1. 3D Advance Metrology by means of 3D Atomic Force Microscopy
- Author
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Herfst, R.W., Nulkes-de Groot, N., Lucas, P., Bijnagte, T., Dekker, B., Biemond, J.J.B., Riel, M.J.C.M. van, Essen, B.H.M.F. van, Koppen, M.E.C.T. van, Oosterling, J.A.J., Kramer, L., Nieuwkoop, E., Corbet, F., Visser, L., and Man, H.
- Subjects
Microscopy ,Industrial Innovation ,ERP 3D Nanomanufacturing Instruments ,ERP Early Research Program ,High Tech Systems & Materials ,Metrology ,3D atomic force microscopy - Abstract
We developed a new 3D-AFM technique that enables imaging of high aspect ratio trenches. By measuring both lateral and vertical forces on a cantilever tip, a subharmonic mode based on the attractive tip-sample forces becomes feasible. This enables the measurement of true 3D information of samples without causing damage. This is especially relevant for semiconductor metrology, as current solutions are lagging behind the development of (near-future) lithography capabilities. Our goal: measure metrology parameters such as critical dimension (CD), side wall angle (SWA), Line edge Roughness (LER), etc.
- Published
- 2019