imaging of obscured materials at 2.54 THz have been performed at video rates of 30 frames per second using the THz-optimized pixel array equipped with a semi-custom fast THz objective, proving that the INO THz camera provides a promising solution for stand-alone imaging systems.

INO has been actively working on extending its microbolometer technology to THz applications. Several techniques have been developed recently to improve the performance of the microbolometer. This article will present these techniques and discuss some potential applications of INO THz microbolometer.

A THz 160×120 pixel array camera has been developed at INO. Real-time transmission and reflectance imaging at video rates of 30 frames/s were performed with a low-power 3 THz quantum cascade laser. Various hidden objects were imaged, proving feasibility of real-time THz imaging for security screening applications.

THz imaging is a very promising field rapidly growing in importance. This expanding field is at its early stage of development but already a large number of applications are foreseen. THz imaging promises to be a key technology in various fields, such as defense & security where it can be used to defeat camouflage. Based on its many years of experience in uncooled bolometers technology, INO has developed, assembled and characterized a prototype THz imager. The camera's 160 × 120 pixel array consists of pixels with a 52 μm pitch that have been optimized for the THz region. Custom camera electronics and an F/1 THz lens barrel complete the imager design. Real-time imaging at video rate of 30 frame/sec has been performed with a 3 THz quantum cascade laser set-up. THz images of numerous object-obscurant combinations are presented, proving the feasibility of video imaging in security screening applications.

INO in collaboration with DRDC Valcartier has been involved in the design and development of uncooled IR bolometric detector technology since the early 1990s for a broad range of military and commercial applications. From the beginning, the strategy has been to develop small-size bidimensional detector arrays and specialty linear arrays, both equipped with on-chip readout electronics. The detector arrays have been implemented in various instruments for both imaging and non-imaging applications. This paper describes two TWS1 and TWS2 prototypes of single band thermal weapon sights (TWS) making use of a novel catadioptric, i.e. refractive/reflective, optics and INO's miniature IR cameras. These cameras employ a 160x120 pixel uncooled bolometric FPA with a 52 µm pitch and NETD at 50 mK, and modular electronics consisting of three boards stacked together to fit into a 3-inch cube volume. The ultra lightweight catadioptric objective is inherently athermalized in the -30°C to +40°C range. The TWS1 is also equipped with a miniature RF link allowing bi-directional video transmission. This TWS1 weighs only 900 g and has a total volume of about 75 in3. Its power consumption is 2 W. The experimental performance showed that human detection, recognition and identification could be achieved at 800 m, 200 m, and 120 m, respectively. Construction of an improved TWS2 model is in progress. The objective is the reduction of TWS2 model weight down to 700 g, its volume down to 50 in3, replacing the RF video link with a wireless digital link, and increasing resolution to 320x240 pixels.

Modified thermal sensors have been produced and characterized for fingerprint recording applications. The sensors are derived from the IR imaging technology developed at INO. The sensor array is made of 160 x 120 pixel VO x based micro thermistors that provide an image of a surface area of 8.3 x 6.2 mm 2 with a resolution of 488 dpi. The sensors were reinforced to withstand the mechanical pressure of the finger and the electrical discharges from the human skin. It is shown that despite their low thermal insulation, the sensors provide an image of the fingerprint pattern with relatively high contrast and resolution. With the acquisition electronics of an IR imager, the temperature of the sensor must be controlled. Measurements of the thermistor temperature were performed in order to access the intrinsic properties of the fingerprint sensors. The NETD is on the order of 2 10 -3 °C when the pass band of the filter is 330 kHz. The temporal behavior of the thermistor temperature shows that 10 ms after the finger has been brought into contact with the sensor, the temperature difference between thermistors in ridge and valley areas of the fingerprint DT r,v may reach 80 10 -3 °C, for an initial temperature difference between the finger and the sensor of 1 °C. Once the sensor reaches a steady thermal state after a long time, the same difference decreases to 1.9 10 -3 °C. The required temperature difference DT r,v , estimated to be 4.8 10 -3 °C to achieve an adequate signal to noise ratio, is relatively easy to reach at short and at long time periods. A modification to the method of acquisition is proposed to cancel the effect of the thermal drift of the sensor and to eliminate the need for the sensor temperature stabilization with a TEC. With this method, the recording of the fingerprint pattern may be achieved in 50 ms after the finger has been brought into contact. This leads to interesting gains in space, time and power consumption. Finally, for applications where the finger must remain in contact with the sensor, the same method may be efficient to reduce the need for thermal control.

INO has been active in microbolometer and FPA technology development since the early 1990s. Microbolometer detectors based on VO2 films with TCR above 3% are typically fabricated. VOx films with TCR above 2% have been developed for applications where FPA temperature is not stabilized. INO is continuing its development of high fill factor pixels with sizes down to 25 micrometers and new macro- and micro-packaging technology. All fabrication is done on six inch wafers in INOs newly expanded clean room facility. INO currently offers as standard products 256x1 and 160x120 pixel FPAs with 52 micrometers pixel pitch. Both arrays have simple, robust, and versatile CMOS readout integrated circuits (ROICs) that may be accessed in self-scanning or random access mode, and reference detectors for on-chip coarse offset and temperature drift compensation. Single frame NETDs (f/1, 300 K, 8-12 micrometers ) are on the order of 150 - 250 mK and may be reduced by frame averaging. Prototyping boards have been developed for both arrays, and the 160x120 FPA has been integrated in a number of thermal cameras and instruments. In collaboration with its clients, INO has developed several FPAs for specific space and terrestrial applications. Custom ROICs fabricated in several different CMOS processes from multiple foundries have been used. A 512x3 pixel microbolometer FPA with 39 micrometers pitch is being developed for the European Space Agency. The array is designed for multi-spectral pushbroom imaging applications and features a novel ROIC with very low 1/f noise, pixel by pixel offset and drift compensation, variable integration time, and digital output. Its single frame NETD (f/1, 300 K, 8-12 micrometers ) is nominally 80 mK.

In an effort to leverage uncooled microbolometer technology, testing of bolometer performance in various nonimaging applications has been performed. One of these applications makes use of an uncooled microbolometer array as the sensing element for a laser beam analyzer. Results of the characterization of cw CO2 laser beams with this analyzer are given. A comparison with the results obtained with a commercial laser beam analyzer is made. Various advantages specific to microbolometer arrays for this application are identified. A second application makes use of microbolometers for absolute temperature measurements. The experimental method and results are described. The technique's limitations and possible implementations are discussed. Finally, the third application evaluated is related to the rapidly expanding field of biometry. It consists of using a modified microbolometer array for fingerprint sensing. The basic approach allowing the use of microbolometers for such an application is discussed. The results of a proof-of-principle experiment are described. Globally, the described work illustrates the fact that microbolometer array fabrication technology can be exploited for many important applications other than IR imaging.

Prototypes of VO2-based bolometric detectors with lateral dimensions of 25 X 25, 30 X 30, 35 X 35, 40 X 40 and finally 50 X 50 micrometers2 and fill factors approaching 90% are presented. These detectors are grouped in hardwired linear arrays as large as 512 X 1 pixels. Under DC biasing, the fabricated detectors, even the smallest ones, exhibit responsivities from 48,000 to 120,000 VW-1, detectivities in the range of 1.5 X 108 cm Hz1/2W-1 and response times in the range of 5 ms. These new bolometric detector structures contain hidden-legs placed completely underneath the bolometer platform. Results of simulations of the mechanical, optical and electrical properties of these new detector structures are presented. A complete detector fabrication process flow is described.© (2000) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.

Linear bolometer arrays are well suited to industrial and space applications, where the object or scene may be convenientlyscanned by a conveyor or in a push-broom mode. The linear format facilitates the introduction of readout features notgenerally available in two-dimensional arrays. Such features include pixel by pixel offset and temperature drift compensation,as well as pixel-level filtering. The latter permits the filtering of detector noise down to a narrow bandwidth while preservinga high output bandwidth to allow oversampling. The former permits superior temperature drift compensation since each pixelmay have a dedicated, matched temperature sensing element.Three types of linear and quasi-linear bolometric detector arrays are being developed at INO within the framework of anR&D program jointly financed by INO and the Centre for Research in Earth and space Technology (CRESTech) of NorthYork (Ontario). The prototypes of these arrays, namely the 1RL256A, 1RL256B and 1RL256C are described in this paper.

An uncooled IR camera making use of a 128 X 128 pixel bolometric FPA is presented. The reconfigurable bolometric focal plane array consist of 50 micrometer X 50 micrometer pixels and simple on-chip CMOS readout electronics which can be operated in random access, independent row and column clocking, and self-scanning modes. Depending on the selected pixel format and frame rate, the FPA's NETD varies from 0.52 degrees Celsius down to 0.10 degrees Celsius. The modular IR camera is software configured and provides RS170A analog video and 12-bit TTL format digital outputs.

Along the years INO has been involved in development of various uncooled infrared devices. Todays, the infrared imagers exhibit good resolutions and find their niche in numerous applications. Nevertheless, there is still a trend toward high resolution imaging for demanding applications. At the same time, low-resolution for mass market applications are sought for low-cost imaging solutions. These two opposite requirements reflect the evolution of infrared cameras from the origin, when only few pixel-count FPAs were available, to megapixel-count FPA of the recent years. This paper reviews the evolution of infrared camera technologies at INO from the uncooled bolometer detector capability up to the recent achievement of 1280×960 pixels infrared camera core using INO's patented microscan technology.