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Hybrid structure responsible for improved thermoelectric performance of Sn-incorporated Cu3SbSe4 with a second phase CuSe.

Authors :
Min, Lei
Xia, Yafen
Ying, Pengzhan
Cui, Jiaolin
Source :
Journal of Applied Physics; 6/21/2020, Vol. 127 Issue 23, p1-7, 7p, 1 Chart, 5 Graphs
Publication Year :
2020

Abstract

In this work, we design and synthesize a hybrid structure consisting of Sn-incorporated Cu<subscript>3</subscript>SbSe<subscript>4</subscript> and a second phase CuSe, that is, (Cu<subscript>3</subscript>Sb<subscript>1 − </subscript><subscript>x</subscript>Sn<subscript>x</subscript>Se<subscript>4</subscript>)(CuSe)<subscript>y</subscript> (x = 0–0.04, y = 0.3–0.08), and explore the role of each phase on the improvement of the thermoelectric (TE) performance. In the Cu<subscript>3</subscript>Sb<subscript>1 − </subscript><subscript>x</subscript>Sn<subscript>x</subscript>Se<subscript>4</subscript> phase, the element Sn residing at the Sb site provides p-type holes while at the same time increasing the point defects and crystal structure distortion. The presence of the second phase CuSe, which is in situ formed within the Cu<subscript>3</subscript>Sb<subscript>1 − </subscript><subscript>x</subscript>Sn<subscript>x</subscript>Se<subscript>4</subscript> matrix, not only improves the electrical conductivity but also increases the phonon scattering on the phase boundaries. As a result, the hybrid structure allows the improvement in TE performance with the highest ZT value of 0.37 at ∼600 K for the samples at x = 0.02–0.03 and y = 0.11–0.09, which is about 42% higher than that of pristine Cu<subscript>3</subscript>SbSe<subscript>4</subscript>. This work reveals us a new method of improving TE performance, that is, through organizing a hybrid structure in Cu<subscript>3</subscript>SbSe<subscript>4</subscript>-based composites. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
00218979
Volume :
127
Issue :
23
Database :
Complementary Index
Journal :
Journal of Applied Physics
Publication Type :
Academic Journal
Accession number :
143877605
Full Text :
https://doi.org/10.1063/5.0011146