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A field effect transistor having the active area made of monolayer graphene is simulated by a drift-diffusion model coupled with the Poisson equation. The adopted geometry, already proposed in (Nastasi and Romano in IEEE Trans. Electron. Devices 68:4729–4734, 2021, https://doi.org/10.1109/TED.2021.3096492), gives a good current-ON/current-OFF ratio as it is evident in the simulations. In this paper, we compare the numerical simulations of the standard (non-degenerate) drift-diffusion model, that includes the Einstein diffusion coefficient, with the degenerate case. [ABSTRACT FROM AUTHOR]

A flexible framework is obtained for enhancing both the thermal and electrical performance of fin field-effect transistor (FinFET) technology. Investigation of the nanoscale heat conduction within a short-channel field-effect transistor can be regarded as an emerging challenge related to future-generation transistors. In this work, we report the electrothermal transport in a 10 nm silicon-on-insulator (SOI) FinFET based on the dual-phase-lag model and modified drift-diffusion motions. We found that electron mobility decreases along the channel due to carrier confinement under higher electric field. In addition, the surface detection temperature indicates that the self-heating process is localized between the source and drain region. As promising results, high-κ metal-oxide and lower thermal boundary resistance can optimize the nanoscale heat transport in the SOI FinFET device. [ABSTRACT FROM AUTHOR]