Numerical analysis of fine lead bonding - effect of pad mechanical properties on interfacial deformation

Authors :: Takahashi, Yasuo
Inoue, Michinobu
Inoue, Katsunori
Source :: IEEE Transactions on Components and Packaging Technologies. Dec, 1999, Vol. 22 Issue 4, p558, 9 p.
Publication Year :: 1999
Abstract: The impact of lead bonding on interfacial deformation processes is examined. Using the finite element method, the authors analyze the effects of thermal stress on pad mechanical properties and bond strength.

Subjects :: Metal bonding -- Models
Finite element method -- Usage
Lead -- Research
Thermal stresses -- Models
Numerical analysis -- Usage
Business
Electronics and electrical industries
Engineering and manufacturing industries

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