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Your search keyword '"Inoue, Katsunori"' showing total 3 results
Start Over Author "Inoue, Katsunori" Topic engineering and manufacturing industries
3 results on '"Inoue, Katsunori"'

1. Numerical analysis of the interfacial contact process in wire thermocompression bonding

Author

Takahashi, Yasuo, Shibamoto, Sigeru, and Inoue, Katsunori

Subjects
Metal bonding -- Research, Electric contacts -- Research, Business, Engineering and manufacturing industries, Science and technology
Abstract

Wire deformation processes during thermocompression bonding without ultrasonic vibration are represented by a numerical model which is based on the finite-element method. The growth process of interfacial contact between the wire surface and lead frame is also studied. Findings indicate that a wire reduction greater than 0.5 is needed for a strong perimeter bond formation. The interfacial contact area is affected mainly by the wire reduction.

Published
1996

2. Numerical analysis of fine lead bonding - effect of pad mechanical properties on interfacial deformation

Author

Takahashi, Yasuo, Inoue, Michinobu, and Inoue, Katsunori

Subjects
Metal bonding -- Models, Finite element method -- Usage, Lead -- Research, Thermal stresses -- Models, Numerical analysis -- Usage, Business, Electronics and electrical industries, Engineering and manufacturing industries
Abstract

The impact of lead bonding on interfacial deformation processes is examined. Using the finite element method, the authors analyze the effects of thermal stress on pad mechanical properties and bond strength.

Published
1999

3. Numerical analysis of fine lead bonding - effect of pad thickness on interfacial deformation

Author

Takahashi, Yasuo, Inoue, Michinobu, and Inoue, Katsunori

Subjects
Numerical analysis -- Methods, Deformation potential -- Models, Integrated circuits -- Testing, Finite element method -- Usage, Lead -- Research, Business, Electronics and electrical industries, Engineering and manufacturing industries
Abstract

The authors discuss their testing of lead bonding in integrated circuits and the possibility of interfacial deformation. The relationships between pad thickness, lead bonding, and deformation are analyzed, and the various effects of deformation on packaging are discussed.

Published
1999

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