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In this work, we design and synthesize a hybrid structure consisting of Sn-incorporated Cu3SbSe4 and a second phase CuSe, that is, (Cu3Sb1 − xSnxSe4)(CuSe)y (x = 0–0.04, y = 0.3–0.08), and explore the role of each phase on the improvement of the thermoelectric (TE) performance. In the Cu3Sb1 − xSnxSe4 phase, the element Sn residing at the Sb site provides p-type holes while at the same time increasing the point defects and crystal structure distortion. The presence of the second phase CuSe, which is in situ formed within the Cu3Sb1 − xSnxSe4 matrix, not only improves the electrical conductivity but also increases the phonon scattering on the phase boundaries. As a result, the hybrid structure allows the improvement in TE performance with the highest ZT value of 0.37 at ∼600 K for the samples at x = 0.02–0.03 and y = 0.11–0.09, which is about 42% higher than that of pristine Cu3SbSe4. This work reveals us a new method of improving TE performance, that is, through organizing a hybrid structure in Cu3SbSe4-based composites. [ABSTRACT FROM AUTHOR]

In this work we have observed a remarkable improvement in the thermoelectric (TE) performance of In6- xSn xSe7 ( ZT = ∼0.28 at x = 0.1, 833 K) compared to that of pristine In6Se7 ( ZT = 0.015 at 640 K). This improvement is mainly attributed to the creation of active donor defects SnIn3+ as Sn(4+) is energetically favorable to In+ sites. Although Sn (2+), which generates a defect SnIn− as an acceptor when it is incorporated into the In3+ sites, has a negative effect on the transport properties, the counter effect from Sn(4+) and Sn(2+) suggests that In6Se7-based alloys are prospectively good thermoelectric candidates if their chemical compositions are well optimized. [ABSTRACT FROM AUTHOR]

We present two series of Cu2Ga4Te7-based compounds with Zn substituting for Cu (Cu-poor) and Ga (Ga-poor), and have observed enhanced thermoelectric performance. Generally, the Seebeck coefficient ( α) and lattice thermal conductivity ( κL) increase and electrical conductivity ( σ) decreases with the Zn content increasing. The variation in electrical properties might be mainly due to the formation of antisite defects ( [ABSTRACT FROM AUTHOR]

N-type Mg2Si0.59 − xSn0.41Sb x (0 ≤ x ≤ 0.01) solid solutions were prepared by melting elemental metals in sealed tantalum tubes followed by hot pressing. The electrical conductivity, Seebeck coefficient, and thermal conductivity have been measured as a function of temperature from 300 to 770 K. The electron effective mass and electron concentration increase with increasing Sb doping amount. The Sb doping enhances the concentration of Mg vacancies, which reduces the electron concentration. The maximum dimensionless figure of merit is 0.68 at 693 K for the x = 0.005 sample. [ABSTRACT FROM AUTHOR]

We synthesized the solid solutions CuGa1-xInxTe2 (x = 0-1.0) by isoelectronic substitution of element In (Ga) for Ga(In) in the CuMTe2 (M = Ga, In) lattices and examined their thermoelectric properties. The structure upon substitution provides much high Seebeck coefficient (α), relatively low thermal (κ), and electrical conductivity (σ). AT 701 K, the α, σ, and κ are 283.15 µV K-1, 1.15 × 104 Ω-1 m-1, and 0.71 W m-1 K-1, respectively, for CuGa0.36In0.64Te2, which give the figure of merit (ZT) of 0.91, about two times those of the mother compounds CuGaTe2 and CuInTe2. This material holds great application perspectives at intermediate temperatures. [ABSTRACT FROM AUTHOR]